SG11201604325RA - Device and method for positioning a photolithography mask by means of a contactless optical method - Google Patents

Device and method for positioning a photolithography mask by means of a contactless optical method

Info

Publication number
SG11201604325RA
SG11201604325RA SG11201604325RA SG11201604325RA SG11201604325RA SG 11201604325R A SG11201604325R A SG 11201604325RA SG 11201604325R A SG11201604325R A SG 11201604325RA SG 11201604325R A SG11201604325R A SG 11201604325RA SG 11201604325R A SG11201604325R A SG 11201604325RA
Authority
SG
Singapore
Prior art keywords
positioning
photolithography mask
contactless optical
optical method
contactless
Prior art date
Application number
SG11201604325RA
Other languages
English (en)
Inventor
Gilles Fresquet
Guenael Ribette
Original Assignee
Fogale Nanotech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fogale Nanotech filed Critical Fogale Nanotech
Publication of SG11201604325RA publication Critical patent/SG11201604325RA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11201604325RA 2013-12-04 2014-11-28 Device and method for positioning a photolithography mask by means of a contactless optical method SG11201604325RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1362065A FR3014212B1 (fr) 2013-12-04 2013-12-04 Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact
PCT/EP2014/076009 WO2015082363A1 (fr) 2013-12-04 2014-11-28 Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact

Publications (1)

Publication Number Publication Date
SG11201604325RA true SG11201604325RA (en) 2016-07-28

Family

ID=50029106

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201604325RA SG11201604325RA (en) 2013-12-04 2014-11-28 Device and method for positioning a photolithography mask by means of a contactless optical method

Country Status (9)

Country Link
US (1) US9897927B2 (zh)
EP (1) EP3077873B1 (zh)
JP (1) JP2016539375A (zh)
KR (1) KR20160093021A (zh)
CN (1) CN105829971B (zh)
FR (1) FR3014212B1 (zh)
SG (1) SG11201604325RA (zh)
TW (1) TWI636345B (zh)
WO (1) WO2015082363A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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US10935366B2 (en) * 2014-12-12 2021-03-02 Werth Messtechnik Gmbh Method and device for measuring features on workpieces
US10473714B2 (en) * 2017-03-06 2019-11-12 Asm Technology Singapore Pte Ltd Method and apparatus for aligning electronic components
CN108036732B (zh) * 2017-11-30 2020-05-26 中国科学院光电技术研究所 一种基于超分辨光刻的间隙检测装置
WO2019192681A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Apparatus, system and method for aligning a substrate
DE102018114860A1 (de) * 2018-06-20 2019-12-24 Precitec Optronik Gmbh Vorrichtung und Verfahren zur optischen Vermessung eines Messobjekts
FR3093560B1 (fr) * 2019-03-05 2021-10-29 Fogale Nanotech Procédé et dispositif de mesure d’interfaces d’un élément optique
KR102199964B1 (ko) * 2019-04-30 2021-01-07 한양대학교 에리카산학협력단 근접 노광을 위한 기판 변형 장치 및 이를 이용한 근접 노광을 위한 기판 변형 방법
EP3800505A1 (en) * 2019-10-03 2021-04-07 ASML Netherlands B.V. Measurement system and method for characterizing a patterning device
US11852464B2 (en) * 2021-12-20 2023-12-26 Mloptic Corp. Chromatic confocal sensor with imaging capability for 6-axis spatial allocation calibration

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JPS57204547A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Exposing method
US4636626A (en) * 1983-01-14 1987-01-13 Nippon Kogaku K.K. Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication
DE69013790T2 (de) * 1989-08-04 1995-05-04 Canon K.K., Tokio/Tokyo Verfahren und Vorrichtung zur Positionsbestimmung.
US5808742A (en) * 1995-05-31 1998-09-15 Massachusetts Institute Of Technology Optical alignment apparatus having multiple parallel alignment marks
JP2004165723A (ja) * 2002-11-08 2004-06-10 Olympus Corp 電子撮像装置
US7650029B2 (en) * 2004-11-23 2010-01-19 Hewlett-Packard Development Company, L.P. Multiple layer alignment sensing
US7800761B2 (en) * 2006-04-12 2010-09-21 Massachusetts Institute Of Technology Infrared interferometric-spatial-phase imaging using backside wafer marks
US7535646B2 (en) * 2006-11-17 2009-05-19 Eastman Kodak Company Light emitting device with microlens array
NL1036683A1 (nl) * 2008-04-14 2009-10-15 Asml Netherlands Bv Focus sensor, inspection apparatus, lithographic apparatus and control system.
JP2011164503A (ja) * 2010-02-15 2011-08-25 Hitachi Displays Ltd 表示装置
JP5736672B2 (ja) * 2010-06-03 2015-06-17 株式会社ニコン 光学部品及び分光測光装置
JP5424267B2 (ja) * 2010-08-06 2014-02-26 株式会社ブイ・テクノロジー マイクロレンズ露光装置
US8419233B2 (en) * 2011-05-10 2013-04-16 Applied Lighting Company Lampshade structure for LED lamps
US9760020B2 (en) * 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology

Also Published As

Publication number Publication date
EP3077873B1 (fr) 2018-02-14
FR3014212B1 (fr) 2017-05-26
US20160377995A1 (en) 2016-12-29
CN105829971B (zh) 2017-09-08
JP2016539375A (ja) 2016-12-15
TW201527908A (zh) 2015-07-16
EP3077873A1 (fr) 2016-10-12
FR3014212A1 (fr) 2015-06-05
TWI636345B (zh) 2018-09-21
WO2015082363A1 (fr) 2015-06-11
CN105829971A (zh) 2016-08-03
US9897927B2 (en) 2018-02-20
KR20160093021A (ko) 2016-08-05

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