SG11201605453WA - Purge apparatus and purge method - Google Patents

Purge apparatus and purge method

Info

Publication number
SG11201605453WA
SG11201605453WA SG11201605453WA SG11201605453WA SG11201605453WA SG 11201605453W A SG11201605453W A SG 11201605453WA SG 11201605453W A SG11201605453W A SG 11201605453WA SG 11201605453W A SG11201605453W A SG 11201605453WA SG 11201605453W A SG11201605453W A SG 11201605453WA
Authority
SG
Singapore
Prior art keywords
purge
purge apparatus
purge method
Prior art date
Application number
SG11201605453WA
Inventor
Masanao Murata
Takashi Yamaji
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11201605453WA publication Critical patent/SG11201605453WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201605453WA 2014-03-17 2015-01-09 Purge apparatus and purge method SG11201605453WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014052997 2014-03-17
PCT/JP2015/050498 WO2015141246A1 (en) 2014-03-17 2015-01-09 Purge apparatus and purge method

Publications (1)

Publication Number Publication Date
SG11201605453WA true SG11201605453WA (en) 2016-09-29

Family

ID=54144226

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201605453WA SG11201605453WA (en) 2014-03-17 2015-01-09 Purge apparatus and purge method

Country Status (9)

Country Link
US (1) US10217656B2 (en)
EP (1) EP3121845B1 (en)
JP (1) JP6136084B2 (en)
KR (1) KR101840367B1 (en)
CN (1) CN106068554B (en)
IL (1) IL246131A (en)
SG (1) SG11201605453WA (en)
TW (1) TWI679719B (en)
WO (1) WO2015141246A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141246A1 (en) * 2014-03-17 2015-09-24 村田機械株式会社 Purge apparatus and purge method
JP6459682B2 (en) * 2015-03-20 2019-01-30 Tdk株式会社 Gas purge device, load port device and gas purge method
TWI567856B (en) * 2015-09-08 2017-01-21 古震維 Purge Load Port
KR20180067427A (en) 2016-12-12 2018-06-20 주식회사 기가레인 Nozzle assembly for load port
US11139188B2 (en) * 2017-04-28 2021-10-05 Sinfonia Technology Co., Ltd. Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus
JP7422577B2 (en) * 2020-03-23 2024-01-26 平田機工株式会社 Load port and control method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6065026A (en) * 1997-01-09 2000-05-16 Document.Com, Inc. Multi-user electronic document authoring system with prompted updating of shared language
US5988233A (en) 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
US6056026A (en) * 1998-12-01 2000-05-02 Asyst Technologies, Inc. Passively activated valve for carrier purging
JPWO2005101484A1 (en) 2004-04-07 2008-03-06 株式会社ライト製作所 Substrate storage container atmosphere replacement port connection device
JP4301456B2 (en) * 2005-11-30 2009-07-22 Ｔｄｋ株式会社 Closed container lid opening and closing system
JP4278676B2 (en) * 2005-11-30 2009-06-17 Ｔｄｋ株式会社 Closed container lid opening and closing system
JP4309935B2 (en) * 2007-07-31 2009-08-05 Ｔｄｋ株式会社 Closed container lid opening / closing system and substrate processing method using the system
FR2922362B1 (en) 2007-10-16 2009-12-18 Avancis Gmbh & Co Kg IMPROVEMENTS TO A CONNECTION HOUSING FOR ELEMENTS CAPABLE OF COLLECTING LIGHT.
JP5236518B2 (en) * 2009-02-03 2013-07-17 株式会社ダン・タクマ Storage system and storage method
JP2010267761A (en) * 2009-05-14 2010-11-25 Shin Etsu Polymer Co Ltd Substrate storing container
JP2011187539A (en) * 2010-03-05 2011-09-22 Sinfonia Technology Co Ltd Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method
JP5494734B2 (en) * 2011-08-15 2014-05-21 Ｔｄｋ株式会社 Purge device and load port device having the purge device
US9445785B2 (en) * 2011-11-02 2016-09-20 Seno Medical Instruments, Inc. System and method for normalizing range in an optoacoustic imaging system
JP6135066B2 (en) * 2012-08-10 2017-05-31 シンフォニアテクノロジー株式会社 Purge nozzle unit, purge device, load port
US9257320B2 (en) * 2013-06-05 2016-02-09 GlobalFoundries, Inc. Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
WO2015129122A1 (en) * 2014-02-27 2015-09-03 村田機械株式会社 Purging apparatus and purging method
WO2015141246A1 (en) * 2014-03-17 2015-09-24 村田機械株式会社 Purge apparatus and purge method
JP6459682B2 (en) * 2015-03-20 2019-01-30 Tdk株式会社 Gas purge device, load port device and gas purge method

Also Published As

Publication number Publication date
IL246131A0 (en) 2016-07-31
JP6136084B2 (en) 2017-05-31
EP3121845B1 (en) 2021-07-28
CN106068554B (en) 2019-05-31
KR20160132104A (en) 2016-11-16
EP3121845A4 (en) 2017-11-15
TW201537666A (en) 2015-10-01
EP3121845A1 (en) 2017-01-25
US20160365266A1 (en) 2016-12-15
US10217656B2 (en) 2019-02-26
KR101840367B1 (en) 2018-03-20
TWI679719B (en) 2019-12-11
CN106068554A (en) 2016-11-02
WO2015141246A1 (en) 2015-09-24
IL246131A (en) 2016-12-29
JPWO2015141246A1 (en) 2017-04-06

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