SG11201504013QA - An integrated electronic device including an interposer structure and a method for fabricating the same - Google Patents
An integrated electronic device including an interposer structure and a method for fabricating the sameInfo
- Publication number
- SG11201504013QA SG11201504013QA SG11201504013QA SG11201504013QA SG11201504013QA SG 11201504013Q A SG11201504013Q A SG 11201504013QA SG 11201504013Q A SG11201504013Q A SG 11201504013QA SG 11201504013Q A SG11201504013Q A SG 11201504013QA SG 11201504013Q A SG11201504013Q A SG 11201504013QA
- Authority
- SG
- Singapore
- Prior art keywords
- fabricating
- electronic device
- same
- device including
- integrated electronic
- Prior art date
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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IL223414A IL223414A (en) | 2012-12-04 | 2012-12-04 | Integrated electronic device and a method for fabricating the same |
PCT/IL2013/050962 WO2014087397A1 (en) | 2012-12-04 | 2013-11-24 | An integrated electronic device including an interposer structure and a method for fabricating the same |
Publications (1)
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SG11201504013QA true SG11201504013QA (en) | 2015-06-29 |
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Application Number | Title | Priority Date | Filing Date |
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SG11201504013QA SG11201504013QA (en) | 2012-12-04 | 2013-11-24 | An integrated electronic device including an interposer structure and a method for fabricating the same |
Country Status (7)
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US (1) | US9673172B2 (en) |
EP (1) | EP2929560B1 (en) |
KR (1) | KR102164533B1 (en) |
CN (1) | CN104937715B (en) |
IL (1) | IL223414A (en) |
SG (1) | SG11201504013QA (en) |
WO (1) | WO2014087397A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US10615111B2 (en) * | 2014-10-31 | 2020-04-07 | The Board Of Trustees Of The Leland Stanford Junior University | Interposer for multi-chip electronics packaging |
KR101672640B1 (en) * | 2015-06-23 | 2016-11-03 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor device |
US9613895B1 (en) * | 2016-03-03 | 2017-04-04 | Inotera Memories, Inc. | Semiconductor package with double side molding |
US9870967B2 (en) * | 2016-03-10 | 2018-01-16 | Analog Devices, Inc. | Plurality of seals for integrated device package |
CN108022905A (en) * | 2016-11-04 | 2018-05-11 | 超威半导体公司 | Use the switching board transmission line of multiple metal layers |
US10730743B2 (en) * | 2017-11-06 | 2020-08-04 | Analog Devices Global Unlimited Company | Gas sensor packages |
US10991660B2 (en) * | 2017-12-20 | 2021-04-27 | Alpha Anc Omega Semiconductor (Cayman) Ltd. | Semiconductor package having high mechanical strength |
EP3518278A1 (en) | 2018-01-30 | 2019-07-31 | Infineon Technologies AG | Power semiconductor module and method for producing the same |
US10832987B2 (en) | 2018-03-24 | 2020-11-10 | International Business Machines Corporation | Managing thermal warpage of a laminate |
CN111613601B (en) * | 2019-02-22 | 2023-09-22 | 爱思开海力士有限公司 | Semiconductor package including bridging wafer |
EP3935923A1 (en) * | 2019-03-06 | 2022-01-12 | TTM Technologies, Inc. | Methods for fabricating printed circuit board assemblies with high density via array |
US11524890B2 (en) * | 2019-10-31 | 2022-12-13 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages and methods of manufacturing the same |
US11211364B1 (en) * | 2020-06-24 | 2021-12-28 | Micron Technology, Inc. | Semiconductor device assemblies and systems with improved thermal performance and methods for making the same |
US11567119B2 (en) * | 2020-12-04 | 2023-01-31 | Advantest Test Solutions, Inc. | Testing system including active thermal interposer device |
CN116092949B (en) * | 2023-04-10 | 2023-06-09 | 北京华封集芯电子有限公司 | Method for manufacturing interposer, interposer and chip package |
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US5585671A (en) * | 1994-10-07 | 1996-12-17 | Nagesh; Voddarahalli K. | Reliable low thermal resistance package for high power flip clip ICs |
US7276787B2 (en) * | 2003-12-05 | 2007-10-02 | International Business Machines Corporation | Silicon chip carrier with conductive through-vias and method for fabricating same |
US7553752B2 (en) | 2007-06-20 | 2009-06-30 | Stats Chippac, Ltd. | Method of making a wafer level integration package |
US7911066B2 (en) * | 2007-08-29 | 2011-03-22 | Agilent Technologies, Inc. | Through-chip via interconnects for stacked integrated circuit structures |
US20090212420A1 (en) | 2008-02-22 | 2009-08-27 | Harry Hedler | integrated circuit device and method for fabricating same |
EP2284876A4 (en) * | 2008-06-05 | 2012-01-04 | Sumitomo Bakelite Co | Manufacturing method for semiconductor device and semiconductor device |
US9048233B2 (en) | 2010-05-26 | 2015-06-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package systems having interposers |
US8476115B2 (en) | 2011-05-03 | 2013-07-02 | Stats Chippac, Ltd. | Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material |
US10381326B2 (en) * | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
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EP2929560B1 (en) | 2023-12-06 |
IL223414A (en) | 2017-07-31 |
CN104937715B (en) | 2018-02-06 |
KR20150092182A (en) | 2015-08-12 |
KR102164533B1 (en) | 2020-10-13 |
CN104937715A (en) | 2015-09-23 |
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WO2014087397A1 (en) | 2014-06-12 |
US20150303173A1 (en) | 2015-10-22 |
US9673172B2 (en) | 2017-06-06 |
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