SG11201505371UA - Hdd patterning using flowable cvd film - Google Patents
Hdd patterning using flowable cvd filmInfo
- Publication number
- SG11201505371UA SG11201505371UA SG11201505371UA SG11201505371UA SG11201505371UA SG 11201505371U A SG11201505371U A SG 11201505371UA SG 11201505371U A SG11201505371U A SG 11201505371UA SG 11201505371U A SG11201505371U A SG 11201505371UA SG 11201505371U A SG11201505371U A SG 11201505371UA
- Authority
- SG
- Singapore
- Prior art keywords
- hdd
- patterning
- cvd film
- flowable cvd
- flowable
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/85—Coating a support with a magnetic layer by vapour deposition
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/855—Coating only part of a support with a magnetic layer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361766197P | 2013-02-19 | 2013-02-19 | |
PCT/US2014/015877 WO2014130304A1 (en) | 2013-02-19 | 2014-02-11 | Hdd patterning using flowable cvd film |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201505371UA true SG11201505371UA (en) | 2015-09-29 |
Family
ID=51350405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201505371UA SG11201505371UA (en) | 2013-02-19 | 2014-02-11 | Hdd patterning using flowable cvd film |
Country Status (5)
Country | Link |
---|---|
US (1) | US8986557B2 (en) |
CN (1) | CN104995333B (en) |
MY (1) | MY171887A (en) |
SG (1) | SG11201505371UA (en) |
WO (1) | WO2014130304A1 (en) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9404178B2 (en) * | 2011-07-15 | 2016-08-02 | Applied Materials, Inc. | Surface treatment and deposition for reduced outgassing |
US20140175051A1 (en) * | 2012-12-21 | 2014-06-26 | Michael Feldbaum | Method of magnetic meida manufacturing |
US20160079034A1 (en) * | 2014-09-12 | 2016-03-17 | Applied Materials Inc. | Flowable film properties tuning using implantation |
US9355922B2 (en) | 2014-10-14 | 2016-05-31 | Applied Materials, Inc. | Systems and methods for internal surface conditioning in plasma processing equipment |
US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
US9896326B2 (en) | 2014-12-22 | 2018-02-20 | Applied Materials, Inc. | FCVD line bending resolution by deposition modulation |
US9777378B2 (en) | 2015-01-07 | 2017-10-03 | Applied Materials, Inc. | Advanced process flow for high quality FCVD films |
GB201514501D0 (en) * | 2015-08-14 | 2015-09-30 | Semblant Ltd | Electroless plating method |
TWI615504B (en) * | 2016-09-13 | 2018-02-21 | Zhang yu shun | Plasma generating device for remote plasma enhanced chemical vapor deposition system |
US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
US10847360B2 (en) | 2017-05-25 | 2020-11-24 | Applied Materials, Inc. | High pressure treatment of silicon nitride film |
US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
WO2018222771A1 (en) | 2017-06-02 | 2018-12-06 | Applied Materials, Inc. | Dry stripping of boron carbide hardmask |
US10269571B2 (en) | 2017-07-12 | 2019-04-23 | Applied Materials, Inc. | Methods for fabricating nanowire for semiconductor applications |
US10234630B2 (en) | 2017-07-12 | 2019-03-19 | Applied Materials, Inc. | Method for creating a high refractive index wave guide |
US10179941B1 (en) | 2017-07-14 | 2019-01-15 | Applied Materials, Inc. | Gas delivery system for high pressure processing chamber |
US10096516B1 (en) | 2017-08-18 | 2018-10-09 | Applied Materials, Inc. | Method of forming a barrier layer for through via applications |
US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
JP6947914B2 (en) | 2017-08-18 | 2021-10-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Annealing chamber under high pressure and high temperature |
