SG11202005786SA - Porous distributed bragg reflectors for laser applications - Google Patents
Porous distributed bragg reflectors for laser applicationsInfo
- Publication number
- SG11202005786SA SG11202005786SA SG11202005786SA SG11202005786SA SG11202005786SA SG 11202005786S A SG11202005786S A SG 11202005786SA SG 11202005786S A SG11202005786S A SG 11202005786SA SG 11202005786S A SG11202005786S A SG 11202005786SA SG 11202005786S A SG11202005786S A SG 11202005786SA
- Authority
- SG
- Singapore
- Prior art keywords
- distributed bragg
- bragg reflectors
- laser applications
- porous distributed
- porous
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
- H01L33/105—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector with a resonant cavity structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1071—Ring-lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18319—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement comprising a periodical structure in lateral directions
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862618985P | 2018-01-18 | 2018-01-18 | |
PCT/US2019/014204 WO2019143945A1 (en) | 2018-01-18 | 2019-01-18 | Porous distributed bragg reflectors for laser applications |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202005786SA true SG11202005786SA (en) | 2020-08-28 |
Family
ID=65352146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202005786SA SG11202005786SA (en) | 2018-01-18 | 2019-01-18 | Porous distributed bragg reflectors for laser applications |
Country Status (8)
Country | Link |
---|---|
US (1) | US11201451B2 (en) |
EP (2) | EP3741015B1 (en) |
JP (1) | JP2021511662A (en) |
KR (1) | KR20200111724A (en) |
CN (1) | CN111630735B (en) |
SG (1) | SG11202005786SA (en) |
TW (1) | TWI827578B (en) |
WO (1) | WO2019143945A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106848838B (en) * | 2017-04-06 | 2019-11-29 | 中国科学院半导体研究所 | GaN base VCSEL chip and preparation method based on porous DBR |
US10868213B2 (en) * | 2018-06-26 | 2020-12-15 | Lumileds Llc | LED utilizing internal color conversion with light extraction enhancements |
US12007504B2 (en) * | 2019-03-01 | 2024-06-11 | Vixar, Inc. | 3D and LiDAR sensing modules |
GB2612040A (en) | 2021-10-19 | 2023-04-26 | Iqe Plc | Porous distributed Bragg reflector apparatuses, systems, and methods |
WO2024044998A1 (en) * | 2022-08-30 | 2024-03-07 | Huawei Technologies Co., Ltd. | Low-coherence surface-emitting laser (lcsel) |
US20240222552A1 (en) * | 2023-01-04 | 2024-07-04 | Innolux Corporation | Semiconductor element, electronic device comprising semiconductor element, and semiconductor chip |
Family Cites Families (38)
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US5283447A (en) * | 1992-01-21 | 1994-02-01 | Bandgap Technology Corporation | Integration of transistors with vertical cavity surface emitting lasers |
US5306385A (en) * | 1992-09-15 | 1994-04-26 | Texas Instruments Incorporated | Method for generating photoluminescence emission lines from transition element doped CAF2 thin films over a Si-based substrate |
GB2347559B (en) * | 1995-11-30 | 2000-11-15 | Hewlett Packard Co | Vertical cavity surface emitting lasers |
US5939732A (en) * | 1997-05-22 | 1999-08-17 | Kulite Semiconductor Products, Inc. | Vertical cavity-emitting porous silicon carbide light-emitting diode device and preparation thereof |
DE19807783A1 (en) * | 1998-02-18 | 1999-09-02 | Siemens Ag | Component with a light transmitter and a light receiver |
US6376269B1 (en) * | 1999-02-02 | 2002-04-23 | Agilent Technologies, Inc. | Vertical cavity surface emitting laser (VCSEL) using buried Bragg reflectors and method for producing same |
US6746777B1 (en) * | 2000-05-31 | 2004-06-08 | Applied Optoelectronics, Inc. | Alternative substrates for epitaxial growth |
KR100754156B1 (en) * | 2000-08-23 | 2007-09-03 | 삼성전자주식회사 | Multiple wavelength vertical-cavity surface emitting laser and method for manufacturing thereof |
US6549556B1 (en) * | 2000-12-01 | 2003-04-15 | Applied Optoelectronics, Inc. | Vertical-cavity surface-emitting laser with bottom dielectric distributed bragg reflector |
JP2002246695A (en) * | 2001-02-13 | 2002-08-30 | Canon Inc | Method for manufacturing semiconductor device using porous substrate, and semiconductor device |
US20020163688A1 (en) * | 2001-03-26 | 2002-11-07 | Zuhua Zhu | Optical communications system and vertical cavity surface emitting laser therefor |
US20020179930A1 (en) * | 2001-06-01 | 2002-12-05 | Motorola, Inc. | Composite semiconductor structure and device with optical testing elements |
