SG11201507968YA - Method for manufacturing composite body and composition - Google Patents
Method for manufacturing composite body and compositionInfo
- Publication number
- SG11201507968YA SG11201507968YA SG11201507968YA SG11201507968YA SG11201507968YA SG 11201507968Y A SG11201507968Y A SG 11201507968YA SG 11201507968Y A SG11201507968Y A SG 11201507968YA SG 11201507968Y A SG11201507968Y A SG 11201507968YA SG 11201507968Y A SG11201507968Y A SG 11201507968YA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- composite body
- manufacturing composite
- manufacturing
- composite
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0206—Polyalkylene(poly)amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013067452 | 2013-03-27 | ||
JP2013179751 | 2013-08-30 | ||
PCT/JP2014/056340 WO2014156616A1 (en) | 2013-03-27 | 2014-03-11 | Method for manufacturing complex, and composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201507968YA true SG11201507968YA (en) | 2015-11-27 |
Family
ID=51623599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201507968YA SG11201507968YA (en) | 2013-03-27 | 2014-03-11 | Method for manufacturing composite body and composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US10020238B2 (en) |
EP (1) | EP2978011B1 (en) |
JP (1) | JP6058788B2 (en) |
KR (1) | KR101747582B1 (en) |
CN (1) | CN105051872B (en) |
SG (1) | SG11201507968YA (en) |
TW (1) | TWI640560B (en) |
WO (1) | WO2014156616A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3159917B1 (en) * | 2014-08-08 | 2021-08-04 | Mitsui Chemicals, Inc. | Seal composition and production method for semiconductor device |
JP6438747B2 (en) * | 2014-11-27 | 2018-12-19 | 三井化学株式会社 | Method for producing composite |
WO2016098738A1 (en) * | 2014-12-17 | 2016-06-23 | 三井化学株式会社 | Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method |
WO2017086361A1 (en) * | 2015-11-16 | 2017-05-26 | 三井化学株式会社 | Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing processing material for semiconductor, and semiconductor device |
KR102015404B1 (en) * | 2016-12-08 | 2019-08-28 | 삼성에스디아이 주식회사 | Composition for forming silica layer, method for manufacturing silica layer, and electric device includimg silica layer |
CN111936588A (en) * | 2018-04-06 | 2020-11-13 | 日产化学株式会社 | Coating film forming composition and method for manufacturing semiconductor device |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4933120B1 (en) | 1968-06-21 | 1974-09-04 | ||
JPS62282650A (en) | 1986-06-02 | 1987-12-08 | 川崎重工業株式会社 | Single toggle crusher |
JP3403402B2 (en) | 1990-01-25 | 2003-05-06 | モービル・オイル・コーポレイション | Synthetic porous crystalline material, its synthesis and use |
DE4026978A1 (en) | 1990-08-25 | 1992-02-27 | Bayer Ag | Coated substrates for electro=optical applications, etc. |
EP0534304A1 (en) | 1991-09-21 | 1993-03-31 | Hoechst Aktiengesellschaft | Cycloalkylated polyethylenimines and their use as hypolipemic agents |
WO1999055714A1 (en) | 1998-04-27 | 1999-11-04 | The University Of Akron | Supramolecular structures and process for making the same |
JP2001213958A (en) | 2000-02-03 | 2001-08-07 | Nippon Shokubai Co Ltd | Ethyleneimine polymer and its production method |
JP2004146495A (en) * | 2002-10-23 | 2004-05-20 | Toppan Printing Co Ltd | Built-in chip capacitor for printed wiring board, and element-containing board built therein |
JP4549135B2 (en) * | 2003-09-24 | 2010-09-22 | 株式会社日本触媒 | Polyalkyleneimine alkylene oxide copolymer |
EP1518882A1 (en) | 2003-09-24 | 2005-03-30 | Nippon Shokubai Co., Ltd. | Polyalkyleneimine alkylene oxide copolymer |
EP2267080A1 (en) | 2008-04-02 | 2010-12-29 | Mitsui Chemicals, Inc. | Composition and method for production thereof, porous material and method for production thereof, interlayer insulating film, semiconductor material, semiconductor device, and low-refractive-index surface protection film |
