SG11202000373YA - Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof - Google Patents

Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof

Info

Publication number
SG11202000373YA
SG11202000373YA SG11202000373YA SG11202000373YA SG11202000373YA SG 11202000373Y A SG11202000373Y A SG 11202000373YA SG 11202000373Y A SG11202000373Y A SG 11202000373YA SG 11202000373Y A SG11202000373Y A SG 11202000373YA SG 11202000373Y A SG11202000373Y A SG 11202000373YA
Authority
SG
Singapore
Prior art keywords
heat exchange
vapour deposition
method therefor
deposition device
exchange method
Prior art date
Application number
SG11202000373YA
Inventor
Tengjun Yang
Yufeng Wang
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11202000373YA publication Critical patent/SG11202000373YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4411—Cooling of the reaction chamber walls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463—Cooling of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F28F27/02—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1393—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0652—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged in parallel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0022—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for chemical reactors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Chemical Vapour Deposition (AREA)
SG11202000373YA 2017-07-17 2018-07-16 Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof SG11202000373YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710582127.2A CN109269332A (en) 2017-07-17 2017-07-17 Heat-exchange device and its heat change method and vapor deposition apparatus
PCT/CN2018/095850 WO2019015554A1 (en) 2017-07-17 2018-07-16 Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof

Publications (1)

Publication Number Publication Date
SG11202000373YA true SG11202000373YA (en) 2020-02-27

Family

ID=65015033

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202000373YA SG11202000373YA (en) 2017-07-17 2018-07-16 Heat exchange apparatus, and heat exchange method therefor and vapour deposition device thereof

Country Status (7)

Country Link
US (1) US20200363146A1 (en)
JP (1) JP2020527219A (en)
KR (1) KR20200026981A (en)
CN (1) CN109269332A (en)
SG (1) SG11202000373YA (en)
TW (1) TWI681518B (en)
WO (1) WO2019015554A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200099688A (en) * 2019-02-15 2020-08-25 이도형 Vacuum deposition apparatus
TWI769634B (en) * 2020-12-22 2022-07-01 台灣積體電路製造股份有限公司 Chiller water supply control system and control method thereof
CN113847817A (en) * 2021-08-27 2021-12-28 日月光半导体制造股份有限公司 Machine table cooling device and method

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JP2003172570A (en) * 2001-12-04 2003-06-20 Choshu Sangyo Kk Brine feeder
JP4652371B2 (en) * 2007-05-08 2011-03-16 株式会社Ｎｔｔファシリティーズ Air conditioning system and operation method thereof
CN101451913B (en) * 2007-11-30 2011-08-31 中国兵器工业集团第七○研究所 Laboratory cooling water auxiliary system for multicylinder diesel engine
CN101476805B (en) * 2008-10-14 2010-06-02 陕西彩虹电子玻璃有限公司 Security emergency apparatus of cooling water system
GB2468920A (en) * 2009-03-27 2010-09-29 Framo Eng As Subsea cooler for cooling a fluid flowing in a subsea flow line
CN101694351B (en) * 2009-09-07 2011-12-21 青岛科技大学 Intelligent industrial circulation water-cooling system
CN201875806U (en) * 2010-11-22 2011-06-22 盛水祥 Dual-purpose wall-hung furnace for plate-type heat exchanger
CN102829649A (en) * 2011-06-13 2012-12-19 上海金日冷却设备有限公司 Anti-freezing device for closed cooling tower
JP5510418B2 (en) * 2011-09-05 2014-06-04 株式会社デンソー Air conditioner for vehicles
JP5673580B2 (en) * 2012-02-15 2015-02-18 トヨタ自動車株式会社 Fuel cell system
JP5875408B2 (en) * 2012-02-29 2016-03-02 三菱重工業株式会社 Injection timing adjustment control system for fuel injection pump
JP2014194301A (en) * 2013-03-29 2014-10-09 Ntt Facilities Inc Air conditioning system and air conditioning system operation method
JP6479406B2 (en) * 2014-10-20 2019-03-06 三菱重工業株式会社 Cooling equipment and nuclear equipment
CN204300151U (en) * 2014-11-18 2015-04-29 南京贝奇尔机械有限公司 A kind of hydroelectricity generator external circulation cooling system
CN204417655U (en) * 2015-01-06 2015-06-24 江苏东方四通科技股份有限公司 Crystal growing furnace power supply water circle device
CN104596174A (en) * 2015-01-26 2015-05-06 上海威特力热管散热器有限公司 Cooling circulating device used for mining electrical equipment
JP6569096B2 (en) * 2015-03-06 2019-09-04 株式会社片山化学工業研究所 Open circulation cooling system and tube anticorrosion method of heat exchanger during operation stop
CN104914891A (en) * 2015-06-04 2015-09-16 北京自动化技术研究院 Cooling control system for temperature control device
CN106679259A (en) * 2015-11-09 2017-05-17 杭州盛忆镐科技有限公司 Treatment device for cooling water circulation
CN205245639U (en) * 2015-11-09 2016-05-18 杭州盛忆镐科技有限公司 Cooling water circulation uses treatment facility
CN106594516B (en) * 2016-11-28 2018-10-26 哈尔滨工程大学 A kind of LNG Power Vessels are cold and hot can cross-utilization system and implementation method

Also Published As

Publication number Publication date
JP2020527219A (en) 2020-09-03
WO2019015554A1 (en) 2019-01-24
CN109269332A (en) 2019-01-25
TWI681518B (en) 2020-01-01
US20200363146A1 (en) 2020-11-19
KR20200026981A (en) 2020-03-11
TW201909358A (en) 2019-03-01

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