SG11201609799QA - Air cavity package - Google Patents

Air cavity package

Info

Publication number
SG11201609799QA
SG11201609799QA SG11201609799QA SG11201609799QA SG11201609799QA SG 11201609799Q A SG11201609799Q A SG 11201609799QA SG 11201609799Q A SG11201609799Q A SG 11201609799QA SG 11201609799Q A SG11201609799Q A SG 11201609799QA SG 11201609799Q A SG11201609799Q A SG 11201609799QA
Authority
SG
Singapore
Prior art keywords
air cavity
cavity package
package
air
cavity
Prior art date
Application number
SG11201609799QA
Inventor
Richard J Koba
Chee Kong Lee
Wei Chuan Goh
Joelle Ng
Original Assignee
Materion Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materion Corp filed Critical Materion Corp
Publication of SG11201609799QA publication Critical patent/SG11201609799QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3738—Semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
SG11201609799QA 2014-05-23 2015-05-22 Air cavity package SG11201609799QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462002336P 2014-05-23 2014-05-23
PCT/US2015/032124 WO2015179733A1 (en) 2014-05-23 2015-05-22 Air cavity package

Publications (1)

Publication Number Publication Date
SG11201609799QA true SG11201609799QA (en) 2016-12-29

Family

ID=54554818

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201609799QA SG11201609799QA (en) 2014-05-23 2015-05-22 Air cavity package

Country Status (7)

Country Link
US (1) US20170069560A1 (en)
EP (1) EP3146560A4 (en)
JP (1) JP2017518640A (en)
CN (1) CN106537579A (en)
PH (1) PH12016502321A1 (en)
SG (1) SG11201609799QA (en)
WO (1) WO2015179733A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6733968B2 (en) * 2015-08-31 2020-08-05 日立化成株式会社 Molecular method for assessing post-renal transplant complications
US11227806B2 (en) 2016-05-09 2022-01-18 Materion Corporation Air cavity package using high temperature silicone adhesive
US10163743B2 (en) 2016-05-20 2018-12-25 Materion Corporation Copper flanged air cavity packages for high frequency devices
US12074099B2 (en) 2021-05-07 2024-08-27 Materion Corporation Microelectronics package assemblies and processes for making

Family Cites Families (29)

* Cited by examiner, † Cited by third party
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JPH06252194A (en) * 1993-02-26 1994-09-09 Toshiba Corp Semiconductor device
JPH07307420A (en) * 1994-05-12 1995-11-21 Shinko Electric Ind Co Ltd Semiconductor device
JPH08115996A (en) * 1994-08-23 1996-05-07 Tokuyama Corp Semiconductor chip mounting package
JPH08113765A (en) * 1994-10-17 1996-05-07 Mitsui Toatsu Chem Inc Heat bonding composite tape
JPH0945839A (en) * 1995-08-03 1997-02-14 Shinko Electric Ind Co Ltd Package for semiconductor device use and semiconductor device
US6056186A (en) * 1996-06-25 2000-05-02 Brush Wellman Inc. Method for bonding a ceramic to a metal with a copper-containing shim
US6399178B1 (en) * 1998-07-20 2002-06-04 Amerasia International Technology, Inc. Rigid adhesive underfill preform, as for a flip-chip device
US6072211A (en) * 1998-08-03 2000-06-06 Motorola, Inc. Semiconductor package
WO2001099124A1 (en) * 2000-06-21 2001-12-27 Dai Nippon Printing Co., Ltd. Laminate and use thereof
US6472758B1 (en) * 2000-07-20 2002-10-29 Amkor Technology, Inc. Semiconductor package including stacked semiconductor dies and bond wires
US6511866B1 (en) * 2001-07-12 2003-01-28 Rjr Polymers, Inc. Use of diverse materials in air-cavity packaging of electronic devices
JP4178843B2 (en) * 2002-06-13 2008-11-12 ソニー株式会社 COOLING DEVICE, ELECTRONIC DEVICE DEVICE, AND COOLING DEVICE MANUFACTURING METHOD
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US7030472B2 (en) * 2004-04-01 2006-04-18 Agere Systems Inc. Integrated circuit device having flexible leadframe
JP2006128534A (en) * 2004-11-01 2006-05-18 Sumitomo Metal Electronics Devices Inc Package for storing high heat radiation type electronic component
US7282797B2 (en) * 2005-05-27 2007-10-16 Motorola, Inc. Graded liquid crystal polymer package
JP4604893B2 (en) * 2005-07-19 2011-01-05 住友電気工業株式会社 Composite porous resin substrate and method for producing the same
US20070029664A1 (en) * 2005-08-05 2007-02-08 Cree Microwave, Llc. Integrated circuit package and method of assembling the same
JP2007088190A (en) * 2005-09-22 2007-04-05 Sumitomo Metal Electronics Devices Inc Package for receiving high heat-dissipation electronic component
US7429790B2 (en) * 2005-10-24 2008-09-30 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
JP2010512665A (en) * 2006-12-12 2010-04-22 インタープレックス，キューエルピー，インコーポレイテッド Plastic electronic device package
US20090028491A1 (en) * 2007-07-26 2009-01-29 General Electric Company Interconnect structure
US8067834B2 (en) * 2007-08-21 2011-11-29 Hvvi Semiconductors, Inc. Semiconductor component
US8143717B2 (en) * 2008-06-16 2012-03-27 Hcc Aegis, Inc. Surface mount package with ceramic sidewalls
JP5247626B2 (en) * 2008-08-22 2013-07-24 住友化学株式会社 Lead frame, resin package, semiconductor device, and resin package manufacturing method
JP5442491B2 (en) * 2010-02-26 2014-03-12 新日鉄住金化学株式会社 Thermally conductive metal-insulating resin substrate and manufacturing method thereof
WO2012029549A1 (en) * 2010-08-30 2012-03-08 住友ベークライト株式会社 Semiconductor package, and semiconductor device
US8969132B2 (en) * 2010-09-20 2015-03-03 Nuvotronics, Llc Device package and methods for the fabrication thereof
JP2012094701A (en) * 2010-10-27 2012-05-17 Kyocera Corp Package for housing semiconductor element and module including the package

Also Published As

Publication number Publication date
US20170069560A1 (en) 2017-03-09
CN106537579A (en) 2017-03-22
PH12016502321A1 (en) 2017-01-30
WO2015179733A1 (en) 2015-11-26
EP3146560A4 (en) 2018-04-18
EP3146560A1 (en) 2017-03-29
JP2017518640A (en) 2017-07-06

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