SG11201606426QA - Modulation of magnetic properties through implantation and associated structures - Google Patents
Modulation of magnetic properties through implantation and associated structuresInfo
- Publication number
- SG11201606426QA SG11201606426QA SG11201606426QA SG11201606426QA SG11201606426QA SG 11201606426Q A SG11201606426Q A SG 11201606426QA SG 11201606426Q A SG11201606426Q A SG 11201606426QA SG 11201606426Q A SG11201606426Q A SG 11201606426QA SG 11201606426Q A SG11201606426Q A SG 11201606426QA
- Authority
- SG
- Singapore
- Prior art keywords
- implantation
- modulation
- magnetic properties
- associated structures
- structures
- Prior art date
Links
- 238000002513 implantation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2014/032240 WO2015147875A1 (en) | 2014-03-28 | 2014-03-28 | Modulation of magnetic properties through implantation and associated structures |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201606426QA true SG11201606426QA (en) | 2016-09-29 |
Family
ID=54196189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201606426QA SG11201606426QA (en) | 2014-03-28 | 2014-03-28 | Modulation of magnetic properties through implantation and associated structures |
Country Status (7)
Country | Link |
---|---|
US (1) | US10079266B2 (en) |
EP (1) | EP3123475A4 (en) |
KR (1) | KR102244115B1 (en) |
CN (1) | CN106030717B (en) |
SG (1) | SG11201606426QA (en) |
TW (1) | TWI610300B (en) |
WO (1) | WO2015147875A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10636875B1 (en) * | 2019-01-21 | 2020-04-28 | Northrop Grumman Systems Corporation | Localized tunneling enhancement for semiconductor devices |
CN114068613A (en) * | 2020-08-05 | 2022-02-18 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6812040B2 (en) * | 2002-03-12 | 2004-11-02 | Freescale Semiconductor, Inc. | Method of fabricating a self-aligned via contact for a magnetic memory element |
US7199055B2 (en) * | 2003-03-03 | 2007-04-03 | Cypress Semiconductor Corp. | Magnetic memory cell junction and method for forming a magnetic memory cell junction |
US7211446B2 (en) | 2004-06-11 | 2007-05-01 | International Business Machines Corporation | Method of patterning a magnetic tunnel junction stack for a magneto-resistive random access memory |
JP5072012B2 (en) * | 2005-11-14 | 2012-11-14 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
US8133745B2 (en) * | 2007-10-17 | 2012-03-13 | Magic Technologies, Inc. | Method of magnetic tunneling layer processes for spin-transfer torque MRAM |
US8455267B2 (en) * | 2009-05-14 | 2013-06-04 | Qualcomm Incorporated | Magnetic tunnel junction device and fabrication |
KR101686553B1 (en) * | 2010-07-12 | 2016-12-14 | 삼성전자 주식회사 | Chip Stacked Package and Package on Package |
KR101127766B1 (en) * | 2011-01-24 | 2012-03-16 | 주식회사 하이닉스반도체 | Method for fabricating magnetic tunnel junction |
US8815720B2 (en) | 2011-04-12 | 2014-08-26 | Varian Semiconductor Equipment Associates, Inc. | Method of etching a workpiece |
JP5535161B2 (en) * | 2011-09-20 | 2014-07-02 | 株式会社東芝 | Magnetoresistive element and manufacturing method thereof |
US8823118B2 (en) | 2012-01-05 | 2014-09-02 | Headway Technologies, Inc. | Spin torque transfer magnetic tunnel junction fabricated with a composite tunneling barrier layer |
JP5659181B2 (en) | 2012-03-21 | 2015-01-28 | 株式会社東芝 | Method for manufacturing magnetoresistive element |
US9070854B2 (en) * | 2012-04-27 | 2015-06-30 | Varian Semiconductor Equipment Associates, Inc. | Techniques for patterning multilayer magnetic memory devices using ion implantation |
KR20140008745A (en) | 2012-07-11 | 2014-01-22 | 삼성전자주식회사 | Magenetic random access memory |
US9059398B2 (en) * | 2012-08-03 | 2015-06-16 | Applied Materials, Inc. | Methods for etching materials used in MRAM applications |
KR102152145B1 (en) * | 2013-09-09 | 2020-09-07 | 삼성전자주식회사 | Magnetic memory device and method of manufacturing the same |
-
2014
- 2014-03-28 WO PCT/US2014/032240 patent/WO2015147875A1/en active Application Filing
- 2014-03-28 US US15/122,129 patent/US10079266B2/en active Active
- 2014-03-28 KR KR1020167023216A patent/KR102244115B1/en active IP Right Grant
- 2014-03-28 EP EP14887179.1A patent/EP3123475A4/en not_active Withdrawn
- 2014-03-28 CN CN201480076166.XA patent/CN106030717B/en not_active Expired - Fee Related
- 2014-03-28 SG SG11201606426QA patent/SG11201606426QA/en unknown
-
2015
- 2015-02-17 TW TW104105651A patent/TWI610300B/en active
Also Published As
Publication number | Publication date |
---|---|
KR102244115B1 (en) | 2021-04-26 |
KR20160138388A (en) | 2016-12-05 |
US20170005136A1 (en) | 2017-01-05 |
US10079266B2 (en) | 2018-09-18 |
WO2015147875A1 (en) | 2015-10-01 |
TW201601148A (en) | 2016-01-01 |
CN106030717A (en) | 2016-10-12 |
CN106030717B (en) | 2019-10-01 |
EP3123475A1 (en) | 2017-02-01 |
TWI610300B (en) | 2018-01-01 |
EP3123475A4 (en) | 2017-11-22 |
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