SG11202001175WA - Solid state image sensor with on-chip filter and extended spectral response - Google Patents
Solid state image sensor with on-chip filter and extended spectral responseInfo
- Publication number
- SG11202001175WA SG11202001175WA SG11202001175WA SG11202001175WA SG11202001175WA SG 11202001175W A SG11202001175W A SG 11202001175WA SG 11202001175W A SG11202001175W A SG 11202001175WA SG 11202001175W A SG11202001175W A SG 11202001175WA SG 11202001175W A SG11202001175W A SG 11202001175WA
- Authority
- SG
- Singapore
- Prior art keywords
- image sensor
- solid state
- state image
- spectral response
- chip filter
- Prior art date
Links
- 239000007787 solid Substances 0.000 title 1
- 230000003595 spectral effect Effects 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/10—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void
- G01J1/16—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void using electric radiation detectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0488—Optical or mechanical part supplementary adjustable parts with spectral filtering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0208—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using focussing or collimating elements, e.g. lenses or mirrors; performing aberration correction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/30—Measuring the intensity of spectral lines directly on the spectrum itself
- G01J3/36—Investigating two or more bands of a spectrum by separate detectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/10—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void
- G01J1/16—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void using electric radiation detectors
- G01J1/1626—Arrangements with two photodetectors, the signals of which are compared
- G01J2001/1652—Arrangements with two photodetectors, the signals of which are compared one detector being transparent before the other one
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/713,217 US11037966B2 (en) | 2017-09-22 | 2017-09-22 | Solid state image sensor with on-chip filter and extended spectral response |
PCT/US2018/051640 WO2019060348A2 (en) | 2017-09-22 | 2018-09-19 | Solid state image sensor with on-chip filter and extended spectral response |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001175WA true SG11202001175WA (en) | 2020-04-29 |
Family
ID=63794672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001175WA SG11202001175WA (en) | 2017-09-22 | 2018-09-19 | Solid state image sensor with on-chip filter and extended spectral response |
Country Status (6)
Country | Link |
---|---|
US (1) | US11037966B2 (en) |
EP (1) | EP3685132A2 (en) |
CN (1) | CN111094915A (en) |
BR (1) | BR112020005572A2 (en) |
SG (1) | SG11202001175WA (en) |
WO (1) | WO2019060348A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7352359B2 (en) * | 2019-02-06 | 2023-09-28 | キヤノン株式会社 | Image sensor and imaging device |
US11121162B2 (en) * | 2019-05-07 | 2021-09-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light pipe structure with high quantum efficiency |
US11477360B2 (en) * | 2020-05-15 | 2022-10-18 | Meta Platforms Technologies, Llc | Stacked image sensor with polarization sensing pixel array |
KR20210146725A (en) * | 2020-05-27 | 2021-12-06 | 삼성전자주식회사 | Image Sensor integrated with a infrared sensor and electronic device including the image sensor |
US20220115420A1 (en) * | 2020-10-13 | 2022-04-14 | Samsung Electronics Co., Ltd. | Hyperspectral element, hyperspectral sensor including the same, and hyperspectral image generating apparatus |
FR3140990A1 (en) * | 2022-10-14 | 2024-04-19 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for acquiring a 2D image and a depth image of a scene |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008251985A (en) | 2007-03-30 | 2008-10-16 | Fujifilm Corp | Solid-state imaging device |
US7646943B1 (en) | 2008-09-04 | 2010-01-12 | Zena Technologies, Inc. | Optical waveguides in image sensors |
KR101550866B1 (en) * | 2009-02-09 | 2015-09-08 | 삼성전자주식회사 | Method for manufacturing a image sensor by filling a upper part of dielectric trench and forming air gap to improve optical cross-talk |
US9294691B2 (en) * | 2011-09-06 | 2016-03-22 | Sony Corporation | Imaging device, imaging apparatus, manufacturing apparatus and manufacturing method |
US20130075607A1 (en) * | 2011-09-22 | 2013-03-28 | Manoj Bikumandla | Image sensors having stacked photodetector arrays |
US8569700B2 (en) * | 2012-03-06 | 2013-10-29 | Omnivision Technologies, Inc. | Image sensor for two-dimensional and three-dimensional image capture |
KR101334219B1 (en) * | 2013-08-22 | 2013-11-29 | (주)실리콘화일 | An image sensor with 3d stacking structure |
US9749553B2 (en) * | 2013-08-23 | 2017-08-29 | Semiconductor Components Industries, Llc | Imaging systems with stacked image sensors |
JP6196911B2 (en) * | 2014-02-05 | 2017-09-13 | オリンパス株式会社 | Solid-state imaging device and imaging device |
US9679933B2 (en) * | 2014-10-06 | 2017-06-13 | Visera Technologies Company Limited | Image sensors and methods of forming the same |
US9508681B2 (en) | 2014-12-22 | 2016-11-29 | Google Inc. | Stacked semiconductor chip RGBZ sensor |
US10163968B2 (en) * | 2015-01-23 | 2018-12-25 | Dartmouth College | Multi-junction pixel image sensor with dielectric reflector between photodetection layers |
US9609239B2 (en) | 2015-08-20 | 2017-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Infrared image sensor |
US9786705B2 (en) * | 2015-12-21 | 2017-10-10 | Qualcomm Incorporated | Solid state image sensor with extended spectral response |
JP2017208496A (en) * | 2016-05-20 | 2017-11-24 | ソニー株式会社 | Solid-state image pickup device and electronic apparatus |
US20180295336A1 (en) * | 2017-04-11 | 2018-10-11 | Himax Imaging Limited | IMAGING SYSTEM FOR SENSING 3D image |
US10608036B2 (en) * | 2017-10-17 | 2020-03-31 | Qualcomm Incorporated | Metal mesh light pipe for transporting light in an image sensor |
-
2017
- 2017-09-22 US US15/713,217 patent/US11037966B2/en active Active
-
2018
- 2018-09-19 CN CN201880060527.XA patent/CN111094915A/en active Pending
- 2018-09-19 SG SG11202001175WA patent/SG11202001175WA/en unknown
- 2018-09-19 BR BR112020005572-7A patent/BR112020005572A2/en not_active Application Discontinuation
- 2018-09-19 WO PCT/US2018/051640 patent/WO2019060348A2/en unknown
- 2018-09-19 EP EP18783239.9A patent/EP3685132A2/en active Pending
Also Published As
Publication number | Publication date |
---|---|
BR112020005572A2 (en) | 2020-10-27 |
CN111094915A (en) | 2020-05-01 |
WO2019060348A2 (en) | 2019-03-28 |
US20190096932A1 (en) | 2019-03-28 |
US11037966B2 (en) | 2021-06-15 |
EP3685132A2 (en) | 2020-07-29 |
WO2019060348A3 (en) | 2019-06-06 |
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