SG11201808732RA - Micromachined bulk acoustic wave resonator pressure sensor - Google Patents
Micromachined bulk acoustic wave resonator pressure sensorInfo
- Publication number
- SG11201808732RA SG11201808732RA SG11201808732RA SG11201808732RA SG11201808732RA SG 11201808732R A SG11201808732R A SG 11201808732RA SG 11201808732R A SG11201808732R A SG 11201808732RA SG 11201808732R A SG11201808732R A SG 11201808732RA SG 11201808732R A SG11201808732R A SG 11201808732RA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- planar structure
- region
- substrate
- pressure sensor
- Prior art date
Links
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 230000008520 organization Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/008—Transmitting or indicating the displacement of flexible diaphragms using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0022—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0047—Diaphragm with non uniform thickness, e.g. with grooves, bosses or continuously varying thickness
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Micromachines (AREA)
- Fuel-Injection Apparatus (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1111111011110111011111111010111110 0111111111011111011111011111111011111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\"\" WO 2017/210184 Al 07 December 2017 (07.12.2017) WIP0 I PCT (51) International Patent Classification: (74) Agent: MILLS, Steven M. et al.; Burns & Levinson LLP, G01L 9/00 (2006.01) 125 Summer Street, Boston, Massachusetts 02110 (US). (21) International Application Number: (81) Designated States (unless otherwise indicated, for every PCT/US2017/034987 kind of national protection available): AE, AG, AL, AM, (22) International Filing Date: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, 30 May 2017 (30.05.2017) CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, (25) Filing Language: English HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, (26) Publication Language: English KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, (30) Priority Data: PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, 62/345,180 03 June 2016 (03.06.2016) US SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, 15/602,758 23 May 2017 (23.05.2017) US TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (71) Applicant: MKS INSTRUMENTS, INC. [US/US]; 2 (84) Designated States (unless otherwise indicated, for every Tech Drive, Suite 201, Andover, Massachusetts 01810 kind of regional protection available): ARIPO (BW, GH, (US). GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, (72) Inventors: TADIGADAPA, Srinivas; 1417 Ridge Mas-TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, ter Drive, State College, Pennsylvania 16803 (US). GOEL, EE, ES, FL FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, — Nishit; 801 Southgate Drive, Apt. A4, State College, Penn- MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, sylvania 16801 (US). BART, Stephen; 15 Rangeley Road, — TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, = West Newton, Massachusetts 02465 (US). KM, ML, MR, NE, SN, TD, TG). (54) Title: MICROMACHINED BULK ACOUSTIC = = = = = = 304 = = 306 Pressure Applied WAVE RESONATOR AP) PRESSURE SENSOR 304 - 360 — isiiimp = = 32O , = = 396 1 392 '362 = 318 32 - Fig. 38 .4 2 (57) : A pressure sensor includes a piezoelectric substrate having a w w the piezoelectric substrate at the periphery of the planar structure of the piezoelectric 1-1 © substrate has a first region having a first characteristic thickness adjacent to Il characteristic thickness at a middle region of the substrate. The second characteristic ei --.... ness such that the planar structure in the second region is displaced relative to the neutral axis of the planar structure such that while IN undergoing bending the second region has either mostly compressive or mostly 1-1 0 ei 366 324 generally planar structure and an anchor location fixing substrate. The planar structure of the piezoelectric the anchor location, and a second region have a second thickness is less than the first characteristic thick- tensile stress. O [Continued on next page] WO 2017/210184 Al MIDEDIM00010101110101110010i0101ROEIDEMOVOIS Published: — with international search report (Art. 21(3))
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662345180P | 2016-06-03 | 2016-06-03 | |
US15/602,758 US10352800B2 (en) | 2016-06-03 | 2017-05-23 | Micromachined bulk acoustic wave resonator pressure sensor |
