SG11201704986RA - Semi-automatic prober - Google Patents
Semi-automatic proberInfo
- Publication number
- SG11201704986RA SG11201704986RA SG11201704986RA SG11201704986RA SG11201704986RA SG 11201704986R A SG11201704986R A SG 11201704986RA SG 11201704986R A SG11201704986R A SG 11201704986RA SG 11201704986R A SG11201704986R A SG 11201704986RA SG 11201704986R A SG11201704986R A SG 11201704986RA
- Authority
- SG
- Singapore
- Prior art keywords
- semi
- automatic prober
- prober
- automatic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462096693P | 2014-12-24 | 2014-12-24 | |
PCT/US2015/067304 WO2016106293A2 (en) | 2014-12-24 | 2015-12-22 | Semi-automatic prober |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201704986RA true SG11201704986RA (en) | 2017-07-28 |
Family
ID=55358100
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201704986RA SG11201704986RA (en) | 2014-12-24 | 2015-12-22 | Semi-automatic prober |
SG10201807897WA SG10201807897WA (en) | 2014-12-24 | 2015-12-22 | Semi-automatic prober |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201807897WA SG10201807897WA (en) | 2014-12-24 | 2015-12-22 | Semi-automatic prober |
Country Status (8)
Country | Link |
---|---|
US (2) | US11175309B2 (en) |
EP (1) | EP3237917B1 (en) |
JP (1) | JP6784677B2 (en) |
KR (1) | KR102481699B1 (en) |
CN (1) | CN107003337B (en) |
SG (2) | SG11201704986RA (en) |
TW (1) | TWI614506B (en) |
WO (1) | WO2016106293A2 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7220148B2 (en) * | 2016-12-20 | 2023-02-09 | クウォリタウ・インコーポレーテッド | Universal probing assembly with 5 degrees of freedom |
US11454664B2 (en) * | 2017-06-21 | 2022-09-27 | Tokyo Electron Limited | Testing system |
KR102033560B1 (en) * | 2018-11-26 | 2019-10-17 | (주)케미텍 | A Test Device Of Semi-Conductor |
CN109633220B (en) * | 2019-01-29 | 2021-08-24 | 江阴佳泰电子科技有限公司 | Pre-blowing and washing type wafer probe station |
EP3800477A1 (en) * | 2019-10-04 | 2021-04-07 | Afore Oy | Testing device and method for electrically testing an integrated circuit |
TWI765312B (en) * | 2019-11-04 | 2022-05-21 | 旺矽科技股份有限公司 | Edge sensor and probing method using the same |
EP4060720A4 (en) * | 2019-11-15 | 2023-08-16 | Kioxia Corporation | Storage device and storage system |
US20210172978A1 (en) * | 2019-12-09 | 2021-06-10 | Formfactor Beaverton, Inc. | Customizable probe cards, probe systems including the same, and related methods |
US10996239B1 (en) * | 2020-05-12 | 2021-05-04 | Mpi Corporation | Method of positioning probe tips relative to pads |
US11493551B2 (en) * | 2020-06-22 | 2022-11-08 | Advantest Test Solutions, Inc. | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11808812B2 (en) | 2020-11-02 | 2023-11-07 | Advantest Test Solutions, Inc. | Passive carrier-based device delivery for slot-based high-volume semiconductor test system |
US11821913B2 (en) | 2020-11-02 | 2023-11-21 | Advantest Test Solutions, Inc. | Shielded socket and carrier for high-volume test of semiconductor devices |
TWI800084B (en) * | 2020-11-13 | 2023-04-21 | 旺矽科技股份有限公司 | Semiconductor inspecting method for confirming whether probes are in contact with contact pads |
US20220155364A1 (en) | 2020-11-19 | 2022-05-19 | Advantest Test Solutions, Inc. | Wafer scale active thermal interposer for device testing |
US11567119B2 (en) | 2020-12-04 | 2023-01-31 | Advantest Test Solutions, Inc. | Testing system including active thermal interposer device |
US11573262B2 (en) | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11587640B2 (en) | 2021-03-08 | 2023-02-21 | Advantest Test Solutions, Inc. | Carrier based high volume system level testing of devices with pop structures |
US11656273B1 (en) | 2021-11-05 | 2023-05-23 | Advantest Test Solutions, Inc. | High current device testing apparatus and systems |
TWI803103B (en) * | 2021-12-16 | 2023-05-21 | 南亞科技股份有限公司 | Testing method |
US11835549B2 (en) | 2022-01-26 | 2023-12-05 | Advantest Test Solutions, Inc. | Thermal array with gimbal features and enhanced thermal performance |
US11940486B2 (en) * | 2022-06-01 | 2024-03-26 | Nanya Technology Corporation | Probe station capable of maintaining stable and accurate contact to device under test |
