SG11201700008WA - Light emitter and light detector modules including vertical alignment features - Google Patents

Light emitter and light detector modules including vertical alignment features

Info

Publication number
SG11201700008WA
SG11201700008WA SG11201700008WA SG11201700008WA SG11201700008WA SG 11201700008W A SG11201700008W A SG 11201700008WA SG 11201700008W A SG11201700008W A SG 11201700008WA SG 11201700008W A SG11201700008W A SG 11201700008WA SG 11201700008W A SG11201700008W A SG 11201700008WA
Authority
SG
Singapore
Prior art keywords
vertical alignment
alignment features
modules including
including vertical
detector modules
Prior art date
Application number
SG11201700008WA
Inventor
Peter Riel
Markus Rossi
Daniel Pérez Calero
Matthias Gloor
Moshe Doron
Dmitry Bakin
Philippe Bouchilloux
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201700008WA publication Critical patent/SG11201700008WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/142—Adjusting of projection optics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2033—LED or laser light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
  • Lens Barrels (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
SG11201700008WA 2014-07-23 2015-07-22 Light emitter and light detector modules including vertical alignment features SG11201700008WA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462028167P 2014-07-23 2014-07-23
US201462044594P 2014-09-02 2014-09-02
US201562150473P 2015-04-21 2015-04-21
PCT/SG2015/050225 WO2016013978A1 (en) 2014-07-23 2015-07-22 Light emitter and light detector modules including vertical alignment features

Publications (1)

Publication Number Publication Date
SG11201700008WA true SG11201700008WA (en) 2017-02-27

Family

ID=55163394

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700008WA SG11201700008WA (en) 2014-07-23 2015-07-22 Light emitter and light detector modules including vertical alignment features

Country Status (8)