PCT/US2017/034987 WO2017210184A1 (en) | 2016-06-03 | 2017-05-30 | Micromachined bulk acoustic wave resonator pressure sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201808732RA true SG11201808732RA (en) | 2018-11-29 |
Family
ID=59031407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201808732RA SG11201808732RA (en) | 2016-06-03 | 2017-05-30 | Micromachined bulk acoustic wave resonator pressure sensor |
Country Status (8)
Country | Link |
---|---|
US (1) | US10352800B2 (en) |
EP (1) | EP3420332A1 (en) |
JP (1) | JP2019519763A (en) |
KR (1) | KR20190011737A (en) |
CN (1) | CN109154533A (en) |
SG (1) | SG11201808732RA (en) |
TW (1) | TWI666432B (en) |
WO (1) | WO2017210184A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018131357A1 (en) * | 2018-12-07 | 2020-06-10 | Carl Freudenberg Kg | Sensor element with mounting section |
DE102018131352A1 (en) * | 2018-12-07 | 2020-06-10 | Carl Freudenberg Kg | Sensor element with one-piece support and sensor body |
CN110793708B (en) * | 2019-11-15 | 2021-12-03 | 联合微电子中心有限责任公司 | Piezoelectric type MEMS acoustic sensor |
CN110944274B (en) * | 2019-11-20 | 2020-12-18 | 武汉大学 | Tunable MEMS piezoelectric transducer with mass load based on Pitton-mode |
CN114275730B (en) * | 2021-11-17 | 2023-09-26 | 电子科技大学 | Magnetic vibrator coupling resonance type micro-nano weighing device and preparation method thereof |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4507170A (en) | 1980-01-07 | 1985-03-26 | Myhre Kjell E | Optimized stress and strain distribution diaphragms |
CH639762A5 (en) | 1980-11-12 | 1983-11-30 | Centre Electron Horloger | PRESSURE TRANSDUCER WITH VIBRATING ELEMENT. |
FR2527865A1 (en) | 1982-06-01 | 1983-12-02 | Cepe | HIGH FREQUENCY PIEZOELECTRIC RESONATOR AND MANUFACTURING METHOD THEREOF |
US5235240A (en) | 1990-05-25 | 1993-08-10 | Toyo Communication Equipment Co., Ltd. | Electrodes and their lead structures of an ultrathin piezoelectric resonator |
DE4414926C2 (en) | 1994-04-28 | 1997-11-20 | Christian Dr Ing Reichinger | Device for detecting forces or pressures with a piezoelectric resonator |
IT1287123B1 (en) * | 1996-10-31 | 1998-08-04 | Abb Kent Taylor Spa | DEVICE FOR MEASURING A PRESSURE |
US20040099061A1 (en) * | 1997-12-22 | 2004-05-27 | Mks Instruments | Pressure sensor for detecting small pressure differences and low pressures |
US6507187B1 (en) * | 1999-08-24 | 2003-01-14 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ultra-sensitive magnetoresistive displacement sensing device |
SE0300375D0 (en) * | 2003-02-12 | 2003-02-12 | Attana Ab | Piezoelectric resonator |
JP2006020020A (en) * | 2004-07-01 | 2006-01-19 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator |
US20090120194A1 (en) | 2007-11-08 | 2009-05-14 | Honeywell International Inc. | Silicon pressure sensor |
US8256306B1 (en) * | 2009-09-02 | 2012-09-04 | The Boeing Company | High-capacity low-profile load cell for measuring compression force |
JP2014211405A (en) * | 2013-04-22 | 2014-11-13 | セイコーエプソン株式会社 | Mems pressure sensor, electronic device, altimeter, electronic apparatus and movable body |
FI125960B (en) | 2013-05-28 | 2016-04-29 | Murata Manufacturing Co | Improved pressure sensor |
JP6212000B2 (en) | 2014-07-02 | 2017-10-11 | 株式会社東芝 | Pressure sensor, and microphone, blood pressure sensor, and touch panel using pressure sensor |
WO2016081915A1 (en) * | 2014-11-21 | 2016-05-26 | California Institute Of Technology | Pressure sensor using piezoelectric bending resonators |
US9963340B2 (en) * | 2015-12-03 | 2018-05-08 | Honeywell International Inc. | Pressure sensor die over pressure protection for high over pressure to operating span ratios |
-
2017
- 2017-05-23 US US15/602,758 patent/US10352800B2/en not_active Expired - Fee Related
- 2017-05-30 EP EP17728987.3A patent/EP3420332A1/en not_active Withdrawn
- 2017-05-30 SG SG11201808732RA patent/SG11201808732RA/en unknown
- 2017-05-30 CN CN201780032411.0A patent/CN109154533A/en active Pending
- 2017-05-30 WO PCT/US2017/034987 patent/WO2017210184A1/en active Application Filing
- 2017-05-30 KR KR1020187033939A patent/KR20190011737A/en unknown
- 2017-05-30 JP JP2018558681A patent/JP2019519763A/en active Pending
- 2017-06-02 TW TW106118184A patent/TWI666432B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP3420332A1 (en) | 2019-01-02 |
US20170350779A1 (en) | 2017-12-07 |
KR20190011737A (en) | 2019-02-07 |
TWI666432B (en) | 2019-07-21 |
TW201743038A (en) | 2017-12-16 |
WO2017210184A1 (en) | 2017-12-07 |
CN109154533A (en) | 2019-01-04 |
US10352800B2 (en) | 2019-07-16 |
JP2019519763A (en) | 2019-07-11 |
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