SG11201706245YA - Image sensor, output method, phase focusing method, imaging device, and terminal - Google Patents
Image sensor, output method, phase focusing method, imaging device, and terminalInfo
- Publication number
- SG11201706245YA SG11201706245YA SG11201706245YA SG11201706245YA SG11201706245YA SG 11201706245Y A SG11201706245Y A SG 11201706245YA SG 11201706245Y A SG11201706245Y A SG 11201706245YA SG 11201706245Y A SG11201706245Y A SG 11201706245YA SG 11201706245Y A SG11201706245Y A SG 11201706245YA
- Authority
- SG
- Singapore
- Prior art keywords
- terminal
- image sensor
- imaging device
- phase focusing
- output method
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000003384 imaging method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Automatic Focus Adjustment (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Focusing (AREA)
- Color Television Image Signal Generators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963242.5A CN105611122B (en) | 2015-12-18 | 2015-12-18 | Imaging sensor and output method, phase focusing method, imaging device and terminal |
| PCT/CN2016/101704 WO2017101572A1 (en) | 2015-12-18 | 2016-10-10 | Image sensor, and output method, phase focusing method, imaging apparatus and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201706245YA true SG11201706245YA (en) | 2017-08-30 |
Family
ID=55990638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201706245YA SG11201706245YA (en) | 2015-12-18 | 2016-10-10 | Image sensor, output method, phase focusing method, imaging device, and terminal |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US10880501B2 (en) |
| EP (1) | EP3236647A4 (en) |
| JP (1) | JP2018509061A (en) |
| KR (1) | KR102038680B1 (en) |
| CN (1) | CN105611122B (en) |
| AU (1) | AU2016370348B2 (en) |
| MY (1) | MY184812A (en) |
| SG (1) | SG11201706245YA (en) |
| TW (2) | TWI662842B (en) |
| WO (1) | WO2017101572A1 (en) |
| ZA (1) | ZA201706228B (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611122B (en) * | 2015-12-18 | 2019-03-01 | Oppo广东移动通信有限公司 | Imaging sensor and output method, phase focusing method, imaging device and terminal |
| CN106504218B (en) | 2016-11-29 | 2019-03-12 | Oppo广东移动通信有限公司 | Control method, control device and electronic device |
| CN106454054B (en) | 2016-11-29 | 2019-03-19 | Oppo广东移动通信有限公司 | Control method, control device and electronic device |
| CN106454288B (en) | 2016-11-29 | 2018-01-19 | 广东欧珀移动通信有限公司 | Control method, control device, imaging device and electronic installation |
| CN106341670B (en) | 2016-11-29 | 2017-09-22 | 广东欧珀移动通信有限公司 | Control method, control device and electronic installation |
| CN107040702B (en) * | 2017-04-28 | 2020-06-05 | Oppo广东移动通信有限公司 | Image sensor, focusing control method, imaging device and mobile terminal |
| CN107155072A (en) * | 2017-04-28 | 2017-09-12 | 广东欧珀移动通信有限公司 | Panorama shooting method, device and terminal device |
| CN107040730B (en) * | 2017-04-28 | 2020-05-08 | Oppo广东移动通信有限公司 | Imaging control method of image sensor, and imaging apparatus |
| CN107105141B (en) * | 2017-04-28 | 2019-06-28 | Oppo广东移动通信有限公司 | Imaging sensor, image processing method, imaging device and mobile terminal |
| CN107135340A (en) * | 2017-04-28 | 2017-09-05 | 广东欧珀移动通信有限公司 | Imaging sensor, focusing control method, imaging device and mobile terminal |
| CN107147845B (en) * | 2017-04-28 | 2020-11-06 | Oppo广东移动通信有限公司 | Focusing method and device and terminal equipment |
