SG11202007663YA - Wire shape inspecting apparatus and wire shape inspecting method - Google Patents

Wire shape inspecting apparatus and wire shape inspecting method

Info

Publication number
SG11202007663YA
SG11202007663YA SG11202007663YA SG11202007663YA SG11202007663YA SG 11202007663Y A SG11202007663Y A SG 11202007663YA SG 11202007663Y A SG11202007663Y A SG 11202007663YA SG 11202007663Y A SG11202007663Y A SG 11202007663YA SG 11202007663Y A SG11202007663Y A SG 11202007663YA
Authority
SG
Singapore
Prior art keywords
wire shape
shape inspecting
inspecting apparatus
wire
inspecting method
Prior art date
Application number
SG11202007663YA
Inventor
Shigeru Amemiya
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202007663YA publication Critical patent/SG11202007663YA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G06T7/571—Depth or shape recovery from multiple images from focus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G06T7/586—Depth or shape recovery from multiple images from multiple light sources, e.g. photometric stereo
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/97—Determining parameters from multiple pictures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10148—Varying focus
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30136—Metal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
SG11202007663YA 2017-12-20 2018-12-20 Wire shape inspecting apparatus and wire shape inspecting method SG11202007663YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017244338 2017-12-20
PCT/JP2018/047043 WO2019124508A1 (en) 2017-12-20 2018-12-20 Wire shape inspecting device and wire shape inspecting method

Publications (1)

Publication Number Publication Date
SG11202007663YA true SG11202007663YA (en) 2020-09-29

Family

ID=66994744

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202007663YA SG11202007663YA (en) 2017-12-20 2018-12-20 Wire shape inspecting apparatus and wire shape inspecting method

Country Status (7)

Country Link
US (1) US11182921B2 (en)
JP (1) JP6851095B2 (en)
KR (1) KR102451949B1 (en)
CN (1) CN111801545B (en)
SG (1) SG11202007663YA (en)
TW (1) TWI697656B (en)
WO (1) WO2019124508A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7377079B2 (en) * 2019-11-25 2023-11-09 Juki株式会社 Sewing needle inspection device
TW202232051A (en) * 2020-10-14 2022-08-16 新加坡商億美設備私人有限公司 Loop height measurement of overlapping bond wires
CN112179920B (en) * 2020-11-29 2021-04-13 惠州高视科技有限公司 Method and system for detecting chip bonding wire defects
JP7442752B1 (en) 2023-05-19 2024-03-04 三菱電機株式会社 Shape inspection method of inspected object

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2981941B2 (en) * 1991-12-02 1999-11-22 株式会社新川 Bonding wire inspection device
JP2981942B2 (en) * 1991-12-02 1999-11-22 株式会社新川 Bonding wire inspection method
JPH05160223A (en) * 1991-12-04 1993-06-25 Fujitsu Miyagi Electron:Kk External appearance inspecting device for electronic component
JPH05312532A (en) * 1992-05-13 1993-11-22 Fujitsu Ltd Device and method for inspecting bonding wire
JP3259398B2 (en) * 1993-01-22 2002-02-25 ソニー株式会社 Inspection equipment for wire bonding
JP2720759B2 (en) * 1993-07-21 1998-03-04 日本電気株式会社 Automatic bonding wire inspection system
US5581632A (en) 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
JPH0883829A (en) * 1994-09-09 1996-03-26 Shinkawa Ltd Inspecting method of height of bonding wire
JP3235009B2 (en) * 1994-09-09 2001-12-04 株式会社新川 Bonding wire inspection method
JP3534583B2 (en) * 1997-01-07 2004-06-07 株式会社ルネサステクノロジ Method for manufacturing semiconductor integrated circuit device
JPH10247669A (en) * 1997-03-04 1998-09-14 Canon Inc Device and method for inspecting bonding wire
JP3813088B2 (en) * 2001-12-28 2006-08-23 株式会社新川 Bonding equipment
CN102017109A (en) 2008-02-29 2011-04-13 库力索法工业公司 Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same
JP2014013144A (en) * 2010-10-27 2014-01-23 Nikon Corp Three-dimensional shape measurement device, three-dimensional shape measurement method, structure manufacturing method and structure manufacturing system
JP5312532B2 (en) 2011-07-28 2013-10-09 京楽産業．株式会社 Game machine
CN103376259A (en) * 2012-04-11 2013-10-30 百励科技股份有限公司 Device and method for detecting internal defects of element
JP6116164B2 (en) * 2012-09-11 2017-04-19 株式会社キーエンス Shape measuring device, shape measuring method, and shape measuring program
TWI545663B (en) * 2014-05-07 2016-08-11 新川股份有限公司 Bonding apparatus and bonding method
JP2017096907A (en) * 2015-11-17 2017-06-01 富士電機株式会社 Wire bonding inspection device, wire bonding inspection method, and program

Also Published As

Publication number Publication date
CN111801545A (en) 2020-10-20
JPWO2019124508A1 (en) 2020-11-19
TW201928287A (en) 2019-07-16
KR102451949B1 (en) 2022-10-07
CN111801545B (en) 2022-02-01
US20200388046A1 (en) 2020-12-10
JP6851095B2 (en) 2021-03-31
KR20200095554A (en) 2020-08-10
WO2019124508A1 (en) 2019-06-27
US11182921B2 (en) 2021-11-23
TWI697656B (en) 2020-07-01

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