SG11202013113RA - Metal sublayer sensing in multi-layer workpiece hole drilling - Google Patents
Metal sublayer sensing in multi-layer workpiece hole drillingInfo
- Publication number
- SG11202013113RA SG11202013113RA SG11202013113RA SG11202013113RA SG11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA SG 11202013113R A SG11202013113R A SG 11202013113RA
- Authority
- SG
- Singapore
- Prior art keywords
- sensing
- hole drilling
- workpiece hole
- metal sublayer
- layer workpiece
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/022,052 US10932370B2 (en) | 2018-06-28 | 2018-06-28 | Metal sublayer sensing in multi-layer workpiece hole drilling |
PCT/IL2019/050716 WO2020003318A1 (en) | 2018-06-28 | 2019-06-27 | Metal sublayer sensing in multi-layer workpiece hole drilling |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202013113RA true SG11202013113RA (en) | 2021-01-28 |
Family
ID=68986107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202013113RA SG11202013113RA (en) | 2018-06-28 | 2019-06-27 | Metal sublayer sensing in multi-layer workpiece hole drilling |
Country Status (4)
Country | Link |
---|---|
US (2) | US10932370B2 (en) |
EP (1) | EP3814760B1 (en) |
SG (1) | SG11202013113RA (en) |
WO (1) | WO2020003318A1 (en) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4786864A (en) | 1985-03-29 | 1988-11-22 | International Business Machines Corporation | Photon assisted tunneling testing of passivated integrated circuits |
US4789770A (en) | 1987-07-15 | 1988-12-06 | Westinghouse Electric Corp. | Controlled depth laser drilling system |
DE3733489A1 (en) | 1987-10-03 | 1989-04-20 | Telemit Electronic Gmbh | METHOD AND DEVICE FOR PROCESSING MATERIALS WITH THE AID OF A LASER |
US4988877A (en) * | 1989-10-03 | 1991-01-29 | Tencor Instruments | Via hole checker |
US6317514B1 (en) | 1998-09-09 | 2001-11-13 | Applied Materials, Inc. | Method and apparatus for inspection of patterned semiconductor wafers |
JP3749107B2 (en) * | 1999-11-05 | 2006-02-22 | ファブソリューション株式会社 | Semiconductor device inspection equipment |
DE10060407C2 (en) | 2000-12-05 | 2003-04-30 | Lpkf Laser & Electronics Ag | Device for laser beam drilling |
JP4738610B2 (en) | 2001-03-02 | 2011-08-03 | 株式会社トプコン | Contamination evaluation method for substrate surface, contamination evaluation apparatus and semiconductor device manufacturing method |
US20050061779A1 (en) | 2003-08-06 | 2005-03-24 | Walter Blumenfeld | Laser ablation feedback spectroscopy |
TWI382795B (en) | 2005-03-04 | 2013-01-11 | Hitachi Via Mechanics Ltd | A method of opening a printed circuit board and an opening device for a printed circuit board |
US8598490B2 (en) * | 2008-03-31 | 2013-12-03 | Electro Scientific Industries, Inc. | Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes |
DE102009016125A1 (en) | 2009-04-03 | 2010-10-14 | Schott Ag | Method and device for processing, in particular for the separation, of workpieces |
WO2010132880A1 (en) | 2009-05-15 | 2010-11-18 | Translith Systems, Llc | Method and apparatus for controlled laser ablation of material |
US8525073B2 (en) * | 2010-01-27 | 2013-09-03 | United Technologies Corporation | Depth and breakthrough detection for laser machining |
JP2012098113A (en) | 2010-11-01 | 2012-05-24 | Renesas Electronics Corp | Method for manufacturing semiconductor device |
CA2872228C (en) | 2012-05-31 | 2017-03-28 | Kabushiki Kaisha Nihon Micronics | Semiconductor probe, testing device and testing method for testing quantum battery |
DE102012219196B3 (en) | 2012-10-22 | 2014-02-06 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method and machine for grooving, drilling or cutting metal workpieces |
US10933490B2 (en) | 2015-12-22 | 2021-03-02 | Drilliant Ltd. | Metal sublayer sensing in multi-layer workpiece hole drilling |
-
2018
- 2018-06-28 US US16/022,052 patent/US10932370B2/en active Active
-
2019
- 2019-06-27 EP EP19826886.4A patent/EP3814760B1/en active Active
- 2019-06-27 SG SG11202013113RA patent/SG11202013113RA/en unknown
- 2019-06-27 WO PCT/IL2019/050716 patent/WO2020003318A1/en active Application Filing
-
2021
- 2021-02-01 US US17/164,340 patent/US11792940B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20210161017A1 (en) | 2021-05-27 |
US10932370B2 (en) | 2021-02-23 |
US20200008303A1 (en) | 2020-01-02 |
EP3814760A4 (en) | 2022-03-30 |
EP3814760B1 (en) | 2024-03-20 |
WO2020003318A1 (en) | 2020-01-02 |
EP3814760A1 (en) | 2021-05-05 |
US11792940B2 (en) | 2023-10-17 |
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