SG11202005133WA - Bridging front opening unified pod (foup) - Google Patents
Bridging front opening unified pod (foup)Info
- Publication number
- SG11202005133WA SG11202005133WA SG11202005133WA SG11202005133WA SG11202005133WA SG 11202005133W A SG11202005133W A SG 11202005133WA SG 11202005133W A SG11202005133W A SG 11202005133WA SG 11202005133W A SG11202005133W A SG 11202005133WA SG 11202005133W A SG11202005133W A SG 11202005133WA
- Authority
- SG
- Singapore
- Prior art keywords
- foup
- front opening
- opening unified
- unified pod
- bridging front
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Handcart (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- External Artificial Organs (AREA)
- Telephone Function (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862626762P | 2018-02-06 | 2018-02-06 | |
US15/956,481 US10504762B2 (en) | 2018-02-06 | 2018-04-18 | Bridging front opening unified pod (FOUP) |
PCT/US2019/016468 WO2019156918A1 (en) | 2018-02-06 | 2019-02-04 | Bridging front opening unified pod (foup) |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202005133WA true SG11202005133WA (en) | 2020-08-28 |
Family
ID=67477001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202005133WA SG11202005133WA (en) | 2018-02-06 | 2019-02-04 | Bridging front opening unified pod (foup) |
Country Status (7)
Country | Link |
---|---|
US (1) | US10504762B2 (en) |
KR (1) | KR102435852B1 (en) |
CN (1) | CN111557042A (en) |
PH (1) | PH12020550855A1 (en) |
SG (1) | SG11202005133WA (en) |
TW (1) | TWI816745B (en) |
WO (1) | WO2019156918A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210296149A1 (en) * | 2020-03-23 | 2021-09-23 | Applied Materials, Inc. | Enclosure system shelf |
USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
KR102649714B1 (en) * | 2020-10-27 | 2024-03-21 | 세메스 주식회사 | Apparatus for treating substrate and method for transffering substrate |
US20220344185A1 (en) * | 2021-04-22 | 2022-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Calibration pod for robotic wafer carrier handling and calibration performed using same |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0135049B1 (en) | 1994-05-31 | 1998-04-20 | 양승택 | Wafer cassette for semiconductor fabrication |
US20050188923A1 (en) * | 1997-08-11 | 2005-09-01 | Cook Robert C. | Substrate carrier for parallel wafer processing reactor |
US6419438B1 (en) * | 2000-11-28 | 2002-07-16 | Asyst Technologies, Inc. | FIMS interface without alignment pins |
US20020187024A1 (en) | 2001-06-12 | 2002-12-12 | Applied Materials, Inc. | Apparatus for storing and moving a carrier |
WO2003021642A2 (en) | 2001-08-31 | 2003-03-13 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
US6955197B2 (en) | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
US6781205B1 (en) * | 2002-10-11 | 2004-08-24 | Ion Systems, Inc. | Electrostatic charge measurement on semiconductor wafers |
US6899145B2 (en) * | 2003-03-20 | 2005-05-31 | Asm America, Inc. | Front opening unified pod |
US7891937B2 (en) | 2003-06-02 | 2011-02-22 | Texas Instruments Incorporated | Adjustable width cassette for wafer film frames |
US7207766B2 (en) * | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
EP1705972A4 (en) | 2004-04-28 | 2010-05-19 | Ibiden Co Ltd | Multilayer printed wiring board |
JP4509669B2 (en) * | 2004-06-29 | 2010-07-21 | 東京エレクトロン株式会社 | Loading mechanism and method for carrying out object to be processed |
US7409263B2 (en) | 2004-07-14 | 2008-08-05 | Applied Materials, Inc. | Methods and apparatus for repositioning support for a substrate carrier |
JP2007123673A (en) * | 2005-10-31 | 2007-05-17 | Asyst Shinko Inc | Vibration-proof mechanism for article storage container |
TW200822269A (en) * | 2006-07-10 | 2008-05-16 | Asyst Technologies | Variable lot size load port |
WO2008008739A2 (en) * | 2006-07-10 | 2008-01-17 | Asyst Technologies, Inc. | Variable lot size load port |
US20080216077A1 (en) | 2007-03-02 | 2008-09-04 | Applied Materials, Inc. | Software sequencer for integrated substrate processing system |
JP5532796B2 (en) * | 2009-09-29 | 2014-06-25 | 凸版印刷株式会社 | Glass substrate storage tray |
JP5541726B2 (en) | 2010-11-08 | 2014-07-09 | 信越ポリマー株式会社 | Substrate storage container |
JP2014513442A (en) * | 2011-05-03 | 2014-05-29 | インテグリス・インコーポレーテッド | Wafer container with particle shield |
TWI431712B (en) * | 2011-09-20 | 2014-03-21 | Gudeng Prec Ind Co Ltd | Large-sized front opening unified wafer pod |
TWI473752B (en) * | 2011-12-13 | 2015-02-21 | Gudeng Prec Ind Co Ltd | Latch structure of a large-sized front opening unified wafer pod |
JP2014007344A (en) * | 2012-06-26 | 2014-01-16 | Disco Abrasive Syst Ltd | Housing cassette |
US9385017B2 (en) | 2012-08-06 | 2016-07-05 | Nordson Corporation | Apparatus and methods for handling workpieces of different sizes |
KR20140092548A (en) * | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | Apparatus for keeping wafers |
JP6148025B2 (en) * | 2013-02-04 | 2017-06-14 | 株式会社Screenホールディングス | Delivery position teaching method, delivery position teaching apparatus, and substrate processing apparatus |
KR102223033B1 (en) * | 2014-04-29 | 2021-03-04 | 삼성전자주식회사 | wafer storage container |
US20150332950A1 (en) | 2014-05-16 | 2015-11-19 | Applied Materials, Inc. | On-end effector magnetic wafer carrier alignment |
US9412619B2 (en) | 2014-08-12 | 2016-08-09 | Applied Materials, Inc. | Method of outgassing a mask material deposited over a workpiece in a process tool |
US10347516B2 (en) * | 2014-11-11 | 2019-07-09 | Applied Materials, Inc. | Substrate transfer chamber |
US10566226B2 (en) * | 2014-11-11 | 2020-02-18 | Applied Materials, Inc. | Multi-cassette carrying case |
US9881820B2 (en) * | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
US10535541B2 (en) | 2015-12-29 | 2020-01-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Adaptive inset for wafer cassette system |
-
2018
- 2018-04-18 US US15/956,481 patent/US10504762B2/en not_active Expired - Fee Related
-
2019
- 2019-02-04 WO PCT/US2019/016468 patent/WO2019156918A1/en active Application Filing
- 2019-02-04 KR KR1020207025379A patent/KR102435852B1/en active IP Right Grant
- 2019-02-04 SG SG11202005133WA patent/SG11202005133WA/en unknown
- 2019-02-04 CN CN201980006816.6A patent/CN111557042A/en active Pending
- 2019-02-11 TW TW108104389A patent/TWI816745B/en active
-
2020
- 2020-06-09 PH PH12020550855A patent/PH12020550855A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102435852B1 (en) | 2022-08-24 |
CN111557042A (en) | 2020-08-18 |
WO2019156918A1 (en) | 2019-08-15 |
PH12020550855A1 (en) | 2021-05-17 |
KR20200108091A (en) | 2020-09-16 |
US10504762B2 (en) | 2019-12-10 |
US20190244845A1 (en) | 2019-08-08 |
TW201937641A (en) | 2019-09-16 |
TWI816745B (en) | 2023-10-01 |
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