Country Link
US (2) US9768361B2 (en)
EP (1) EP3172608B1 (en)
JP (2) JP6760920B2 (en)
KR (2) KR102282827B1 (en)
CN (1) CN106537212B (en)
SG (1) SG11201700008WA (en)
TW (2) TWI735232B (en)
WO (1) WO2016013978A1 (en)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9608142B2 (en) 2015-02-27 2017-03-28 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules with optics integrated into a cap
WO2016163953A1 (en) 2015-04-06 2016-10-13 Heptagon Micro Optics Pte. Ltd. Small footprint auto focus camera module
US10475830B2 (en) 2015-08-06 2019-11-12 Ams Sensors Singapore Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
US20170047362A1 (en) 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
US10187560B2 (en) 2015-10-15 2019-01-22 Omnivision Technologies, Inc. Notched-spacer camera module and method for fabricating same
WO2017123151A1 (en) * 2016-01-11 2017-07-20 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having features for improved alignment and reduced tilt
US10157943B2 (en) * 2016-01-22 2018-12-18 Omnivision Technologies, Inc. Trenched-bonding-dam device and manufacturing method for same
US9971235B2 (en) * 2016-01-29 2018-05-15 Seiko Epson Corporation Light source device, projector, and method of manufacturing light source device
CN107195751B (en) * 2016-03-14 2020-01-14 光宝光电(常州)有限公司 Light emitting diode packaging structure
US11020624B2 (en) 2016-04-19 2021-06-01 KFT Fire Trainer, LLC Fire simulator
US10718922B2 (en) 2016-06-01 2020-07-21 Ams Sensors Singapore Pte. Ltd. Optoelectronic module including lens barrel comprising flanges and adhesive thereon and resting directly on a cover glass
US10088140B2 (en) * 2016-06-07 2018-10-02 Heptagon Micro Optics Pte. Ltd. Eye-safe optoelectronic module
US10551596B2 (en) 2016-06-29 2020-02-04 Ams Sensors Singapore Pte. Ltd. Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same
FR3053760B1 (en) 2016-07-05 2020-07-17 Valeo Vision LIGHT SOURCE AND CORRESPONDING LIGHT MODULE FOR A MOTOR VEHICLE
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
DE102016014834B3 (en) * 2016-12-14 2018-04-19 Innolite Gmbh Method for ultra-precise centering of a transmissive or reflective optic, in particular a lens with an aspherical or free-form front lens surface
KR102588807B1 (en) * 2016-12-15 2023-10-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Semiconductor device package, method for manufacturing semiconductor device package, and auto focusing apparatus
FR3060851B1 (en) * 2016-12-20 2018-12-07 3D Plus OPTOELECTRONIC 3D IMAGING MODULE
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US20190031930A1 (en) * 2017-07-28 2019-01-31 Ledvance Llc Systems and methods for curing an ultraviolet adhesive within a container
CN109510925A (en) * 2017-09-15 2019-03-22 南昌欧菲光电技术有限公司 Camera module
JP6897830B2 (en) * 2017-11-30 2021-07-07 日亜化学工業株式会社 Light emitting device
JP6687008B2 (en) * 2017-11-30 2020-04-22 日亜化学工業株式会社 Light emitting device
CN108319035B (en) * 2018-03-23 2021-01-12 昆山丘钛微电子科技有限公司 Optical projection module and control method thereof
CN108627936B (en) 2018-04-10 2020-02-21 Oppo广东移动通信有限公司 Laser projection structure and electronic device
KR102649319B1 (en) * 2018-06-15 2024-03-20 엘지이노텍 주식회사 Printed circuit board and camera device including the same
US20210267043A1 (en) * 2018-06-15 2021-08-26 Lg Innotek Co., Ltd. Printed circuit board and camera device comprising same
KR102578173B1 (en) * 2018-06-26 2023-09-13 엘지이노텍 주식회사 Printed circuit board and camera device including the same
US11152758B2 (en) * 2018-09-06 2021-10-19 Nichia Corporation Light emitting device
DE102018126297A1 (en) * 2018-10-23 2020-04-23 HELLA GmbH & Co. KGaA Lighting device for vehicles
WO2020105162A1 (en) * 2018-11-22 2020-05-28 三菱電機株式会社 Sensor module
US11201992B2 (en) 2018-12-21 2021-12-14 Waymo Llc Sensor clamping design for autonomous vehicle camera
CN111463652A (en) * 2019-01-22 2020-07-28 隆达电子股份有限公司 Light emitting device
US20220181369A1 (en) * 2019-03-08 2022-06-09 Dexerials Corporation Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structure
EP3796063B1 (en) * 2019-09-17 2022-10-26 Axis AB Lens member for a lens arrangement of a camera device
JP7460880B2 (en) 2019-10-31 2024-04-03 日亜化学工業株式会社 Light-emitting device
JPWO2021171865A1 (en) * 2020-02-26 2021-09-02
KR102362936B1 (en) * 2020-03-20 2022-02-14 김진형 Optical Sensor for Long-Distance Measuring Instrument Focus-Aligned by Zig, Long-Distance Measuring Instrument having the Same and Method of Fabricating the Same
JP7060830B2 (en) * 2020-03-23 2022-04-27 日亜化学工業株式会社 Light emitting device
US11843221B2 (en) * 2020-03-30 2023-12-12 Namuga, Co., Ltd. Light source module for emitting high density beam and method for controlling the same
FR3118294A1 (en) * 2020-12-18 2022-06-24 Stmicroelectronics (Grenoble 2) Sas Optoelectronic device
WO2024023225A1 (en) * 2022-07-28 2024-02-01 Ams International Ag Sensor device, optoelectronic device and method for fabricating a sensor device

