SG11201509431PA - Laser braze ceramic to an implantable medical device housing - Google Patents

Laser braze ceramic to an implantable medical device housing

Info

Publication number
SG11201509431PA
SG11201509431PA SG11201509431PA SG11201509431PA SG11201509431PA SG 11201509431P A SG11201509431P A SG 11201509431PA SG 11201509431P A SG11201509431P A SG 11201509431PA SG 11201509431P A SG11201509431P A SG 11201509431PA SG 11201509431P A SG11201509431P A SG 11201509431PA
Authority
SG
Singapore
Prior art keywords
medical device
implantable medical
device housing
laser braze
ceramic
Prior art date
Application number
SG11201509431PA
Inventor
Ulrich Hausch
Goran Pavlovic
Jacob Markham
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of SG11201509431PA publication Critical patent/SG11201509431PA/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A61N1/3754—Feedthroughs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Architecture (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Prostheses (AREA)
  • Endoscopes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Electrotherapy Devices (AREA)
SG11201509431PA 2013-05-24 2014-05-23 Laser braze ceramic to an implantable medical device housing SG11201509431PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/902,287 US9431801B2 (en) 2013-05-24 2013-05-24 Method of coupling a feedthrough assembly for an implantable medical device
PCT/US2014/039331 WO2014190256A2 (en) 2013-05-24 2014-05-23 Laser braze ceramic to an implantable medical device housing

Publications (1)

Publication Number Publication Date
SG11201509431PA true SG11201509431PA (en) 2015-12-30

Family

ID=51059565

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509431PA SG11201509431PA (en) 2013-05-24 2014-05-23 Laser braze ceramic to an implantable medical device housing

Country Status (5)

Country Link
US (2) US9431801B2 (en)
EP (2) EP3003475B1 (en)
CN (1) CN105555357A (en)
SG (1) SG11201509431PA (en)
WO (1) WO2014190256A2 (en)

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US9610451B2 (en) * 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing using a gold alloy
US9610452B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing by sintering
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EP3058984A1 (en) * 2015-02-20 2016-08-24 Heraeus Deutschland GmbH & Co. KG Component with a ceramic base, with a conductor and with a fastening element and a method for its manufacture
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EP3228354B1 (en) * 2016-04-07 2020-08-05 Heraeus Deutschland GmbH & Co. KG Method of directly connecting a wire to a feedthrough comprising a cermet conductor and an associated feedthrough
CN110652654A (en) * 2019-09-18 2020-01-07 杭州承诺医疗科技有限公司 Implantable neural stimulator packaging structure and method
EP4226968A1 (en) 2020-02-21 2023-08-16 Heraeus Medical Components, LLC Ferrule for non-planar medical device housing
EP4230258A1 (en) 2020-02-21 2023-08-23 Heraeus Medical Components, LLC Ferrule with strain relief spacer for implantable medical device
EP3903877B1 (en) * 2020-04-28 2024-07-24 Heraeus Medevio GmbH & Co. KG Feedthrough system
EP3939730A1 (en) 2020-07-14 2022-01-19 BIOTRONIK SE & Co. KG Method of joining a first and a second components of a lead-through using a reactive multilayer system
US20230085958A1 (en) 2021-09-10 2023-03-23 Greatbatch Ltd. A Ceramic Reinforced Metal Composite For Hermetic Bodies For Implantable Devices

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EP3300768A1 (en) 2018-04-04
EP3003475A2 (en) 2016-04-13
WO2014190256A2 (en) 2014-11-27
US9431801B2 (en) 2016-08-30
US9653893B2 (en) 2017-05-16
EP3300768B1 (en) 2019-11-20
WO2014190256A3 (en) 2015-01-22
EP3003475B1 (en) 2017-12-06
US20140345934A1 (en) 2014-11-27
CN105555357A (en) 2016-05-04
US20160126713A1 (en) 2016-05-05

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