SG11201705392XA - Adaptive groove focusing and leveling device and method - Google Patents

Adaptive groove focusing and leveling device and method

Info

Publication number
SG11201705392XA
SG11201705392XA SG11201705392XA SG11201705392XA SG11201705392XA SG 11201705392X A SG11201705392X A SG 11201705392XA SG 11201705392X A SG11201705392X A SG 11201705392XA SG 11201705392X A SG11201705392X A SG 11201705392XA SG 11201705392X A SG11201705392X A SG 11201705392XA
Authority
SG
Singapore
Prior art keywords
leveling device
adaptive groove
groove focusing
focusing
adaptive
Prior art date
Application number
SG11201705392XA
Inventor
Jingchao Qi
Feibiao Chen
Original Assignee
Shanghai Micro Electronics Equipment (Group) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment (Group) Co Ltd filed Critical Shanghai Micro Electronics Equipment (Group) Co Ltd
Publication of SG11201705392XA publication Critical patent/SG11201705392XA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
SG11201705392XA 2014-12-31 2015-12-27 Adaptive groove focusing and leveling device and method SG11201705392XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410851525.6A CN105807570B (en) 2014-12-31 2014-12-31 The focusing leveling device and its method of adaptive groove
PCT/CN2015/099085 WO2016107508A1 (en) 2014-12-31 2015-12-27 Adaptive groove focusing and leveling device and method

Publications (1)

Publication Number Publication Date
SG11201705392XA true SG11201705392XA (en) 2017-08-30

Family

ID=56284263

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201705392XA SG11201705392XA (en) 2014-12-31 2015-12-27 Adaptive groove focusing and leveling device and method

Country Status (7)

Country Link
US (1) US10274840B2 (en)
JP (1) JP6457646B2 (en)
KR (1) KR101985338B1 (en)
CN (1) CN105807570B (en)
SG (1) SG11201705392XA (en)
TW (1) TWI567365B (en)
WO (1) WO2016107508A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108931188A (en) * 2018-09-10 2018-12-04 苏州亿拓光电科技有限公司 Optical position detection device and method
CN109443210A (en) * 2018-12-13 2019-03-08 苏州亿拓光电科技有限公司 Optical position detection device and method
CN113311665B (en) * 2020-02-27 2023-04-07 上海微电子装备（集团）股份有限公司 Positioning system, positioning method and interferometer verification method
US11104849B1 (en) * 2020-08-19 2021-08-31 Richard Fauconier Method for restricting laser beams entering an aperture to a chosen dyad and measuring the beams' separation
CN114509923B (en) * 2022-01-28 2023-11-24 复旦大学 Focusing and leveling device in deep ultraviolet objective lens design and application thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58113706A (en) 1981-12-26 1983-07-06 Nippon Kogaku Kk <Nikon> Detector for horizontal position
NL9100410A (en) 1991-03-07 1992-10-01 Asm Lithography Bv IMAGE DEVICE EQUIPPED WITH A FOCUS ERROR AND / OR TILT DETECTION DEVICE.
JP3372728B2 (en) 1995-10-18 2003-02-04 キヤノン株式会社 Surface position detection device
JPH104055A (en) * 1996-06-13 1998-01-06 Canon Inc Automatic focusing device and manufacture of device using it
JP4174324B2 (en) * 2003-01-06 2008-10-29 キヤノン株式会社 Exposure method and apparatus
US6975407B1 (en) * 2004-05-19 2005-12-13 Taiwan Semiconductor Manufacturing Co, Ltd. Method of wafer height mapping
JP2006113198A (en) 2004-10-13 2006-04-27 Olympus Corp Focus detecting apparatus
KR101332035B1 (en) * 2004-12-22 2013-11-22 가부시키가이샤 니콘 Method for measuring position of mask surface in height direction, exposure apparatus and exposure method
US8068211B2 (en) 2007-07-06 2011-11-29 Canon Kabushiki Kaisha Exposure apparatus and method for manufacturing device
CN101344727B (en) * 2008-06-26 2011-09-28 上海微电子装备有限公司 Focusing and leveling detection device and method
CN101872128A (en) * 2009-04-22 2010-10-27 瑞鼎科技股份有限公司 Nano-photoetching system and nano-photoetching method
CN102207694A (en) 2010-03-31 2011-10-05 上海微电子装备有限公司 Imaging adjustment unit and focusing and leveling control system using the unit
CN102455600B (en) * 2010-10-18 2014-07-23 中芯国际集成电路制造(上海)有限公司 Wafer surface morphology detection method
CN102087483B (en) * 2010-12-27 2013-04-03 中国科学院光电技术研究所 Optical system for focal plane detection in projection lithography
CN102566295A (en) * 2010-12-31 2012-07-11 上海微电子装备有限公司 Lithography device and method for measuring multi-light spot zero offset
JP2014513869A (en) * 2011-04-22 2014-06-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． Lithographic system for processing a target such as a wafer, and method of operating a lithography system for processing a target such as a wafer

Also Published As

Publication number Publication date
TWI567365B (en) 2017-01-21
CN105807570A (en) 2016-07-27
WO2016107508A1 (en) 2016-07-07
JP6457646B2 (en) 2019-01-23
US10274840B2 (en) 2019-04-30
TW201623915A (en) 2016-07-01
CN105807570B (en) 2018-03-02
US20170351185A1 (en) 2017-12-07
KR20170105025A (en) 2017-09-18
KR101985338B1 (en) 2019-06-03
JP2018502298A (en) 2018-01-25

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