SG11201700904UA - Gcib nozzle assembly - Google Patents
Gcib nozzle assemblyInfo
- Publication number
- SG11201700904UA SG11201700904UA SG11201700904UA SG11201700904UA SG11201700904UA SG 11201700904U A SG11201700904U A SG 11201700904UA SG 11201700904U A SG11201700904U A SG 11201700904UA SG 11201700904U A SG11201700904U A SG 11201700904UA SG 11201700904U A SG11201700904U A SG 11201700904UA
- Authority
- SG
- Singapore
- Prior art keywords
- gcib
- nozzle assembly
- nozzle
- assembly
- gcib nozzle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/061—Construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0812—Ionized cluster beam [ICB] sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0822—Multiple sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
- H01J2237/3151—Etching
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462033253P | 2014-08-05 | 2014-08-05 | |
| PCT/US2015/043203 WO2016022427A2 (en) | 2014-08-05 | 2015-07-31 | Gcib nozzle assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201700904UA true SG11201700904UA (en) | 2017-03-30 |
Family
ID=55264745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201700904UA SG11201700904UA (en) | 2014-08-05 | 2015-07-31 | Gcib nozzle assembly |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9343259B2 (en) |
| EP (1) | EP3178105B1 (en) |
| JP (2) | JP6406734B2 (en) |
| KR (1) | KR102467978B1 (en) |
| CN (1) | CN106688075B (en) |
| SG (1) | SG11201700904UA (en) |
| TW (1) | TWI588861B (en) |
| WO (1) | WO2016022427A2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107146752A (en) * | 2017-06-26 | 2017-09-08 | 武汉大学 | A kind of method and device of visualizing gas cluster ions jet |
| CN107393794B (en) * | 2017-08-07 | 2019-09-10 | 深圳江海行纳米科技有限公司 | A kind of gas-cluster ion sources production method and device |
| CN113639955B (en) * | 2021-10-15 | 2022-01-04 | 中国空气动力研究与发展中心计算空气动力研究所 | Device for measuring concave panel boundary layer disturbance |
| US20240096592A1 (en) * | 2022-09-15 | 2024-03-21 | Applied Materials Israel Ltd. | Optimized saddle nozzle design for gas injection system |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09119915A (en) * | 1996-11-01 | 1997-05-06 | Hitachi Ltd | Ionization and mass spectrometry apparatus for sample |
| US6613240B2 (en) * | 1999-12-06 | 2003-09-02 | Epion Corporation | Method and apparatus for smoothing thin conductive films by gas cluster ion beam |
| JP3398352B2 (en) * | 2000-01-20 | 2003-04-21 | 株式会社つくばナノ・テクノロジー | Cluster ion beam generator |
| US7670964B2 (en) * | 2007-03-22 | 2010-03-02 | Tokyo Electron Limited | Apparatus and methods of forming a gas cluster ion beam using a low-pressure source |
| US8981322B2 (en) * | 2009-02-04 | 2015-03-17 | Tel Epion Inc. | Multiple nozzle gas cluster ion beam system |
| US8097860B2 (en) * | 2009-02-04 | 2012-01-17 | Tel Epion Inc. | Multiple nozzle gas cluster ion beam processing system and method of operating |
| US20100243913A1 (en) * | 2009-03-31 | 2010-09-30 | Tel Epion Inc. | Pre-aligned nozzle/skimmer |
| TWI416577B (en) * | 2009-04-23 | 2013-11-21 | Tel Epion Inc | Method of irradiating substrate with gas cluster ion beam formed from multiple gas nozzles |
| US8217372B2 (en) * | 2009-06-30 | 2012-07-10 | Exogenesis Corporation | Gas-cluster-jet generator and gas-cluster ion-beam apparatus utilizing an improved gas-cluster-jet generator |
| US20110240602A1 (en) * | 2010-03-30 | 2011-10-06 | Tel Epion Inc. | High-voltage gas cluster ion beam (gcib) processing system |
| JP5236687B2 (en) * | 2010-05-26 | 2013-07-17 | 兵庫県 | Surface treatment method and surface treatment apparatus |
| WO2012027330A1 (en) * | 2010-08-23 | 2012-03-01 | Exogenesis Corporation | Method and apparatus for neutral beam processing based on gas cluster ion beam technology |
| US20130082189A1 (en) * | 2011-09-30 | 2013-04-04 | Tel Epion Inc. | Pre-aligned multi-beam nozzle/skimmer module |
| JP6108975B2 (en) * | 2013-06-18 | 2017-04-05 | 株式会社アルバック | Gas cluster ion beam system |
| US8993982B2 (en) * | 2013-07-15 | 2015-03-31 | Vg Systems Limited | Switchable ion gun with improved gas inlet arrangement |
-
2015
- 2015-07-31 KR KR1020177006097A patent/KR102467978B1/en active IP Right Grant
- 2015-07-31 WO PCT/US2015/043203 patent/WO2016022427A2/en active Application Filing
- 2015-07-31 SG SG11201700904UA patent/SG11201700904UA/en unknown
- 2015-07-31 US US14/815,265 patent/US9343259B2/en active Active
- 2015-07-31 EP EP15829520.4A patent/EP3178105B1/en active Active
- 2015-07-31 JP JP2017506398A patent/JP6406734B2/en active Active
- 2015-07-31 CN CN201580049124.1A patent/CN106688075B/en active Active
- 2015-08-05 TW TW104125321A patent/TWI588861B/en active
-
2018
- 2018-09-13 JP JP2018171628A patent/JP6625707B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106688075B (en) | 2018-08-24 |
| JP2017527075A (en) | 2017-09-14 |
| JP6625707B2 (en) | 2019-12-25 |
| EP3178105B1 (en) | 2019-09-25 |
| CN106688075A (en) | 2017-05-17 |
| US20160042909A1 (en) | 2016-02-11 |
| KR20170041806A (en) | 2017-04-17 |
| KR102467978B1 (en) | 2022-11-16 |
| WO2016022427A3 (en) | 2016-03-31 |
| WO2016022427A2 (en) | 2016-02-11 |
| JP2019050203A (en) | 2019-03-28 |
| EP3178105A2 (en) | 2017-06-14 |
| TW201624519A (en) | 2016-07-01 |
| US9343259B2 (en) | 2016-05-17 |
| TWI588861B (en) | 2017-06-21 |
| JP6406734B2 (en) | 2018-10-17 |
| EP3178105A4 (en) | 2018-04-25 |
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