SG11201912704YA - Scanning electron microscope objective lens calibration - Google Patents

Scanning electron microscope objective lens calibration

Info

Publication number
SG11201912704YA
SG11201912704YA SG11201912704YA SG11201912704YA SG11201912704YA SG 11201912704Y A SG11201912704Y A SG 11201912704YA SG 11201912704Y A SG11201912704Y A SG 11201912704YA SG 11201912704Y A SG11201912704Y A SG 11201912704YA SG 11201912704Y A SG11201912704Y A SG 11201912704YA
Authority
SG
Singapore
Prior art keywords
objective lens
electron microscope
scanning electron
microscope objective
lens calibration
Prior art date
Application number
SG11201912704YA
Inventor
Ichiro Honjo
Christopher Sears
Hedong Yang
Thanh Ha
Jianwei Wang
Huina Xu
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201912704YA publication Critical patent/SG11201912704YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/008—Details of detection or image processing, including general computer control
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/02—Objectives
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/10—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1471—Arrangements for directing or deflecting the discharge along a desired path for centering, aligning or positioning of ray or beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical or photographic arrangements associated with the tube
    • H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3007—Electron or ion-optical systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/1501—Beam alignment means or procedures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/282—Determination of microscope properties
    • H01J2237/2826—Calibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Biophysics (AREA)
  • Software Systems (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • General Health & Medical Sciences (AREA)
  • Computational Linguistics (AREA)
  • Biomedical Technology (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
SG11201912704YA 2017-06-29 2018-06-29 Scanning electron microscope objective lens calibration SG11201912704YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762526804P 2017-06-29 2017-06-29
US15/672,797 US10790114B2 (en) 2017-06-29 2017-08-09 Scanning electron microscope objective lens calibration using X-Y voltages iteratively determined from images obtained using said voltages
PCT/US2018/040166 WO2019006225A1 (en) 2017-06-29 2018-06-29 Scanning electron microscope objective lens calibration

Publications (1)

Publication Number Publication Date
SG11201912704YA true SG11201912704YA (en) 2020-01-30

Family

ID=64734421

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201912704YA SG11201912704YA (en) 2017-06-29 2018-06-29 Scanning electron microscope objective lens calibration

Country Status (9)

Country Link
US (1) US10790114B2 (en)
EP (1) EP3635468A4 (en)
JP (1) JP7030856B2 (en)
KR (1) KR102363558B1 (en)
CN (1) CN110770624B (en)
IL (1) IL271541B (en)
SG (1) SG11201912704YA (en)
TW (1) TWI772449B (en)
WO (1) WO2019006225A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3951832A1 (en) * 2020-08-03 2022-02-09 FEI Company Method of aligning a charged particle beam apparatus
JP2023541993A (en) * 2020-09-21 2023-10-04 モレキュラー デバイシーズ， エルエルシー Method and system for developing imaging configurations to optimize performance of microscopy systems

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969350A (en) * 1995-08-31 1997-03-11 Hitachi Ltd Optical axis matching device of scanning electron microscope
US5627373A (en) * 1996-06-17 1997-05-06 Hewlett-Packard Company Automatic electron beam alignment and astigmatism correction in scanning electron microscope
KR100191347B1 (en) * 1996-08-09 1999-06-15 윤종용 Critical dimension management sample for semiconductor manufacturing process
US6066849A (en) * 1997-01-16 2000-05-23 Kla Tencor Scanning electron beam microscope
US6744268B2 (en) * 1998-08-27 2004-06-01 The Micromanipulator Company, Inc. High resolution analytical probe station
US6198299B1 (en) * 1998-08-27 2001-03-06 The Micromanipulator Company, Inc. High Resolution analytical probe station
JP3802716B2 (en) * 1999-09-17 2006-07-26 株式会社日立製作所 Sample inspection method and apparatus
ATE484840T1 (en) * 2001-10-10 2010-10-15 Applied Materials Israel Ltd METHOD AND DEVICE FOR ALIGNING A COLUMN FOR CHARGED PARTICLE BEAMS
CN100341106C (en) * 2001-10-10 2007-10-03 应用材料以色列有限公司 Method and device for aligning a charged particle beam column
JP4737968B2 (en) * 2004-10-13 2011-08-03 株式会社東芝 Correction device, correction method, correction program, and semiconductor device manufacturing method
NL1029847C2 (en) * 2005-09-01 2007-03-05 Fei Co Method for determining lens errors in a particle-optical device.
JP4920268B2 (en) * 2006-02-23 2012-04-18 株式会社日立ハイテクノロジーズ Semiconductor process monitoring method and system
US8026491B2 (en) * 2006-03-08 2011-09-27 Hitachi High-Technologies Corporation Charged particle beam apparatus and method for charged particle beam adjustment
JP4928987B2 (en) * 2006-03-08 2012-05-09 株式会社日立ハイテクノロジーズ Charged particle beam adjustment method and charged particle beam apparatus
JP5241353B2 (en) 2007-07-31 2013-07-17 株式会社日立ハイテクノロジーズ Method for adjusting scanning electron microscope and scanning electron microscope
US8080790B2 (en) 2008-03-05 2011-12-20 Hitachi High-Technologies Corporation Scanning electron microscope
JP5715873B2 (en) * 2011-04-20 2015-05-13 株式会社日立ハイテクノロジーズ Defect classification method and defect classification system
JP5401521B2 (en) * 2011-09-05 2014-01-29 株式会社日立ハイテクノロジーズ Charged particle beam equipment
JP6043735B2 (en) * 2012-02-14 2016-12-14 株式会社日立ハイテクノロジーズ Image evaluation apparatus and pattern shape evaluation apparatus
US8969827B2 (en) * 2012-07-09 2015-03-03 Materials Analysis Technology (Us) Corp. Specimen preparation for transmission electron microscopy
US9098891B2 (en) * 2013-04-08 2015-08-04 Kla-Tencor Corp. Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology
US10539589B2 (en) * 2014-06-25 2020-01-21 Fei Efa, Inc. Through process flow intra-chip and inter-chip electrical analysis and process control using in-line nanoprobing
CN107300629B (en) * 2017-07-31 2019-07-09 清华大学 Scan probe scaling method

Also Published As

Publication number Publication date
KR20200014444A (en) 2020-02-10
IL271541A (en) 2020-02-27
EP3635468A1 (en) 2020-04-15
TWI772449B (en) 2022-08-01
EP3635468A4 (en) 2021-03-10
CN110770624B (en) 2021-10-08
US10790114B2 (en) 2020-09-29
US20190004298A1 (en) 2019-01-03
CN110770624A (en) 2020-02-07
JP2020526872A (en) 2020-08-31
JP7030856B2 (en) 2022-03-07
KR102363558B1 (en) 2022-02-17
IL271541B (en) 2022-04-01
WO2019006225A1 (en) 2019-01-03
TW201907436A (en) 2019-02-16

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