SG11201603069RA - Ultraviolet-ray-curable organopolysiloxane composition, and method for producing printing material - Google Patents
Ultraviolet-ray-curable organopolysiloxane composition, and method for producing printing materialInfo
- Publication number
- SG11201603069RA SG11201603069RA SG11201603069RA SG11201603069RA SG11201603069RA SG 11201603069R A SG11201603069R A SG 11201603069RA SG 11201603069R A SG11201603069R A SG 11201603069RA SG 11201603069R A SG11201603069R A SG 11201603069RA SG 11201603069R A SG11201603069R A SG 11201603069RA
- Authority
- SG
- Singapore
- Prior art keywords
- ultraviolet
- ray
- printing material
- organopolysiloxane composition
- curable organopolysiloxane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/0011—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping plates or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/001—Flat articles, e.g. films or sheets having irregular or rough surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/06—Crosslinking by radiation
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013217177 | 2013-10-18 | ||
PCT/JP2014/071598 WO2015056483A1 (en) | 2013-10-18 | 2014-08-19 | Ultraviolet-ray-curable organopolysiloxane composition, and method for producing printing material |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201603069RA true SG11201603069RA (en) | 2016-05-30 |
Family
ID=52827936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201603069RA SG11201603069RA (en) | 2013-10-18 | 2014-08-19 | Ultraviolet-ray-curable organopolysiloxane composition, and method for producing printing material |
Country Status (8)
Country | Link |
---|---|
US (1) | US9714344B2 (en) |
EP (1) | EP3059284A4 (en) |
JP (1) | JP6020740B2 (en) |
KR (1) | KR101833291B1 (en) |
CN (1) | CN105637035B (en) |
SG (1) | SG11201603069RA (en) |
TW (1) | TWI633157B (en) |
WO (1) | WO2015056483A1 (en) |
Families Citing this family (30)
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JP6217590B2 (en) * | 2013-11-05 | 2017-10-25 | 信越化学工業株式会社 | UV-curable adhesive organopolysiloxane composition |
JP6156251B2 (en) * | 2014-05-09 | 2017-07-05 | 信越化学工業株式会社 | Method for bonding thermoplastic resin substrate and organopolysiloxane resin |
JP6390361B2 (en) * | 2014-11-11 | 2018-09-19 | 信越化学工業株式会社 | UV thickening type thermally conductive silicone grease composition |
JP6678388B2 (en) * | 2014-12-25 | 2020-04-08 | 信越化学工業株式会社 | Curable silicone resin composition |
CN105131613B (en) * | 2015-10-08 | 2020-01-31 | 成都硅宝科技股份有限公司 | Addition type light-cured organic silicon rubber composition |
CN108025494B (en) | 2015-11-26 | 2020-03-10 | 瓦克化学股份公司 | High-viscosity silicone composition for producing elastomeric molded parts by ballistic generating method |
MX2018006755A (en) | 2015-12-03 | 2018-11-09 | Elantas Beck Gmbh | One-component, storage-stable, uv-crosslinkable organosiloxane composition. |
WO2017143508A1 (en) | 2016-02-23 | 2017-08-31 | Dow Corning Corporation | Curable high hardness silicone composition and composite articles made thereof |
JP2019514201A (en) * | 2016-04-18 | 2019-05-30 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | Method of manufacturing optoelectronic component, and optoelectronic component |
ES2961578T3 (en) * | 2016-05-29 | 2024-03-12 | Stratasys Ltd | Additive manufacturing of rubber-like materials |
CN106433142A (en) * | 2016-09-12 | 2017-02-22 | 宁波创导三维医疗科技有限公司 | Silica gel 3D printer and printing method thereof |