US6697413B2 (en) * | 2001-10-31 | 2004-02-24 | Applied Optoelectronics, Inc. | Tunable vertical-cavity surface-emitting laser with tuning junction |
US6850548B2 (en) * | 2001-12-28 | 2005-02-01 | Finisar Corporation | Assymmetric distributed Bragg reflector for vertical cavity surface emitting lasers |
US6771680B2 (en) * | 2002-10-22 | 2004-08-03 | Agilent Technologies, Inc | Electrically-pumped, multiple active region vertical-cavity surface-emitting laser (VCSEL) |
GB2399940A (en) * | 2003-03-25 | 2004-09-29 | Sharp Kk | Vertical cavity surface emitting laser |
JP4235530B2 (en) * | 2003-10-20 | 2009-03-11 | キヤノン株式会社 | Surface-emitting diode, surface-emitting diode array, and manufacturing method thereof |
JP4138629B2 (en) * | 2003-11-06 | 2008-08-27 | 株式会社東芝 | Surface emitting semiconductor device and manufacturing method thereof |
WO2005078512A1 (en) * | 2004-02-17 | 2005-08-25 | The Furukawa Electric Co., Ltd. | Photonic crystal semiconductor device and method for manufacturing same |
JP4710282B2 (en) * | 2004-09-06 | 2011-06-29 | 富士ゼロックス株式会社 | Multi-wavelength surface emitting laser manufacturing method |
JP4568125B2 (en) * | 2005-01-17 | 2010-10-27 | 株式会社東芝 | Surface emitting semiconductor device |
JP4027392B2 (en) * | 2005-04-28 | 2007-12-26 | キヤノン株式会社 | Vertical cavity surface emitting laser device |
JP4919628B2 (en) * | 2005-07-28 | 2012-04-18 | 株式会社リコー | Surface emitting laser, surface emitting laser array, optical writing system, and optical transmission system |
US7499481B2 (en) * | 2006-11-14 | 2009-03-03 | Canon Kabushiki Kaisha | Surface-emitting laser and method for producing the same |
JP4235674B2 (en) * | 2006-11-14 | 2009-03-11 | キヤノン株式会社 | Surface emitting laser device and manufacturing method thereof |
JP2009170508A (en) * | 2008-01-11 | 2009-07-30 | Furukawa Electric Co Ltd:The | Surface-emitting semiconductor laser and manufacturing method thereof |
EP3923352A1 (en) * | 2010-01-27 | 2021-12-15 | Yale University, Inc. | Conductivity based selective etch for gan devices and applications thereof |
WO2013016676A2 (en) * | 2011-07-27 | 2013-01-31 | MYTEK, LLC (doing business as VIXAR) | Method and apparatus including improved vertical-cavity surface-emitting lasers |
KR101272833B1 (en) * | 2012-02-03 | 2013-06-11 | 광주과학기술원 | Optical device having the silicon distributed bragg reflector structure and method for fabricating the same |
US9583353B2 (en) * | 2012-06-28 | 2017-02-28 | Yale University | Lateral electrochemical etching of III-nitride materials for microfabrication |
US20170093128A1 (en) * | 2014-03-04 | 2017-03-30 | Hewlett Packard Enterprise Development Lp | Vertical-cavity surface-emitting lasers |
US11095096B2 (en) * | 2014-04-16 | 2021-08-17 | Yale University | Method for a GaN vertical microcavity surface emitting laser (VCSEL) |
EP3198691B1 (en) * | 2014-09-25 | 2018-05-09 | Koninklijke Philips N.V. | Vertical cavity surface emitting laser |
KR102425935B1 (en) * | 2014-09-30 | 2022-07-27 | 예일 유니버시티 | A METHOD FOR GaN VERTICAL MICROCAVITY SURFACE EMITTING LASER (VCSEL) |
US10790410B2 (en) * | 2015-10-23 | 2020-09-29 | Sensor Electronic Technology, Inc. | Light extraction from optoelectronic device |
US11495670B2 (en) * | 2016-09-22 | 2022-11-08 | Iqe Plc | Integrated epitaxial metal electrodes |
CN106848838B (en) * | 2017-04-06 | 2019-11-29 | 中国科学院半导体研究所 | GaN base VCSEL chip and preparation method based on porous DBR |
US11038321B2 (en) * | 2018-10-12 | 2021-06-15 | The Board Of Trustees Of The University Of Illinois | Single mode VCSELs with low threshold and high speed operation |
-
2019
- 2019-01-18 JP JP2020539230A patent/JP2021511662A/en active Pending
- 2019-01-18 CN CN201980008703.XA patent/CN111630735B/en active Active
- 2019-01-18 EP EP19704126.2A patent/EP3741015B1/en active Active
- 2019-01-18 WO PCT/US2019/014204 patent/WO2019143945A1/en unknown
- 2019-01-18 TW TW108102069A patent/TWI827578B/en active
- 2019-01-18 US US16/252,334 patent/US11201451B2/en active Active
- 2019-01-18 EP EP23152877.9A patent/EP4213319B1/en active Active
- 2019-01-18 SG SG11202005786SA patent/SG11202005786SA/en unknown
- 2019-01-18 KR KR1020207023497A patent/KR20200111724A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201941271A (en) | 2019-10-16 |
EP4213319A1 (en) | 2023-07-19 |
US11201451B2 (en) | 2021-12-14 |
CN111630735B (en) | 2024-07-26 |
TWI827578B (en) | 2024-01-01 |
US20190221993A1 (en) | 2019-07-18 |
KR20200111724A (en) | 2020-09-29 |
EP3741015B1 (en) | 2023-06-07 |
JP2021511662A (en) | 2021-05-06 |
CN111630735A (en) | 2020-09-04 |
EP3741015A1 (en) | 2020-11-25 |
EP4213319B1 (en) | 2024-08-14 |
WO2019143945A1 (en) | 2019-07-25 |
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