WO2009153834A1 (en) | 2008-06-18 | 2009-12-23 | 富士通株式会社 | Semiconductor device and method for manufacturing the same |
WO2010137711A1 (en) | 2009-05-29 | 2010-12-02 | 三井化学株式会社 | Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device |
EP2615635B1 (en) * | 2010-09-10 | 2016-05-25 | Mitsui Chemicals, Inc. | Semiconductor device production method and rinse |
US9042016B2 (en) * | 2011-10-12 | 2015-05-26 | Fujifilm Corporation | Optical film, method of producing optical film, antireflective film, polarizing plate and image display device |
CN104412376B (en) * | 2012-07-17 | 2017-02-08 | 三井化学株式会社 | Semiconductor device and method for manufacturing same, and rinsing fluid |
-
2014
- 2014-03-11 CN CN201480017656.2A patent/CN105051872B/en active Active
- 2014-03-11 JP JP2015508256A patent/JP6058788B2/en active Active
- 2014-03-11 WO PCT/JP2014/056340 patent/WO2014156616A1/en active Application Filing
- 2014-03-11 KR KR1020157026071A patent/KR101747582B1/en active IP Right Grant
- 2014-03-11 US US14/779,757 patent/US10020238B2/en active Active
- 2014-03-11 SG SG11201507968YA patent/SG11201507968YA/en unknown
- 2014-03-11 EP EP14773360.4A patent/EP2978011B1/en active Active
- 2014-03-20 TW TW103110403A patent/TWI640560B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI640560B (en) | 2018-11-11 |
TW201439167A (en) | 2014-10-16 |
EP2978011B1 (en) | 2018-05-02 |
US20160049343A1 (en) | 2016-02-18 |
CN105051872A (en) | 2015-11-11 |
WO2014156616A1 (en) | 2014-10-02 |
KR101747582B1 (en) | 2017-06-14 |
KR20150120510A (en) | 2015-10-27 |
US10020238B2 (en) | 2018-07-10 |
JP6058788B2 (en) | 2017-01-11 |
CN105051872B (en) | 2018-06-08 |
EP2978011A1 (en) | 2016-01-27 |
EP2978011A4 (en) | 2016-10-19 |
JPWO2014156616A1 (en) | 2017-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1223810A1 (en) | Method of making an absorbent composite and absorbent articles employing the same | |
ZA201603964B (en) | Vehicle component and vehicle component manufacturing method | |
EP2952097A4 (en) | Pest-control composition and pest-control method | |
EP2978019A4 (en) | Method for manufacturing bonded body and method for manufacturing power-module substrate | |
FI20135896A (en) | Composite body and method for making it | |
EP2952100A4 (en) | Pest-control composition and pest-control method | |
EP2944462A4 (en) | Laminate and method for producing same | |
EP2979542A4 (en) | Method for manufacturing excreta-processing material and excreta-processing material | |
EP3062315A4 (en) | Copper-resin composite body and method for producing same | |
EP2966042A4 (en) | Bismuth-vanadate-laminate manufacturing method and bismuth-vanadate laminate | |
EP3081746A4 (en) | Rotating body and method for manufacturing rotating body | |
GB201305414D0 (en) | Method and composition | |
EP2952099A4 (en) | Pest-control composition and pest-control method | |
EP2886589A4 (en) | Soft metal laminate and method for manufacturing same | |
EP2979858A4 (en) | Gas-barrier laminate and method for manufacturing gas-barrier laminate | |
EP2965904A4 (en) | Multilayer structure, multilayer structure manufacturing method and composition set | |
SG11201601292RA (en) | Polishing composition and method for producing same | |
EP2966186A4 (en) | Strength member and manufacturing method therefor | |
FI2994279T3 (en) | Method for the manufacturing of composite material | |
SG11201601265YA (en) | Polishing Composition and Method for Producing Same | |
EP2853370A4 (en) | Composite body and method for producing composite body | |
SG11201507968YA (en) | Method for manufacturing composite body and composition | |
EP2979855A4 (en) | Laminate and method for producing same | |
EP2842741A4 (en) | Laminate body and method for manufacturing same | |
EP2837646A4 (en) | Method for manufacturing ester composition, and resin composition |