KR20180119744A (en) * | 2017-04-25 | 2018-11-05 | 삼성디스플레이 주식회사 | Photocurable resin for pattern formation and patterned body manufactured therefrom |
IL278176B (en) | 2017-05-29 | 2022-09-01 | Stratasys Ltd | Method and system for additive manufacturing of peelable sacrificial structure |
TWI762659B (en) | 2017-06-19 | 2022-05-01 | 美商陶氏有機矽公司 | A liquid silicone composition for transfer-or injection-molding optical parts, transfer-or injection-molding optical parts made therefrom, and a method of transfer-or injection-molding optical parts using the composition |
KR101822151B1 (en) * | 2017-06-28 | 2018-01-25 | 비즈텍코리아 주식회사 | Photocurable polysiloxane composition for 3D printing and dental model comprising the same |
US10689491B2 (en) * | 2017-09-29 | 2020-06-23 | Lawrence Livermore National Security, Llc | Silicone formulations for 3D printing |
CN111670104B (en) | 2017-12-28 | 2023-05-12 | 斯特拉塔西斯公司 | Method and system for additive manufacturing of strippable sacrificial structures |
JP7152113B2 (en) * | 2018-02-05 | 2022-10-12 | スリーエム イノベイティブ プロパティズ カンパニー | Radiation-curable compositions for additive manufacturing techniques containing mercapto-functional polyorganosiloxanes |
GB201803923D0 (en) * | 2018-03-12 | 2018-04-25 | Johnson Matthey Plc | Compositions |
TW202010806A (en) * | 2018-09-03 | 2020-03-16 | 美商陶氏有機矽公司 | Low viscosity compositions and 3D printing methods utilizing the compositions |
WO2020065653A1 (en) | 2018-09-27 | 2020-04-02 | Stratasys Ltd. | Method and system for additive manufacturing with a sacrificial structure for easy removal |
EP3875543A4 (en) * | 2018-10-30 | 2022-08-10 | Dow Toray Co., Ltd. | Curable reactive silicone composition, cured product thereof and uses of composition and cured product |
JP6897695B2 (en) * | 2019-01-28 | 2021-07-07 | 信越化学工業株式会社 | Method for manufacturing UV curable silicone adhesive composition and laminate |
JP2020152093A (en) * | 2019-03-15 | 2020-09-24 | パナック株式会社 | Method for producing composite body, and composite body |
JP7094926B2 (en) * | 2019-09-02 | 2022-07-04 | 信越化学工業株式会社 | Thermosetting silicone resin composition and die attach material for optical semiconductor devices |
KR102312734B1 (en) * | 2020-05-20 | 2021-10-14 | 한국세라믹기술원 | Manufacturing method of ceramic 3-dimensional printing output sintered body |
JP7374059B2 (en) * | 2020-09-25 | 2023-11-06 | コネクテックジャパン株式会社 | Wiring formation method |
US20240004294A1 (en) * | 2020-10-07 | 2024-01-04 | Dai Nippon Printing Co., Ltd. | Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor device |
US11680167B2 (en) | 2021-02-10 | 2023-06-20 | Honeywell Federal Manufacturing & Technologies, Llc | Thixotropic polysiloxane pastes for additive manufacturing |
WO2023190168A1 (en) * | 2022-03-31 | 2023-10-05 | 大日本印刷株式会社 | Cured film forming method, method for manufacturing substrate for imprint mold, method for manufacturing imprint mold, method for manufacturing uneven structure, pattern forming method, hard mask forming method, insulating film forming method, and method for manufacturing semiconductor device |
Family Cites Families (21)
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JP3417230B2 (en) | 1996-09-25 | 2003-06-16 | 信越化学工業株式会社 | Photocurable liquid silicone rubber composition for mold making |
TW406113B (en) | 1997-03-20 | 2000-09-21 | Wacker Chemie Gmbh | Crosslinkable compositions possibly comprising MQ silicone resins |
WO1998042789A1 (en) * | 1997-03-20 | 1998-10-01 | Wacker-Chemie Gmbh | Cross-linkable compounds, optionally containing mq silicon resins |
