SG11201510498WA - Thermosetting resin composition containing polymer having specific terminal structure - Google Patents
Thermosetting resin composition containing polymer having specific terminal structureInfo
- Publication number
- SG11201510498WA SG11201510498WA SG11201510498WA SG11201510498WA SG11201510498WA SG 11201510498W A SG11201510498W A SG 11201510498WA SG 11201510498W A SG11201510498W A SG 11201510498WA SG 11201510498W A SG11201510498W A SG 11201510498WA SG 11201510498W A SG11201510498W A SG 11201510498WA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- composition containing
- thermosetting resin
- containing polymer
- terminal structure
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/12—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/02—Polyamines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013130934 | 2013-06-21 | ||
PCT/JP2014/064862 WO2014203735A1 (en) | 2013-06-21 | 2014-06-04 | Heat-curable resin composition containing polymer having specific terminal structure |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201510498WA true SG11201510498WA (en) | 2016-01-28 |
Family
ID=52104475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201510498WA SG11201510498WA (en) | 2013-06-21 | 2014-06-04 | Thermosetting resin composition containing polymer having specific terminal structure |
Country Status (7)
Country | Link |
---|---|
US (1) | US9657128B2 (en) |
JP (1) | JP6402860B2 (en) |
KR (1) | KR101981788B1 (en) |
CN (1) | CN105324402B (en) |
SG (1) | SG11201510498WA (en) |
TW (1) | TWI636095B (en) |
WO (1) | WO2014203735A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6764134B2 (en) * | 2016-08-30 | 2020-09-30 | 日産化学株式会社 | Photosensitive adhesive composition |
JP7357195B2 (en) * | 2018-12-03 | 2023-10-06 | パナソニックIpマネジメント株式会社 | Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounted structure, and method for manufacturing mounted structure |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1419619A (en) | 1972-01-25 | 1975-12-31 | Redifon Ltd | Scanning devices |
JPS4931079A (en) | 1972-07-21 | 1974-03-20 | ||
KR100754374B1 (en) * | 2006-02-07 | 2007-08-31 | 삼성에스디아이 주식회사 | Electrolyte membrane using polybenzoxazines and manufacturing method thereof |
JP4887850B2 (en) | 2006-03-16 | 2012-02-29 | 住友ベークライト株式会社 | Liquid resin composition for underfill, semiconductor device manufacturing method using the same, and semiconductor device |
TW200801077A (en) | 2006-05-01 | 2008-01-01 | Sekisui Chemical Co Ltd | Sintered resin product and electronic device comprising the same |
JP5019363B2 (en) | 2007-02-22 | 2012-09-05 | 信越化学工業株式会社 | Epoxy resin adhesive composition |
JP2008291070A (en) * | 2007-05-22 | 2008-12-04 | Sekisui Chem Co Ltd | Manufacturing method for thermosetting resin, and thermosetting resin |
TW200909478A (en) * | 2007-07-10 | 2009-03-01 | Sekisui Chemical Co Ltd | Thermosetting resin having benzoxazine structure and method for producing the same |
JP4931079B2 (en) | 2007-12-21 | 2012-05-16 | パナソニック株式会社 | Liquid thermosetting resin composition for underfill and semiconductor device using the same |
JP5421630B2 (en) * | 2008-03-26 | 2014-02-19 | 積水化学工業株式会社 | Thermosetting resin, thermosetting composition containing thermosetting resin, molded body thereof, cured body, cured molded body, and electronic device including them |
JP2009242669A (en) * | 2008-03-31 | 2009-10-22 | Sekisui Chem Co Ltd | Preparation of thermosetting resin composition, thermosetting resin composition, molded item, cured product, and electronic component |
KR20110039339A (en) * | 2008-08-14 | 2011-04-15 | 헨켈 아게 운트 코. 카게아아 | Polymerizable benzoxazine compositions |
KR101615990B1 (en) | 2008-09-18 | 2016-04-28 | 고쿠리츠다이가쿠호우진 도쿄다이가쿠 | Method for manufacturing semiconductor device |
DE102009003033B4 (en) * | 2009-05-12 | 2013-02-21 | Henkel Ag & Co. Kgaa | Polymerizable benzoxazine compounds with surface-active or surface-active properties |
KR101202555B1 (en) | 2009-09-30 | 2012-11-19 | 세키스이가가쿠 고교가부시키가이샤 | Thermosetting resin having benzoxazine rings and process for production thereof |
US20130012620A1 (en) * | 2010-03-17 | 2013-01-10 | Designer Molecules, Inc. | Curing agents for epoxy resins |
-
2014
- 2014-06-04 CN CN201480034929.4A patent/CN105324402B/en active Active
- 2014-06-04 SG SG11201510498WA patent/SG11201510498WA/en unknown
- 2014-06-04 JP JP2015522734A patent/JP6402860B2/en active Active
- 2014-06-04 KR KR1020157034535A patent/KR101981788B1/en active IP Right Grant
- 2014-06-04 US US14/900,489 patent/US9657128B2/en active Active
- 2014-06-04 WO PCT/JP2014/064862 patent/WO2014203735A1/en active Application Filing
- 2014-06-16 TW TW103120705A patent/TWI636095B/en active
Also Published As
Publication number | Publication date |
---|---|
JPWO2014203735A1 (en) | 2017-02-23 |
KR20160023672A (en) | 2016-03-03 |
US20160152759A1 (en) | 2016-06-02 |
TW201510077A (en) | 2015-03-16 |
KR101981788B1 (en) | 2019-05-27 |
CN105324402A (en) | 2016-02-10 |
US9657128B2 (en) | 2017-05-23 |
CN105324402B (en) | 2018-01-09 |
JP6402860B2 (en) | 2018-10-10 |
TWI636095B (en) | 2018-09-21 |
WO2014203735A1 (en) | 2014-12-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201709161SA (en) | Novel polymer and thermosetting composition containing same | |
EP2977409A4 (en) | Glass-fiber-reinforced polycarbonate resin composition | |
EP2949697A4 (en) | Resin composition | |
EP2883906A4 (en) | Conductive cellulose-based resin composition | |
EP2857428A4 (en) | Epoxy resin composition | |
SG10201709684TA (en) | Resin Composition | |
SG11201500481RA (en) | Resin composition | |
EP2994507A4 (en) | Epoxy resin compositions | |
EP2942372A4 (en) | Conductive polymer composition | |
EP3015510A4 (en) | Molding resin composition | |
EP2837661A4 (en) | Resin composition | |
EP2921526A4 (en) | Thermosetting resin composition | |
EP3015523A4 (en) | Resin composition | |
EP3009476A4 (en) | Polymer resin composition having excellent chemical resistance | |
EP2832795A4 (en) | Resin composition | |
EP3037483A4 (en) | Flame-retardant synthetic resin composition | |
EP2980157A4 (en) | Resin composition | |
EP2829574A4 (en) | Light-diffusible resin composition | |
HK1223637A1 (en) | Polycyclohexylenedimethylene terephthalate resin composition | |
EP2915848A4 (en) | Thermosetting resin composition and use thereof | |
EP2951225A4 (en) | An epoxy resin composition,and its applications | |
EP2998354A4 (en) | Ptfe resin composition | |
PL2835400T3 (en) | Resin composition | |
SG11201601795XA (en) | Methacrylic resin composition | |
EP2910606A4 (en) | Thermosetting resin composition |