SG11201602010VA - Heat treatment method - Google Patents
Heat treatment methodInfo
- Publication number
- SG11201602010VA SG11201602010VA SG11201602010VA SG11201602010VA SG11201602010VA SG 11201602010V A SG11201602010V A SG 11201602010VA SG 11201602010V A SG11201602010V A SG 11201602010VA SG 11201602010V A SG11201602010V A SG 11201602010VA SG 11201602010V A SG11201602010V A SG 11201602010VA
- Authority
- SG
- Singapore
- Prior art keywords
- heat treatment
- treatment method
- heat
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013244374A JP6086056B2 (en) | 2013-11-26 | 2013-11-26 | Heat treatment method |
PCT/JP2014/005417 WO2015079621A1 (en) | 2013-11-26 | 2014-10-27 | Heat treatment method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201602010VA true SG11201602010VA (en) | 2016-04-28 |
Family
ID=53198599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201602010VA SG11201602010VA (en) | 2013-11-26 | 2014-10-27 | Heat treatment method |
Country Status (8)
Country | Link |
---|---|
US (1) | US9922842B2 (en) |
EP (1) | EP3035373B1 (en) |
JP (1) | JP6086056B2 (en) |
KR (1) | KR102105367B1 (en) |
CN (1) | CN105580119B (en) |
SG (1) | SG11201602010VA (en) |
TW (1) | TWI588904B (en) |
WO (1) | WO2015079621A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7251458B2 (en) * | 2019-12-05 | 2023-04-04 | 株式会社Sumco | Silicon wafer manufacturing method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0884769A1 (en) | 1996-02-29 | 1998-12-16 | Tokyo Electron Limited | Heat-treating boat for semiconductor wafer |
JP3505934B2 (en) * | 1996-09-10 | 2004-03-15 | 東京エレクトロン株式会社 | Object support structure and heat treatment apparatus |
JPH10233368A (en) * | 1997-02-20 | 1998-09-02 | Toshiba Ceramics Co Ltd | Vertical wafer port |
JP2002324830A (en) * | 2001-02-20 | 2002-11-08 | Mitsubishi Electric Corp | Holding tool for substrate heat treatment, substrate heat treating equipment method for manufacturing semiconductor device, method for manufacturing the holding tool for substrate heat treatment and method for deciding structure of the holding tool for substrate heat treatment |
JP2002274983A (en) * | 2001-03-12 | 2002-09-25 | Tokai Konetsu Kogyo Co Ltd | Member for semiconductor manufacturing apparatus coated with sic film and method of manufacturing the same |
JP4396105B2 (en) * | 2003-02-05 | 2010-01-13 | 信越半導体株式会社 | Vertical heat treatment boat and semiconductor wafer heat treatment method |
JP4363401B2 (en) * | 2003-03-26 | 2009-11-11 | 信越半導体株式会社 | Heat treatment wafer support and heat treatment apparatus |
JP2005101161A (en) | 2003-09-24 | 2005-04-14 | Hitachi Kokusai Electric Inc | Supporting tool for heat treatment, heat treatment apparatus, heat treatment method, method of manufacturing substrate, and method of manufacturing semiconductor device |
US7888685B2 (en) | 2004-07-27 | 2011-02-15 | Memc Electronic Materials, Inc. | High purity silicon carbide structures |
US7601227B2 (en) | 2005-08-05 | 2009-10-13 | Sumco Corporation | High purification method of jig for semiconductor heat treatment |
KR101332206B1 (en) * | 2005-12-02 | 2013-11-25 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Semiconductor processing |
JP4290187B2 (en) * | 2006-09-27 | 2009-07-01 | コバレントマテリアル株式会社 | Surface cleaning method for semiconductor wafer heat treatment boat |
