SG11201709029QA - System and Method for Lead Foot Angle Inspection Using Multiview Stereo Vision - Google Patents

System and Method for Lead Foot Angle Inspection Using Multiview Stereo Vision

Info

Publication number
SG11201709029QA
SG11201709029QA SG11201709029QA SG11201709029QA SG11201709029QA SG 11201709029Q A SG11201709029Q A SG 11201709029QA SG 11201709029Q A SG11201709029Q A SG 11201709029QA SG 11201709029Q A SG11201709029Q A SG 11201709029QA SG 11201709029Q A SG11201709029Q A SG 11201709029QA
Authority
SG
Singapore
Prior art keywords
singapore
international
image capturing
capturing device
blk
Prior art date
Application number
SG11201709029QA
Inventor
Hak Wee Tang
Ruini Cao
Kok Yeow Lim
Zin Oo Thant
Original Assignee
Generic Power Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Generic Power Pte Ltd filed Critical Generic Power Pte Ltd
Publication of SG11201709029QA publication Critical patent/SG11201709029QA/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/282—Image signal generators for generating image signals corresponding to three or more geometrical viewpoints, e.g. multi-view systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/80—Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/243—Image signal generators using stereoscopic image cameras using three or more 2D image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/246—Calibration of cameras
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G06T2207/10012—Stereo images
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30244—Camera pose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N2013/0074—Stereoscopic image analysis
    • H04N2013/0081—Depth or disparity estimation from stereoscopic image signals

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Eye Examination Apparatus (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electromagnetism (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 08 November 2018 (08.11.2018) WIPO I PCT 01E1°1°1a °nolo III 010 01110l Elm im iflo oimIE (10) International Publication Number WO 2018/203824 Al (51) International Patent Classification: GO1B 11/26 (2006.01) GO1N 21/84 (2006.01) (21) International Application Number: PCT/SG2017/050232 (22) International Filing Date: 02 May 2017 (02.05.2017) (25) Filing Language: English (26) Publication Language: English (71) Applicant: GENERIC POWER PTE LTD [SG/SG]; Blk 5004 Ang Mo Kio Ave 5, #03-12 TECHplace II, Singapore 569872 (SG). (72) Inventors: TANG, Hak Wee; 503 Sembawang Road, #03-27, Singapore 757707 (SG). CAO, Ruini; Blk. 368, Corporation Drive, #09-469, Singapore 610368 (SG). LIM, Kok Yeow; 130 Hillview Avenue, #08-01, Singapore 669596 (SG). THANT, Zin Oo; Blk. 548, Ang Mo Kio Av- enue 10, #03-2016, Singapore 560548 (SG). (74) Agent: NG, Kim Tean; NANYANG LAW LLC, P.O. Box 1861, Robinson Road Post Office, Singapore 903711 (SG). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: with international search report (Art. 21(3)) with amended claims (Art. 19(1)) (54) Title: SYSTEM AND METHOD FOR LEAD FOOT ANGLE INSPECTION USING MULTIVIEW STEREO VISION (57) : The present invention includes a system and method for three-dimensional imaging and analysis of electronic components. Specifi- cally, it permits rapid and reliable inspection of the lead foot angle in inte- 30 grated circuit packages. A first image capturing device, a second image cap- turing device and a third image capturing device are arranged in a \"corner shape\" or \"L-shape.\" The first image capturing device forms the corner and 40 A 40 obtains an image of the bottom of the component. The perspective viewing angle of the second image capturing device and the perspective viewing an- gle of the third image capturing device are orthogonal to each other to allow accurate three-dimensional reconstruction of the lead angles and detection 63 of flaws or bends. 73 W O 20 18/ 2038 24 Al St: 83 81 FIGURE 1
SG11201709029QA 2017-05-02 2017-05-02 System and Method for Lead Foot Angle Inspection Using Multiview Stereo Vision SG11201709029QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2017/050232 WO2018203824A1 (en) 2017-05-02 2017-05-02 System and method for lead foot angle inspection using multiview stereo vision

Publications (1)

Publication Number Publication Date
SG11201709029QA true SG11201709029QA (en) 2018-12-28

Family

ID=64015012

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709029QA SG11201709029QA (en) 2017-05-02 2017-05-02 System and Method for Lead Foot Angle Inspection Using Multiview Stereo Vision

Country Status (4)

Country Link
US (1) US10715790B2 (en)
CN (1) CN109219730B (en)
SG (1) SG11201709029QA (en)
WO (1) WO2018203824A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112701060B (en) * 2021-03-24 2021-08-06 高视科技(苏州)有限公司 Method and device for detecting bonding wire of semiconductor chip
CN114543680B (en) * 2022-02-18 2022-12-02 国网湖北省电力有限公司电力科学研究院 On-site monitoring and distance measuring method for overhead transmission line channel construction vehicle