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0824353B2 (en) * 1984-03-31 1996-03-06 ソニー株式会社 Positioning method for solid-state imaging device
JPH05259482A (en) * 1992-03-13 1993-10-08 Fujitsu Ltd Package for optical semiconductor device
DE19508222C1 (en) * 1995-03-08 1996-06-05 Siemens Ag Opto-electronic converter
US6909554B2 (en) * 2000-12-27 2005-06-21 Finisar Corporation Wafer integration of micro-optics
FR2824955B1 (en) 2001-05-18 2004-07-09 St Microelectronics Sa SHIELDED OPTICAL SEMICONDUCTOR PACKAGE
US6838689B1 (en) * 2002-02-14 2005-01-04 Finisar Corporation Backside alignment and packaging of opto-electronic devices
JP2004029679A (en) 2002-06-28 2004-01-29 Toshiba Corp Optical module device, method of manufacturing the same, and projection tv system
JP4110988B2 (en) * 2003-02-03 2008-07-02 コニカミノルタホールディングス株式会社 Imaging device and portable terminal
US6912090B2 (en) * 2003-03-18 2005-06-28 Lucent Technologies Inc. Adjustable compound microlens apparatus with MEMS controller
JP2004325826A (en) * 2003-04-25 2004-11-18 Fuji Photo Film Co Ltd Fixing method and fixed structure of optical member
TWI231606B (en) * 2003-11-10 2005-04-21 Shih-Hsien Tseng Image pickup device and a manufacturing method thereof
JP4091936B2 (en) * 2004-01-14 2008-05-28 松下電器産業株式会社 Optical device, manufacturing method thereof, cap part and manufacturing method thereof
US7223619B2 (en) * 2004-03-05 2007-05-29 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. VCSEL with integrated lens
JP2005292242A (en) * 2004-03-31 2005-10-20 Matsushita Electric Ind Co Ltd Imaging apparatus and method for manufacturing the same
US20070148807A1 (en) * 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7308167B2 (en) 2004-09-01 2007-12-11 Agilent Technologies, Inc. Optical assembly with optoelectronic device alignment
JP4428526B2 (en) * 2004-10-15 2010-03-10 パナソニック株式会社 Optical device
TWI336022B (en) 2004-10-29 2011-01-11 Altus Technology Inc Digital still camera lens module
JP2006148710A (en) 2004-11-22 2006-06-08 Sharp Corp Imaging module and method of manufacturing the same
JP2006228837A (en) * 2005-02-15 2006-08-31 Sharp Corp Semiconductor device and its manufacturing method
JP4754924B2 (en) 2005-10-07 2011-08-24 株式会社ブイ・テクノロジー Exposure equipment
JP4805705B2 (en) * 2006-03-23 2011-11-02 アルプス電気株式会社 The camera module
US7960819B2 (en) 2006-07-13 2011-06-14 Cree, Inc. Leadframe-based packages for solid state emitting devices
KR20080064335A (en) 2007-01-04 2008-07-09 엘지전자 주식회사 Photo lithography mask, exposure method using the same and manufacturing method of substrate for display device
JP2008197282A (en) * 2007-02-09 2008-08-28 Sharp Corp Plastic lens unit, camera module and method for manufacturing them
JP2008225007A (en) 2007-03-12 2008-09-25 Harison Toshiba Lighting Corp Lighting device
CN101334510A (en) * 2007-06-27 2008-12-31 鸿富锦精密工业（深圳）有限公司 Lens module group and its assembling method
WO2009079567A2 (en) * 2007-12-17 2009-06-25 Newport Corporation Laser emitter modules and methods of assembly
US8029157B2 (en) * 2007-12-21 2011-10-04 William Li Light refraction illumination device
JP5532929B2 (en) * 2008-02-08 2014-06-25 日立化成株式会社 Optical wiring printed circuit board manufacturing method
US20100053407A1 (en) * 2008-02-26 2010-03-04 Tessera, Inc. Wafer level compliant packages for rear-face illuminated solid state image sensors