KR20230173448A (en) * | 2022-06-17 | 2023-12-27 | 주식회사 쎄믹스 | System for inspecting multiple wafers |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3874916A (en) * | 1972-06-23 | 1975-04-01 | Radiant Energy Systems | Mask alignment system for electron beam pattern generator |
JPH03273663A (en) | 1990-03-23 | 1991-12-04 | Canon Inc | Substrate holder |
WO1999004273A1 (en) * | 1997-07-15 | 1999-01-28 | Wentworth Laboratories, Inc. | Probe station with multiple adjustable probe supports |
US6114869A (en) | 1998-05-21 | 2000-09-05 | Cerprobe Corporation | Method and apparatus for interfacing between automatic wafer probe machines, automatic testers, and probe cards |
JP2000040728A (en) * | 1998-07-22 | 2000-02-08 | Nippon Asm Kk | Wafer carrying mechanism |
JP2000158337A (en) | 1998-11-27 | 2000-06-13 | Speedfam-Ipec Co Ltd | Wafer chuck mechanism in end surface polishing device |
US20020097062A1 (en) * | 2000-10-30 | 2002-07-25 | Strom John Timothy | Method and process of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing analysis, and manufacture |
US20030035711A1 (en) * | 2001-07-14 | 2003-02-20 | Ulysses Gilchrist | Centering double side edge grip end effector with integrated mapping sensor |
JP4548817B2 (en) | 2002-10-18 | 2010-09-22 | 東京エレクトロン株式会社 | Probe device |
US7221172B2 (en) | 2003-05-06 | 2007-05-22 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
US7300082B2 (en) * | 2003-07-21 | 2007-11-27 | Asyst Technologies, Inc. | Active edge gripping and effector |
US7126361B1 (en) * | 2005-08-03 | 2006-10-24 | Qualitau, Inc. | Vertical probe card and air cooled probe head system |
CN100362620C (en) * | 2005-08-11 | 2008-01-16 | 中微半导体设备(上海)有限公司 | Loading umloading device of semiconductor processing piece and its loading and unloading method |
KR100674440B1 (en) * | 2005-08-12 | 2007-01-25 | 주식회사 파이컴 | Probe card manufacture method and device |
TWI273243B (en) | 2005-08-16 | 2007-02-11 | Chipmos Technologies Inc | Replaceable modular probe head |
US8278951B2 (en) | 2006-11-17 | 2012-10-02 | Cascade Microtech, Inc. | Probe station for testing semiconductor substrates and comprising EMI shielding |
JP5450391B2 (en) * | 2007-05-15 | 2014-03-26 | ロナルド・シー・シューバート | Wafer probe test and inspection system |
JP5535492B2 (en) * | 2009-02-12 | 2014-07-02 | ラピスセミコンダクタ株式会社 | Semiconductor integrated circuit inspection apparatus and semiconductor integrated circuit inspection method |
KR20120104812A (en) | 2011-03-14 | 2012-09-24 | 삼성전자주식회사 | Semiconductor wafer testing system and method |
JP2012204695A (en) | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | Probe card detection device, positioning device for wafer, and positioning method for wafer |
JP6031238B2 (en) | 2012-03-09 | 2016-11-24 | 東京エレクトロン株式会社 | Wafer inspection interface and wafer inspection apparatus |
CN202770936U (en) | 2012-06-05 | 2013-03-06 | 武汉新芯集成电路制造有限公司 | Wafer acceptance test device |
JP6013250B2 (en) * | 2013-03-27 | 2016-10-25 | 東京エレクトロン株式会社 | Probe device |
-
2015
- 2015-12-21 US US14/976,810 patent/US11175309B2/en active Active
- 2015-12-22 WO PCT/US2015/067304 patent/WO2016106293A2/en active Application Filing
- 2015-12-22 JP JP2017532822A patent/JP6784677B2/en active Active
- 2015-12-22 SG SG11201704986RA patent/SG11201704986RA/en unknown
- 2015-12-22 CN CN201580070723.1A patent/CN107003337B/en active Active
- 2015-12-22 EP EP15834701.3A patent/EP3237917B1/en active Active
- 2015-12-22 KR KR1020177018937A patent/KR102481699B1/en active IP Right Grant
- 2015-12-22 SG SG10201807897WA patent/SG10201807897WA/en unknown
- 2015-12-23 TW TW104143372A patent/TWI614506B/en active
-
2021
- 2021-09-01 US US17/464,307 patent/US20210396785A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2018503256A (en) | 2018-02-01 |
WO2016106293A3 (en) | 2016-09-15 |
EP3237917A2 (en) | 2017-11-01 |
TWI614506B (en) | 2018-02-11 |
KR102481699B1 (en) | 2022-12-26 |
US20160187377A1 (en) | 2016-06-30 |
CN107003337B (en) | 2022-05-17 |
WO2016106293A2 (en) | 2016-06-30 |
KR20170100553A (en) | 2017-09-04 |
TW201636618A (en) | 2016-10-16 |
US20210396785A1 (en) | 2021-12-23 |
EP3237917B1 (en) | 2021-03-17 |
SG10201807897WA (en) | 2018-10-30 |
CN107003337A (en) | 2017-08-01 |
JP6784677B2 (en) | 2020-11-11 |
US11175309B2 (en) | 2021-11-16 |
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