KR100818842B1 (en) * | 2006-12-27 | 2008-04-01 | 주식회사 실트론 | Wafer support pin in capable of preventing slip during thermal treatment to wafer and thermal treatment method to wafer |
JP5051909B2 (en) * | 2007-03-30 | 2012-10-17 | コバレントマテリアル株式会社 | Vertical wafer boat |
JP5211543B2 (en) * | 2007-05-01 | 2013-06-12 | 信越半導体株式会社 | Wafer support jig, vertical heat treatment boat equipped with the same, and method for manufacturing wafer support jig |
JP5071217B2 (en) * | 2008-04-17 | 2012-11-14 | 信越半導体株式会社 | Vertical heat treatment boat and silicon wafer heat treatment method using the same |
JP2010283153A (en) * | 2009-06-04 | 2010-12-16 | Hitachi Kokusai Electric Inc | Method for manufacturing semiconductor device, heat treatment apparatus, and member for heat treatment |
JP5439305B2 (en) * | 2010-07-14 | 2014-03-12 | 信越半導体株式会社 | Silicon substrate manufacturing method and silicon substrate |
JP2013048218A (en) * | 2011-07-22 | 2013-03-07 | Semiconductor Energy Lab Co Ltd | Method for manufacturing soi substrate |
TWI523107B (en) | 2011-09-27 | 2016-02-21 | 環球晶圓日本股份有限公司 | Method for heat-treating silicon wafer |
JP5997552B2 (en) | 2011-09-27 | 2016-09-28 | グローバルウェーハズ・ジャパン株式会社 | Heat treatment method for silicon wafer |
-
2013
- 2013-11-26 JP JP2013244374A patent/JP6086056B2/en active Active
-
2014
- 2014-10-27 WO PCT/JP2014/005417 patent/WO2015079621A1/en active Application Filing
- 2014-10-27 KR KR1020167009150A patent/KR102105367B1/en active IP Right Grant
- 2014-10-27 US US15/022,846 patent/US9922842B2/en active Active
- 2014-10-27 SG SG11201602010VA patent/SG11201602010VA/en unknown
- 2014-10-27 CN CN201480052178.9A patent/CN105580119B/en active Active
- 2014-10-27 EP EP14865182.1A patent/EP3035373B1/en active Active
- 2014-11-05 TW TW103138382A patent/TWI588904B/en active
Also Published As
Publication number | Publication date |
---|---|
US20160233107A1 (en) | 2016-08-11 |
EP3035373B1 (en) | 2018-06-06 |
CN105580119A (en) | 2016-05-11 |
KR20160089342A (en) | 2016-07-27 |
WO2015079621A1 (en) | 2015-06-04 |
CN105580119B (en) | 2018-02-06 |
EP3035373A4 (en) | 2017-04-12 |
KR102105367B1 (en) | 2020-04-28 |
TWI588904B (en) | 2017-06-21 |
JP2015103717A (en) | 2015-06-04 |
JP6086056B2 (en) | 2017-03-01 |
EP3035373A1 (en) | 2016-06-22 |
US9922842B2 (en) | 2018-03-20 |
TW201526112A (en) | 2015-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB201316088D0 (en) | Heating method | |
GB201309057D0 (en) | Method | |
GB2527013B (en) | Circulation warming apparatus | |
HK1215164A1 (en) | Treatment methods | |
GB201304872D0 (en) | Treatment | |
GB201309928D0 (en) | Method | |
GB201301857D0 (en) | Method | |
EP2816126A4 (en) | Heat treatment method | |
GB201309654D0 (en) | Method | |
GB201301233D0 (en) | Method | |
GB201300409D0 (en) | Method | |
IL241096A0 (en) | Method of treatment | |
GB201311385D0 (en) | Method | |
GB201305714D0 (en) | Method | |
GB201301094D0 (en) | Method | |
HK1204991A1 (en) | Perm treatment method | |
GB201307310D0 (en) | Treatment | |
SG11201602010VA (en) | Heat treatment method | |
PT2996460T (en) | Turf treatment method | |
GB201311389D0 (en) | Method | |
GB201321115D0 (en) | Treatment | |
GB201322764D0 (en) | Treating places | |
GB201322778D0 (en) | Method of treatment | |
GB201310085D0 (en) | Heating apparatus | |
GB201309238D0 (en) | Treatment |