| CN106982329B (en) * | 2017-04-28 | 2020-08-07 | Oppo广东移动通信有限公司 | Image sensor, focusing control method, imaging device and mobile terminal |
| US10714520B1 (en) * | 2017-08-04 | 2020-07-14 | Facebook Technologies, Llc | Manufacturing an on-chip microlens array |
| US10777609B1 (en) * | 2019-04-01 | 2020-09-15 | Visera Technologies Company Limited | Optical devices with light collection elements formed in pixels |
| CN110381181A (en) * | 2019-06-28 | 2019-10-25 | 信利光电股份有限公司 | Future range inducing method, electronic device, storage medium and mobile terminal |
| CN111131714A (en) * | 2019-12-31 | 2020-05-08 | 联想(北京)有限公司 | Image acquisition control method and device and electronic equipment |
| US11663728B2 (en) | 2020-01-16 | 2023-05-30 | Samsung Electronics Co., Ltd. | Depth estimation method and apparatus |
| CN111464733B (en) * | 2020-05-22 | 2021-10-01 | Oppo广东移动通信有限公司 | Control method, camera assembly and mobile terminal |
| CN112243096B (en) * | 2020-09-30 | 2024-01-02 | 格科微电子（上海）有限公司 | Pixel reading method and device in pixel synthesis mode, storage medium and image acquisition equipment |
| CN112616009B (en) * | 2020-12-31 | 2022-08-02 | 维沃移动通信有限公司 | Electronic equipment and camera module thereof |
| GB2618466A (en) * | 2021-02-20 | 2023-11-08 | Boe Technology Group Co Ltd | Image acquisition device, image acquisition apparatus, image acquisition method and manufacturing method |
| CN113654459B (en) * | 2021-07-22 | 2024-05-24 | 北京小米移动软件有限公司 | Method, device and storage medium for determining position of under-screen photosensitive sensor |
| CN114827488B (en) * | 2022-04-26 | 2023-02-17 | 北京大学 | Pixel structure unit, pixel structure array, operating method of pixel structure unit and pixel structure array, and image sensor |
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| US6999119B1 (en) | 1998-04-10 | 2006-02-14 | Nikon Corporation | Image-capturing element, image-capturing circuit for processing signal from image-capturing element, image-capturing device, driving method of image-capturing element |
| JP2004191630A (en) * | 2002-12-11 | 2004-07-08 | Canon Inc | Imaging apparatus |
| US7568628B2 (en) | 2005-03-11 | 2009-08-04 | Hand Held Products, Inc. | Bar code reading device with global electronic shutter control |
| KR100976284B1 (en) * | 2007-06-07 | 2010-08-16 | 가부시끼가이샤 도시바 | Image pickup device |
| US7745779B2 (en) | 2008-02-08 | 2010-06-29 | Aptina Imaging Corporation | Color pixel arrays having common color filters for multiple adjacent pixels for use in CMOS imagers |
| US8134115B2 (en) * | 2009-06-23 | 2012-03-13 | Nokia Corporation | Color filters for sub-diffraction limit-sized light sensors |
| DE102009049387B4 (en) * | 2009-10-14 | 2016-05-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus, image processing apparatus and method for optical imaging |
| WO2011136031A1 (en) | 2010-04-28 | 2011-11-03 | 富士フイルム株式会社 | Imaging device |
| KR101777351B1 (en) * | 2011-05-16 | 2017-09-11 | 삼성전자주식회사 | Image pickup device, digital photographing apparatus using the device, auto-focusing method, and computer-readable storage medium for performing the method |
| JP2013066140A (en) * | 2011-08-31 | 2013-04-11 | Sony Corp | Imaging device, signal processing method, and program |
| CN102510450A (en) * | 2011-10-17 | 2012-06-20 | 北京瑞澜联合通信技术有限公司 | Image sensor, pick-up device and image data generation method |
