SG11201607232WA - Metal paste and use thereof for the connecting of components - Google Patents
Metal paste and use thereof for the connecting of componentsInfo
- Publication number
- SG11201607232WA SG11201607232WA SG11201607232WA SG11201607232WA SG11201607232WA SG 11201607232W A SG11201607232W A SG 11201607232WA SG 11201607232W A SG11201607232W A SG 11201607232WA SG 11201607232W A SG11201607232W A SG 11201607232WA SG 11201607232W A SG11201607232W A SG 11201607232WA
- Authority
- SG
- Singapore
- Prior art keywords
- components
- metal paste
- paste
- metal
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/29124—Aluminium [Al] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/29294—Material of the matrix with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14167030.7A EP2942129B1 (en) | 2014-05-05 | 2014-05-05 | Metal paste and its use in joining components |
PCT/EP2015/058476 WO2015169571A1 (en) | 2014-05-05 | 2015-04-20 | Metal paste and use thereof for joining construction elements |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201607232WA true SG11201607232WA (en) | 2016-11-29 |
Family
ID=50685754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201607232WA SG11201607232WA (en) | 2014-05-05 | 2015-04-20 | Metal paste and use thereof for the connecting of components |
Country Status (9)
Country | Link |
---|---|
US (1) | US20170221855A1 (en) |
EP (1) | EP2942129B1 (en) |
JP (1) | JP6312858B2 (en) |
KR (1) | KR20160140804A (en) |
CN (1) | CN106413945B (en) |
MX (1) | MX2016012883A (en) |
SG (1) | SG11201607232WA (en) |
TW (1) | TW201603152A (en) |
WO (1) | WO2015169571A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017222010A1 (en) * | 2016-06-22 | 2019-04-18 | 積水化学工業株式会社 | Connecting structure, metal atom-containing particle and bonding composition |
SG11201906718UA (en) * | 2017-03-15 | 2019-10-30 | Hitachi Chemical Co Ltd | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device |
EP3401039A1 (en) * | 2017-05-12 | 2018-11-14 | Heraeus Deutschland GmbH & Co. KG | Method of joining structural elements using metal paste |
WO2019060166A1 (en) * | 2017-09-25 | 2019-03-28 | Eastman Kodak Company | Method of making silver-containing dispersions with nitrogenous bases |
JP7482214B2 (en) | 2020-03-31 | 2024-05-13 | 三井金属鉱業株式会社 | Copper particles and method for producing same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0467509A (en) * | 1990-07-06 | 1992-03-03 | Kao Corp | Conductive paste and conductive film |
JP5151150B2 (en) * | 2006-12-28 | 2013-02-27 | 株式会社日立製作所 | Composition for forming conductive sintered layer, and method for forming conductive film and bonding method using the same |
DE102009040076A1 (en) * | 2009-09-04 | 2011-03-10 | W.C. Heraeus Gmbh | Metal paste with oxidizing agent |
JP2011096900A (en) * | 2009-10-30 | 2011-05-12 | Fujitsu Ltd | Electric conductor and printed wiring board, and method of manufacturing the electric conductor and the printed wiring board |
JP5811314B2 (en) * | 2010-06-16 | 2015-11-11 | 国立研究開発法人物質・材料研究機構 | METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT BODY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD |
JP5025825B2 (en) * | 2010-07-28 | 2012-09-12 | 積水化学工業株式会社 | Conductive particles with insulating particles, anisotropic conductive material, and connection structure |
CN103260797B (en) * | 2010-12-17 | 2015-12-02 | 古河电气工业株式会社 | Heat bonding material, add the joint method of thermal bonding coating material, coating substance and electronic unit |
JP5785024B2 (en) * | 2011-08-03 | 2015-09-24 | 第一工業製薬株式会社 | Silver particle dispersion composition, conductive circuit using the same, and method for forming conductive circuit |
JP5360285B2 (en) * | 2012-01-26 | 2013-12-04 | 東レ株式会社 | Photosensitive conductive paste |
-
2014
- 2014-05-05 EP EP14167030.7A patent/EP2942129B1/en active Active
-
2015
- 2015-04-20 US US15/308,787 patent/US20170221855A1/en not_active Abandoned
- 2015-04-20 CN CN201580022549.3A patent/CN106413945B/en active Active
- 2015-04-20 JP JP2016564128A patent/JP6312858B2/en active Active
- 2015-04-20 MX MX2016012883A patent/MX2016012883A/en unknown
- 2015-04-20 WO PCT/EP2015/058476 patent/WO2015169571A1/en active Application Filing
- 2015-04-20 KR KR1020167029972A patent/KR20160140804A/en active IP Right Grant
- 2015-04-20 SG SG11201607232WA patent/SG11201607232WA/en unknown
- 2015-05-04 TW TW104114193A patent/TW201603152A/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP2942129B1 (en) | 2017-07-05 |
JP6312858B2 (en) | 2018-04-18 |
US20170221855A1 (en) | 2017-08-03 |
TW201603152A (en) | 2016-01-16 |
MX2016012883A (en) | 2016-12-12 |
JP2017519897A (en) | 2017-07-20 |
KR20160140804A (en) | 2016-12-07 |
EP2942129A1 (en) | 2015-11-11 |
CN106413945B (en) | 2018-05-18 |
WO2015169571A1 (en) | 2015-11-12 |
CN106413945A (en) | 2017-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL276946A (en) | Antiproliferative compounds and methods of use thereof | |
HRP20192145T1 (en) | Carrier-antibody compositions and methods of making and using the same | |
GB201506913D0 (en) | Inductor structure and application thereof | |
GB201411197D0 (en) | Composition and use thereof | |
HUE060941T2 (en) | Haloolefin-based composition and use thereof | |
PL3377663T3 (en) | Copper-nickel-zinc alloy and use thereof | |
SG11201607232WA (en) | Metal paste and use thereof for the connecting of components | |
PL2875832T3 (en) | Implantable paste and its use | |
HK1247136A1 (en) | Compositions comprising 15-hepe and methods of using the same | |
TWI560830B (en) | Metal sintering preparation and the use thereof for the connecting of components | |
SG10201406685YA (en) | Metal sintering preparation and the use thereof for the connecting of components | |
HUE045443T2 (en) | Soldering paste and process of cohesive connection | |
PL3145660T3 (en) | Metal powder | |
PL3113774T3 (en) | Compositions of grapiprant and methods for using the same | |
GB2608711B (en) | Brazing components and techniques | |
GB201411196D0 (en) | Composition and use thereof | |
EP3181728A4 (en) | Metal material and current-carrying component using said metal material | |
GB2545167B (en) | Cloches and use thereof | |
PL3229772T3 (en) | 6-aryl-9-glycosylpurines and use thereof |