JP7274461B2 (en) | 2017-09-12 | 2023-05-16 | アプライド マテリアルズ インコーポレイテッド | Apparatus and method for manufacturing semiconductor structures using protective barrier layers |
US10643867B2 (en) | 2017-11-03 | 2020-05-05 | Applied Materials, Inc. | Annealing system and method |
EP3707746B1 (en) | 2017-11-11 | 2023-12-27 | Micromaterials LLC | Gas delivery system for high pressure processing chamber |
WO2019099125A1 (en) | 2017-11-16 | 2019-05-23 | Applied Materials, Inc. | High pressure steam anneal processing apparatus |
JP2021503714A (en) | 2017-11-17 | 2021-02-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Capacitor system for high pressure processing system |
CN111699549A (en) | 2018-01-24 | 2020-09-22 | 应用材料公司 | Seam closure using high pressure annealing |
KR20230079236A (en) | 2018-03-09 | 2023-06-05 | 어플라이드 머티어리얼스, 인코포레이티드 | High pressure annealing process for metal containing materials |
US10714331B2 (en) | 2018-04-04 | 2020-07-14 | Applied Materials, Inc. | Method to fabricate thermally stable low K-FinFET spacer |
US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
US10566188B2 (en) | 2018-05-17 | 2020-02-18 | Applied Materials, Inc. | Method to improve film stability |
US10704141B2 (en) | 2018-06-01 | 2020-07-07 | Applied Materials, Inc. | In-situ CVD and ALD coating of chamber to control metal contamination |
US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
JP7179172B6 (en) | 2018-10-30 | 2022-12-16 | アプライド マテリアルズ インコーポレイテッド | Method for etching structures for semiconductor applications |
SG11202103763QA (en) | 2018-11-16 | 2021-05-28 | Applied Materials Inc | Film deposition using enhanced diffusion process |
WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8022416B2 (en) * | 2005-10-19 | 2011-09-20 | General Electric Company | Functional blocks for assembly |
US7498273B2 (en) | 2006-05-30 | 2009-03-03 | Applied Materials, Inc. | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
JP4703608B2 (en) * | 2007-06-28 | 2011-06-15 | 株式会社東芝 | Discrete track medium manufacturing method |
US7745352B2 (en) | 2007-08-27 | 2010-06-29 | Applied Materials, Inc. | Curing methods for silicon dioxide thin films deposited from alkoxysilane precursor with harp II process |
US7943531B2 (en) | 2007-10-22 | 2011-05-17 | Applied Materials, Inc. | Methods for forming a silicon oxide layer over a substrate |
JP2010061708A (en) * | 2008-09-01 | 2010-03-18 | Showa Denko Kk | Method of manufacturing magnetic recording medium, and magnetic recording/reproducing apparatus |
US8329587B2 (en) * | 2009-10-05 | 2012-12-11 | Applied Materials, Inc. | Post-planarization densification |
TWI612700B (en) * | 2010-07-28 | 2018-01-21 | 應用材料股份有限公司 | Resist fortification for magnetic media patterning |
US9284649B2 (en) * | 2011-06-30 | 2016-03-15 | Seagate Technology Llc | Method of patterning a stack |
WO2013077952A1 (en) * | 2011-11-23 | 2013-05-30 | Applied Materials, Inc. | Apparatus and methods for silicon oxide cvd photoresist planarization |
-
2014
- 2014-02-11 WO PCT/US2014/015877 patent/WO2014130304A1/en active Application Filing
- 2014-02-11 US US14/177,893 patent/US8986557B2/en not_active Expired - Fee Related
- 2014-02-11 CN CN201480008492.7A patent/CN104995333B/en not_active Expired - Fee Related
- 2014-02-11 MY MYPI2015001820A patent/MY171887A/en unknown
- 2014-02-11 SG SG11201505371UA patent/SG11201505371UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20140231384A1 (en) | 2014-08-21 |
WO2014130304A1 (en) | 2014-08-28 |
CN104995333A (en) | 2015-10-21 |
US8986557B2 (en) | 2015-03-24 |
CN104995333B (en) | 2017-09-22 |
MY171887A (en) | 2019-11-06 |
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