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5477138A (en) * 1991-07-23 1995-12-19 Vlsi Technology, Inc. Apparatus and method for testing the calibration of a variety of electronic package lead inspection systems
US6111702A (en) * 1995-11-30 2000-08-29 Lucent Technologies Inc. Panoramic viewing system with offset virtual optical centers
SG42307A1 (en) * 1996-01-09 1997-08-15 Peng Seng Toh Measurement and inspection of leads on integrated circuit packages
JP3995030B2 (en) * 1996-09-17 2007-10-24 コグネックス・テクノロジー・アンド・インベストメント・コーポレーション Semiconductor package inspection equipment
US5991434A (en) * 1996-11-12 1999-11-23 St. Onge; James W. IC lead inspection system configurable for different camera positions
US6072898A (en) * 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
US7653237B2 (en) * 1998-01-16 2010-01-26 Scanner Technologies Corporation Method of manufacturing ball array devices using an inspection apparatus having two or more cameras and ball array devices produced according to the method
US6242756B1 (en) * 1998-05-21 2001-06-05 Agilent Technologies, Inc Cross optical axis inspection system for integrated circuits
US7103212B2 (en) * 2002-11-22 2006-09-05 Strider Labs, Inc. Acquisition of three-dimensional images by an active stereo technique using locally unique patterns
US8107719B2 (en) * 2005-11-12 2012-01-31 Douglas Davidson Machine vision system for three-dimensional metrology and inspection in the semiconductor industry
SG138491A1 (en) 2006-06-21 2008-01-28 Generic Power Pte Ltd Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components
US7535560B2 (en) * 2007-02-26 2009-05-19 Aceris 3D Inspection Inc. Method and system for the inspection of integrated circuit devices having leads
US8179434B2 (en) * 2008-05-09 2012-05-15 Mettler-Toledo, LLC System and method for imaging of curved surfaces
CN201814585U (en) * 2010-09-03 2011-05-04 北京睿思厚德辐射信息科技有限公司 Medical and industrial X-ray real-time three-dimensional imaging device
CN103733019B (en) * 2012-07-24 2017-03-01 精益视觉科技私人有限公司 Method and apparatus for determining the coplanarity of integrated antenna package
US9626752B2 (en) * 2013-05-22 2017-04-18 Delta Design, Inc. Method and apparatus for IC 3D lead inspection having color shadowing
KR101784276B1 (en) * 2015-02-27 2017-10-12 주식회사 고영테크놀러지 Board inspection method and system

Also Published As

Publication number Publication date
WO2018203824A1 (en) 2018-11-08
CN109219730B (en) 2020-10-13
US10715790B2 (en) 2020-07-14
CN109219730A (en) 2019-01-15
US20180324409A1 (en) 2018-11-08

Similar Documents

Publication Publication Date Title
SG11201809960YA (en) System and method for automated table game activity recognition
SG11201909671TA (en) Method of living body detection and terminal device
SG11201903958SA (en) Intuitive occluded object indicator
SG11201903836QA (en) Image-based vehicle damage determining method, apparatus, and electronic device
SG11201909420QA (en) Picture-based vehicle loss assessment method and apparatus, and electronic device
SG11201810922VA (en) Methods and systems for detecting environmental information of a vehicle
SG11201903904VA (en) Image-based vehicle loss assessment method, apparatus, and system, and electronic device
SG11201804506RA (en) Systems and methods for rendering multiple levels of detail
SG11201901450QA (en) Methods of forming semiconductor device structures including two-dimensional material structures
SG11201803666WA (en) Single image detection
SG11201710421WA (en) Vending machine
SG11201903107SA (en) Method and system for providing information of stored object
SG11201807741SA (en) Conductive structures, systems and devices including conductive structures and related methods
SG11201803717VA (en) Method and system for shared transport
SG11201907091PA (en) Intra-prediction mode propagation
SG11201811765TA (en) Methods and systems for providing transportation service
SG11201810493WA (en) System and method for electrical circuit monitoring
SG11201900047UA (en) Chickpea protein concentrate
SG11201407668XA (en) Method and device for detecting an analyte in a body fluid
SG11201709029QA (en) System and Method for Lead Foot Angle Inspection Using Multiview Stereo Vision
SG11201808547UA (en) Transfer system for flipping and multiple checking of electronic devices
SG11201908767QA (en) Method for accurate diagnosis of a disease targeting biomarkers in liquid biopsy
SG11201909024XA (en) Obtaining data from targets using imagery and other remote sensing data
SG11201901042YA (en) Optical measurement of opening dimensions in a wafer
SG11201906159XA (en) Socket side thermal system