US20050060027A1 (en) | 1999-01-13 | 2005-03-17 | Advanced Stent Technologies, Inc. | Catheter balloon systems and methods |
JP4715990B2 (en) | 2004-01-09 | 2011-07-06 | 信越化学工業株式会社 | Curable resin composition for optical recording medium and optical recording medium |
JP4788863B2 (en) | 2004-06-18 | 2011-10-05 | シーメット株式会社 | Optical three-dimensional modeling resin composition and optical three-dimensional modeling method |
DE102004036573A1 (en) * | 2004-07-28 | 2006-03-23 | Ge Bayer Silicones Gmbh & Co. Kg | Use of light-activatable, curable silicone compositions for the production of thick-walled molded articles or thick-walled coatings |
US20070269586A1 (en) | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
KR20090018199A (en) | 2006-06-05 | 2009-02-19 | 다우 코닝 코포레이션 | Electronic package and method of preparing same |
US20080014532A1 (en) | 2006-07-14 | 2008-01-17 | 3M Innovative Properties Company | Laminate body, and method for manufacturing thin substrate using the laminate body |
US20090062417A1 (en) | 2007-08-31 | 2009-03-05 | Momentive Performance Materials Gmbh | Process For The Continuous Manufacturing Of Shaped Articles And Use Of Silicone Rubber Compositions In That Process |
JP5319905B2 (en) * | 2007-10-09 | 2013-10-16 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Silicone rubber composition for mold master and mold master |
JP5342830B2 (en) * | 2008-08-19 | 2013-11-13 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Photocurable organopolysiloxane composition |
JP5168510B2 (en) | 2009-08-20 | 2013-03-21 | 信越化学工業株式会社 | Nanoimprint material, curved surface printing pad material or offset printing blanket material |
JP2012074644A (en) | 2010-09-30 | 2012-04-12 | Shin Etsu Chem Co Ltd | Micro-contact printing material and manufacturing method thereof |
DE102010043149A1 (en) * | 2010-10-29 | 2012-05-03 | Wacker Chemie Ag | Highly transparent light-crosslinkable silicone mixtures |
JP5490671B2 (en) | 2010-12-07 | 2014-05-14 | 信越化学工業株式会社 | Method for curing silicone resin composition |
JP5679445B2 (en) | 2011-06-14 | 2015-03-04 | 信越化学工業株式会社 | Concave and convex pattern forming method |
JP5472241B2 (en) | 2011-09-16 | 2014-04-16 | 信越化学工業株式会社 | Method for producing cured thin film using photocurable silicone resin composition |
JP5704049B2 (en) * | 2011-10-13 | 2015-04-22 | 信越化学工業株式会社 | Method for forming conductive circuit |
JP6217590B2 (en) * | 2013-11-05 | 2017-10-25 | 信越化学工業株式会社 | UV-curable adhesive organopolysiloxane composition |
-
2014
- 2014-08-06 TW TW103126901A patent/TWI633157B/en active
- 2014-08-19 KR KR1020167010366A patent/KR101833291B1/en active IP Right Grant
- 2014-08-19 WO PCT/JP2014/071598 patent/WO2015056483A1/en active Application Filing
- 2014-08-19 SG SG11201603069RA patent/SG11201603069RA/en unknown
- 2014-08-19 EP EP14853853.1A patent/EP3059284A4/en not_active Withdrawn
- 2014-08-19 US US15/022,724 patent/US9714344B2/en active Active
- 2014-08-19 JP JP2015542533A patent/JP6020740B2/en active Active
- 2014-08-19 CN CN201480057133.0A patent/CN105637035B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105637035B (en) | 2019-03-29 |
JPWO2015056483A1 (en) | 2017-03-09 |
EP3059284A4 (en) | 2017-06-21 |
US9714344B2 (en) | 2017-07-25 |
CN105637035A (en) | 2016-06-01 |
TW201516091A (en) | 2015-05-01 |
KR20160073378A (en) | 2016-06-24 |
KR101833291B1 (en) | 2018-03-02 |
JP6020740B2 (en) | 2016-11-02 |
US20160230005A1 (en) | 2016-08-11 |
EP3059284A1 (en) | 2016-08-24 |
TWI633157B (en) | 2018-08-21 |
WO2015056483A1 (en) | 2015-04-23 |
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