SG11201601295TA - Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device - Google Patents

Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device

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Publication number
SG11201601295TA
SG11201601295TA SG11201601295TA SG11201601295TA SG11201601295TA SG 11201601295T A SG11201601295T A SG 11201601295TA SG 11201601295T A SG11201601295T A SG 11201601295TA SG 11201601295T A SG11201601295T A SG 11201601295TA SG 11201601295T A SG11201601295T A SG 11201601295TA
Authority
SG
Singapore
Prior art keywords
semiconductor device
multilayer structure
forming
multilayer
semiconductor
Prior art date
Application number
SG11201601295TA
Inventor
Teck Kheng Lee
Bok Leng Ser
Original Assignee
Inst Of Technical Education
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Of Technical Education filed Critical Inst Of Technical Education
Publication of SG11201601295TA publication Critical patent/SG11201601295TA/en

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    • H01L23/49838Geometry or layout
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SG11201601295TA 2013-08-28 2013-08-28 Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device SG11201601295TA (en)

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US10297563B2 (en) * 2016-09-15 2019-05-21 Intel Corporation Copper seed layer and nickel-tin microbump structures
US10332856B2 (en) * 2017-11-08 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method of fabricating the same
KR102028715B1 (en) * 2017-12-19 2019-10-07 삼성전자주식회사 Semiconductor package
JP7259530B2 (en) * 2019-05-08 2023-04-18 住友電気工業株式会社 Surface emitting laser, electronic device, manufacturing method of surface emitting laser
CN113140521B (en) * 2020-01-20 2022-11-22 上海艾为电子技术股份有限公司 Wafer level packaging method and wafer level packaging structure
US11621229B2 (en) * 2020-10-15 2023-04-04 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
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