| TWI504251B (en) * | 2012-07-04 | 2015-10-11 | Vivotek Inc | An audio hint method of the focusing |
| JP6010465B2 (en) * | 2013-01-11 | 2016-10-19 | 富士フイルム株式会社 | Solid-state imaging device |
| JP6271842B2 (en) * | 2013-02-18 | 2018-01-31 | キヤノン株式会社 | Ranging device, ranging method, and imaging device |
| CN105144699B (en) * | 2013-03-15 | 2019-03-15 | 拉姆伯斯公司 | The imaging sensor and its operating method of the resetting of having ready conditions of threshold monitor |
| JP6220148B2 (en) | 2013-04-26 | 2017-10-25 | キヤノン株式会社 | Imaging apparatus and control method thereof |
| CN105308747B (en) | 2013-06-11 | 2018-07-17 | 拉姆伯斯公司 | Separated grid is had ready conditions the imaging sensor of resetting |
| CN103531603B (en) * | 2013-10-30 | 2018-10-16 | 上海集成电路研发中心有限公司 | A kind of cmos image sensor |
| CN105765962B (en) * | 2013-12-05 | 2019-03-01 | 奥林巴斯株式会社 | Photographic device |
| CN103686103B (en) * | 2013-12-31 | 2018-01-26 | 上海集成电路研发中心有限公司 | With imaging sensor, the pixel cell merged with schizotype |
| JP6338436B2 (en) * | 2014-04-25 | 2018-06-06 | キヤノン株式会社 | Imaging apparatus and control method thereof |
| CN104064577A (en) * | 2014-07-16 | 2014-09-24 | 上海集成电路研发中心有限公司 | Image sensor achieving automatic focusing |
| JP6369233B2 (en) * | 2014-09-01 | 2018-08-08 | ソニー株式会社 | Solid-state imaging device, signal processing method thereof, and electronic device |
| CN104241310B (en) * | 2014-09-23 | 2017-11-07 | 上海集成电路研发中心有限公司 | A kind of CMOS image pixel array with double micro lens layer |
| KR102390836B1 (en) * | 2015-10-05 | 2022-04-26 | 삼성전자주식회사 | Electronic device and method for generating an image data |
| CN105611122B (en) * | 2015-12-18 | 2019-03-01 | Oppo广东移动通信有限公司 | Imaging sensor and output method, phase focusing method, imaging device and terminal |
-
2015
- 2015-12-18 CN CN201510963242.5A patent/CN105611122B/en active Active
-
2016
- 2016-10-10 JP JP2017541007A patent/JP2018509061A/en active Pending
- 2016-10-10 SG SG11201706245YA patent/SG11201706245YA/en unknown
- 2016-10-10 WO PCT/CN2016/101704 patent/WO2017101572A1/en active Application Filing
- 2016-10-10 MY MYPI2017702798A patent/MY184812A/en unknown
- 2016-10-10 KR KR1020177026269A patent/KR102038680B1/en active IP Right Grant
- 2016-10-10 EP EP16874631.1A patent/EP3236647A4/en not_active Ceased
- 2016-10-10 AU AU2016370348A patent/AU2016370348B2/en active Active
- 2016-12-15 TW TW106142226A patent/TWI662842B/en active
- 2016-12-15 TW TW105141603A patent/TWI612811B/en active
-
2017
- 2017-06-26 US US15/632,697 patent/US10880501B2/en active Active
- 2017-09-13 ZA ZA2017/06228A patent/ZA201706228B/en unknown
-
2019
- 2019-06-09 US US16/435,555 patent/US10764522B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105611122B (en) | 2019-03-01 |
| ZA201706228B (en) | 2019-01-30 |
| EP3236647A4 (en) | 2018-01-10 |
| TW201724842A (en) | 2017-07-01 |
| AU2016370348B2 (en) | 2018-06-28 |
| US20190297288A1 (en) | 2019-09-26 |
| MY184812A (en) | 2021-04-23 |
| US10764522B2 (en) | 2020-09-01 |
| CN105611122A (en) | 2016-05-25 |
| US20170295332A1 (en) | 2017-10-12 |
| EP3236647A1 (en) | 2017-10-25 |
| JP2018509061A (en) | 2018-03-29 |
| AU2016370348A1 (en) | 2017-08-10 |
| TWI662842B (en) | 2019-06-11 |
| TWI612811B (en) | 2018-01-21 |
| US10880501B2 (en) | 2020-12-29 |
| TW201818716A (en) | 2018-05-16 |
| WO2017101572A1 (en) | 2017-06-22 |
| KR20170120134A (en) | 2017-10-30 |
| KR102038680B1 (en) | 2019-10-30 |
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