IT1391091B1 (en) * 2008-07-15 2011-11-18 Fraen Corp Srl LIGHTING DEVICE WITH ADJUSTABLE LIGHTING, IN PARTICULAR FOR AN ELECTRIC TORCH
JP2010040672A (en) * 2008-08-01 2010-02-18 Oki Semiconductor Co Ltd Semiconductor device, and fabrication method thereof
KR100956380B1 (en) * 2008-08-06 2010-05-07 삼성전기주식회사 Camera module and method for manufacturing the same
JP2010066742A (en) * 2008-08-14 2010-03-25 Pearl Lighting Co Ltd Projection unit
KR101264983B1 (en) * 2008-11-06 2013-05-15 시바우라 메카트로닉스 가부시끼가이샤 Bonding apparatus and bonding method
JP5324890B2 (en) * 2008-11-11 2013-10-23 ラピスセミコンダクタ株式会社 Camera module and manufacturing method thereof
GB2465607A (en) * 2008-11-25 2010-05-26 St Microelectronics CMOS imager structures
WO2010074743A1 (en) 2008-12-22 2010-07-01 Tessera North America, Inc. Focus compensation for thin cameras
US9001257B1 (en) * 2008-12-23 2015-04-07 DigitalOptics Corporation MEMS Wafer scale optics
KR20100099932A (en) * 2009-03-04 2010-09-15 삼성테크윈 주식회사 Print circuit board embedding image sensor and camera module comprising the same
WO2010111465A1 (en) * 2009-03-25 2010-09-30 Magna Electronics Inc. Vehicular camera and lens assembly
CN101853849A (en) * 2009-03-30 2010-10-06 朋程科技股份有限公司 Rectifier for use at high temperature
JP2010238995A (en) 2009-03-31 2010-10-21 Sanyo Electric Co Ltd Semiconductor module and camera module mounted with the same
JP5259482B2 (en) 2009-04-16 2013-08-07 西工業株式会社 SEALING DEVICE AND CONTINUOUS FILM EQUIPMENT PROVIDED WITH THIS SEALING DEVICE
JP2011009645A (en) * 2009-06-29 2011-01-13 Toshiba Corp Semiconductor device and method of manufacturing the same
US20110292271A1 (en) * 2010-05-27 2011-12-01 Tzy-Ying Lin Camera module and fabrication method thereof
JP5977745B2 (en) * 2010-08-17 2016-08-24 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． Method for manufacturing a plurality of optical devices for a camera
JP5221615B2 (en) * 2010-09-21 2013-06-26 株式会社東芝 Imaging device and manufacturing method thereof
US8308379B2 (en) * 2010-12-01 2012-11-13 Digitaloptics Corporation Three-pole tilt control system for camera module
JP5372986B2 (en) * 2011-03-11 2013-12-18 シャープ株式会社 Camera module and manufacturing method thereof
US8979316B2 (en) * 2011-05-11 2015-03-17 Dicon Fiberoptics Inc. Zoom spotlight using LED array
KR101890457B1 (en) * 2011-08-10 2018-08-21 헵타곤 마이크로 옵틱스 피티이. 리미티드 Opto-electronic module and method for manufacturing the same
KR101893996B1 (en) * 2011-08-22 2018-09-04 삼성전자주식회사 Light Emitting Device Package
JP5950147B2 (en) * 2011-09-20 2016-07-13 カシオ計算機株式会社 LIGHT SOURCE DEVICE, PROJECTOR, AND LIGHT SOURCE DEVICE MANUFACTURING METHOD
EP2850654B1 (en) 2012-05-17 2016-10-26 Heptagon Micro Optics Pte. Ltd. Assembly of wafer stacks
US8806743B2 (en) * 2012-08-07 2014-08-19 Excelitas Technologies Singapore Pte. Ltd Panelized process for SMT sensor devices
KR101997243B1 (en) * 2012-09-13 2019-07-08 엘지이노텍 주식회사 Light emtting device and lighting system
US9595553B2 (en) * 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
JP6103998B2 (en) * 2013-03-15 2017-03-29 スタンレー電気株式会社 Light emitting device
CN110061018B (en) * 2013-05-21 2023-11-28 弗托斯传感与算法公司 Monolithic integration of plenoptic lenses on photosensor substrates
CN109755859B (en) * 2013-06-19 2021-12-17 苹果公司 Integrated structured light projector

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