SG11201707202QA - A component handling assembly - Google Patents

A component handling assembly

Info

Publication number
SG11201707202QA
SG11201707202QA SG11201707202QA SG11201707202QA SG11201707202QA SG 11201707202Q A SG11201707202Q A SG 11201707202QA SG 11201707202Q A SG11201707202Q A SG 11201707202QA SG 11201707202Q A SG11201707202Q A SG 11201707202QA SG 11201707202Q A SG11201707202Q A SG 11201707202QA
Authority
SG
Singapore
Prior art keywords
handling assembly
component handling
component
assembly
handling
Prior art date
Application number
SG11201707202QA
Inventor
Rainer Hittmann
Max Schaule
Dieter Schmid
Original Assignee
Rasco Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rasco Gmbh filed Critical Rasco Gmbh
Publication of SG11201707202QA publication Critical patent/SG11201707202QA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/917—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automatic Assembly (AREA)
  • Manipulator (AREA)
  • Drying Of Solid Materials (AREA)
SG11201707202QA 2015-05-29 2015-05-29 A component handling assembly SG11201707202QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2015/061990 WO2016192754A1 (en) 2015-05-29 2015-05-29 A component handling assembly

Publications (1)

Publication Number Publication Date
SG11201707202QA true SG11201707202QA (en) 2017-10-30

Family

ID=53385596

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707202QA SG11201707202QA (en) 2015-05-29 2015-05-29 A component handling assembly

Country Status (8)

Country Link
US (1) US20180053681A1 (en)
EP (1) EP3304585A1 (en)
KR (1) KR20180008426A (en)
CN (1) CN107534010A (en)
PH (1) PH12017501802A1 (en)
SG (1) SG11201707202QA (en)
TW (1) TWI649246B (en)
WO (1) WO2016192754A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3895210A1 (en) * 2018-12-11 2021-10-20 ISMECA Semiconductor Holding SA A component handling assembly

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219634A (en) * 1986-03-20 1987-09-26 Hitachi Ltd Vacuum retainer
US5188411A (en) * 1991-01-24 1993-02-23 John A. Blatt Vacuum cup control apparatus
DE19732056A1 (en) * 1997-07-25 1999-01-28 Schuler Pressen Gmbh & Co Vacuum system for a transfer system
JP2000207033A (en) * 1999-01-18 2000-07-28 Myotoku Ltd Pressure sensor device
US6364089B1 (en) * 1999-12-10 2002-04-02 National Semiconductor Corporation Multi-station rotary die handling device
US6397885B1 (en) * 2001-02-06 2002-06-04 Norgren Automotive, Inc. Vacuum control apparatus for maintaining the operating condition of a vacuum responsive device during loss and resumption of power
JP4346912B2 (en) * 2003-01-20 2009-10-21 株式会社 東京ウエルズ Vacuum suction system and control method thereof
DE102004013058B4 (en) * 2004-03-05 2008-09-25 J. Schmalz Gmbh Method for operating a vacuum handling device
KR100574058B1 (en) * 2004-08-20 2006-04-27 삼성전자주식회사 Wafer bake apparatus
DE102004042825B3 (en) * 2004-08-28 2006-01-05 J. Schmalz Gmbh Method for operating a vacuum handling device
JP4695406B2 (en) * 2005-02-10 2011-06-08 パナソニック株式会社 Component mounting apparatus and component mounting method
KR101328210B1 (en) * 2005-02-10 2013-11-14 파나소닉 주식회사 Comp0nent mounting equipment and substrate transfer method
CN101395981B (en) * 2006-03-07 2011-01-26 松下电器产业株式会社 Component mounting condition determination method
US20100283194A1 (en) * 2009-05-11 2010-11-11 Han Zhen-Zhong Energy-saving vacuum adsorption apparatus
DE102011118173B4 (en) * 2011-11-10 2015-10-08 Festo Ag & Co. Kg Method for operating a vacuum gripper, vacuum controller and manipulator
KR101430691B1 (en) * 2012-06-22 2014-08-18 에스브이에스 주식회사 Apparatus and Method for removing air in viahole of semiconductor
EP3115795A1 (en) * 2013-11-11 2017-01-11 Rasco GmbH Component handling assembly and method of handling components

Also Published As

Publication number Publication date
KR20180008426A (en) 2018-01-24
TW201641398A (en) 2016-12-01
PH12017501802A1 (en) 2018-04-02
US20180053681A1 (en) 2018-02-22
CN107534010A (en) 2018-01-02
WO2016192754A1 (en) 2016-12-08
TWI649246B (en) 2019-02-01
EP3304585A1 (en) 2018-04-11

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