SG11202012216PA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11202012216PA SG11202012216PA SG11202012216PA SG11202012216PA SG11202012216PA SG 11202012216P A SG11202012216P A SG 11202012216PA SG 11202012216P A SG11202012216P A SG 11202012216PA SG 11202012216P A SG11202012216P A SG 11202012216PA SG 11202012216P A SG11202012216P A SG 11202012216PA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/18—Other polishing compositions based on non-waxy substances on other substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018146643 | 2018-08-03 | ||
PCT/JP2019/030215 WO2020027260A1 (en) | 2018-08-03 | 2019-08-01 | Polishing composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202012216PA true SG11202012216PA (en) | 2021-01-28 |
Family
ID=69231101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202012216PA SG11202012216PA (en) | 2018-08-03 | 2019-08-01 | Polishing composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US20210171801A1 (en) |
JP (1) | JP7467342B2 (en) |
KR (1) | KR20210039382A (en) |
CN (1) | CN112400005B (en) |
DE (1) | DE112019003914T5 (en) |
SG (1) | SG11202012216PA (en) |
TW (1) | TW202013484A (en) |
WO (1) | WO2020027260A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6656241B1 (en) * | 2001-06-14 | 2003-12-02 | Ppg Industries Ohio, Inc. | Silica-based slurry |
JP3937143B2 (en) | 2002-02-18 | 2007-06-27 | 信越化学工業株式会社 | Polishing agent for polishing silicon wafer and polishing method |
MY149975A (en) * | 2007-09-21 | 2013-11-15 | Cabot Microelectronics Corp | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
KR101330956B1 (en) * | 2009-08-19 | 2013-11-18 | 히타치가세이가부시끼가이샤 | Polishing solution for cmp and polishing method |
CN104745082A (en) * | 2013-12-25 | 2015-07-01 | 安集微电子(上海)有限公司 | Chemical mechanical polishing liquid and polishing method |
JP6482234B2 (en) | 2014-10-22 | 2019-03-13 | 株式会社フジミインコーポレーテッド | Polishing composition |
CN105802508B (en) * | 2014-12-29 | 2020-03-13 | 安集微电子(上海)有限公司 | Application of azole compound in improving stability of chemical mechanical polishing solution |
US10119048B1 (en) * | 2017-07-31 | 2018-11-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-abrasive CMP slurry compositions with tunable selectivity |
-
2019
- 2019-08-01 WO PCT/JP2019/030215 patent/WO2020027260A1/en active Application Filing
- 2019-08-01 SG SG11202012216PA patent/SG11202012216PA/en unknown
- 2019-08-01 KR KR1020217002790A patent/KR20210039382A/en active Search and Examination
- 2019-08-01 CN CN201980046853.XA patent/CN112400005B/en active Active
- 2019-08-01 US US17/253,616 patent/US20210171801A1/en not_active Abandoned
- 2019-08-01 JP JP2020534738A patent/JP7467342B2/en active Active
- 2019-08-01 DE DE112019003914.8T patent/DE112019003914T5/en active Pending
- 2019-08-02 TW TW108127544A patent/TW202013484A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN112400005A (en) | 2021-02-23 |
JP7467342B2 (en) | 2024-04-15 |
JPWO2020027260A1 (en) | 2021-08-26 |
CN112400005B (en) | 2023-06-16 |
US20210171801A1 (en) | 2021-06-10 |
TW202013484A (en) | 2020-04-01 |
DE112019003914T5 (en) | 2021-04-15 |
KR20210039382A (en) | 2021-04-09 |
WO2020027260A1 (en) | 2020-02-06 |
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