SG11202005521TA - Epoxy resin composition, cured product, and electrical or electronic component - Google Patents

Epoxy resin composition, cured product, and electrical or electronic component

Info

Publication number
SG11202005521TA
SG11202005521TA SG11202005521TA SG11202005521TA SG11202005521TA SG 11202005521T A SG11202005521T A SG 11202005521TA SG 11202005521T A SG11202005521T A SG 11202005521TA SG 11202005521T A SG11202005521T A SG 11202005521TA SG 11202005521T A SG11202005521T A SG 11202005521TA
Authority
SG
Singapore
Prior art keywords
electrical
resin composition
epoxy resin
electronic component
cured product
Prior art date
Application number
SG11202005521TA
Inventor
Kazumasa Oota
Original Assignee
Mitsubishi Chem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chem Corp filed Critical Mitsubishi Chem Corp
Publication of SG11202005521TA publication Critical patent/SG11202005521TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG11202005521TA 2017-12-12 2018-12-10 Epoxy resin composition, cured product, and electrical or electronic component SG11202005521TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017237870 2017-12-12
PCT/JP2018/045282 WO2019117077A1 (en) 2017-12-12 2018-12-10 Epoxy resin compositions, cured object, and electrical/electronic component

Publications (1)

Publication Number Publication Date
SG11202005521TA true SG11202005521TA (en) 2020-07-29

Family

ID=66820331

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005521TA SG11202005521TA (en) 2017-12-12 2018-12-10 Epoxy resin composition, cured product, and electrical or electronic component

Country Status (7)

Country Link
US (1) US11299620B2 (en)
JP (1) JP2019104906A (en)
KR (1) KR20200088840A (en)
CN (1) CN111527120B (en)
SG (1) SG11202005521TA (en)
TW (1) TWI795486B (en)
WO (1) WO2019117077A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220155259A (en) * 2020-03-16 2022-11-22 미쯔비시 케미컬 주식회사 Epoxy resin composition, cured product and electrical/electronic parts

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (en) 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd Novel polyepoxy compound
JP2566178B2 (en) 1990-11-08 1996-12-25 油化シエルエポキシ株式会社 Epoxy resin powder composition
JP3315436B2 (en) * 1992-06-19 2002-08-19 ジャパンエポキシレジン株式会社 Method for producing epoxy resin containing biphenol skeleton
JPH10147629A (en) * 1996-11-15 1998-06-02 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition and its cured material
JPH11106472A (en) * 1997-10-06 1999-04-20 Nippon Kayaku Co Ltd Production of epoxy resin
JP4846078B2 (en) * 1998-06-04 2011-12-28 長春人造樹脂廠股▲分▼有限公司 Method for producing epoxy resin with low hydrolyzable chlorine content
JP3889520B2 (en) 1999-02-17 2007-03-07 ジャパンエポキシレジン株式会社 Epoxy compound purification method
JP2002128861A (en) * 2000-10-23 2002-05-09 Japan Epoxy Resin Kk Epoxy resin composition and method for producing the same
JP3712610B2 (en) 2000-12-28 2005-11-02 ジャパンエポキシレジン株式会社 Epoxy resin crystallized product, curable composition and cured product
JP3986445B2 (en) * 2003-02-17 2007-10-03 東都化成株式会社 Method for producing high-purity epoxy resin and epoxy resin composition
JP2007238963A (en) * 2007-06-25 2007-09-20 Nippon Kayaku Co Ltd Method for producing epoxy resin
JP2013006972A (en) * 2011-06-24 2013-01-10 Mitsubishi Chemicals Corp Epoxy resin composition, and cured material obtained by curing the same
JP6772680B2 (en) * 2015-09-03 2020-10-21 三菱ケミカル株式会社 Epoxy resin, epoxy resin composition, cured product and electrical / electronic parts
SG11201801738TA (en) 2015-09-03 2018-04-27 Mitsubishi Chem Corp Epoxy resin, epoxy resin composition, cured product and electrical or electronic component

Also Published As

Publication number Publication date
WO2019117077A1 (en) 2019-06-20
JP2019104906A (en) 2019-06-27
CN111527120B (en) 2023-11-17
TWI795486B (en) 2023-03-11
CN111527120A (en) 2020-08-11
TW201927848A (en) 2019-07-16
US11299620B2 (en) 2022-04-12
KR20200088840A (en) 2020-07-23
US20200299503A1 (en) 2020-09-24

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