SG11201503874RA - Electrical connection interface for connecting electrical leads for high speed data transmission - Google Patents

Electrical connection interface for connecting electrical leads for high speed data transmission

Info

Publication number
SG11201503874RA
SG11201503874RA SG11201503874RA SG11201503874RA SG11201503874RA SG 11201503874R A SG11201503874R A SG 11201503874RA SG 11201503874R A SG11201503874R A SG 11201503874RA SG 11201503874R A SG11201503874R A SG 11201503874RA SG 11201503874R A SG11201503874R A SG 11201503874RA
Authority
SG
Singapore
Prior art keywords
data transmission
high speed
speed data
connection interface
electrical connection
Prior art date
Application number
SG11201503874RA
Inventor
Andrei Kaikkonen
Doron Lapidot
Lennart Lundqvist
Lars-Göte Svensson
Original Assignee
Tyco Electronics Svenska Holdings Ab
Tyco Electronics Japan G K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Svenska Holdings Ab, Tyco Electronics Japan G K filed Critical Tyco Electronics Svenska Holdings Ab
Publication of SG11201503874RA publication Critical patent/SG11201503874RA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
SG11201503874RA 2012-11-28 2013-06-28 Electrical connection interface for connecting electrical leads for high speed data transmission SG11201503874RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12194674.3A EP2739125A1 (en) 2012-11-28 2012-11-28 Electrical connection interface for connecting electrical leads for high speed data transmission
PCT/EP2013/063694 WO2014082761A1 (en) 2012-11-28 2013-06-28 Electrical connection interface for connecting electrical leads for high speed data transmission

Publications (1)

Publication Number Publication Date
SG11201503874RA true SG11201503874RA (en) 2015-06-29

Family

ID=47257643

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201503874RA SG11201503874RA (en) 2012-11-28 2013-06-28 Electrical connection interface for connecting electrical leads for high speed data transmission
SG10201704209QA SG10201704209QA (en) 2012-11-28 2013-06-28 Electrical connection interface for connecting electrical leads for high speed data transmission

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201704209QA SG10201704209QA (en) 2012-11-28 2013-06-28 Electrical connection interface for connecting electrical leads for high speed data transmission

Country Status (8)

Country Link
US (1) US9860972B2 (en)
EP (1) EP2739125A1 (en)
JP (1) JP6281151B2 (en)
CN (1) CN104996001B (en)
CA (1) CA2891678C (en)
IL (1) IL238806A0 (en)
SG (2) SG11201503874RA (en)
WO (1) WO2014082761A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK2775806T3 (en) * 2013-03-07 2015-06-01 Tyco Electronics Svenska Holdings Ab Optical receiver and transceiver operating this
US9544057B2 (en) 2013-09-17 2017-01-10 Finisar Corporation Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end
US9444165B2 (en) * 2014-09-16 2016-09-13 Via Technologies, Inc. Pin arrangement and electronic assembly
CN110677981A (en) * 2019-09-27 2020-01-10 北京神导科讯科技发展有限公司 Photoelectric detector signal processing circuit board and photoelectric detector
JP7066772B2 (en) * 2020-03-26 2022-05-13 株式会社日立製作所 Signal transmission circuit and printed circuit board
CN111511097B (en) * 2020-06-18 2020-12-29 深圳市欧博凯科技有限公司 High-speed transmission optical module circuit board structure and manufacturing method thereof and crosstalk prevention method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3818117A (en) * 1973-04-23 1974-06-18 E Reyner Low attenuation flat flexible cable
US3703604A (en) * 1971-11-30 1972-11-21 Amp Inc Flat conductor transmission cable
US5808529A (en) * 1996-07-12 1998-09-15 Storage Technology Corporation Printed circuit board layering configuration for very high bandwidth interconnect
JP3873416B2 (en) * 1997-12-04 2007-01-24 ブラザー工業株式会社 Printer
US7057115B2 (en) * 2004-01-26 2006-06-06 Litton Systems, Inc. Multilayered circuit board for high-speed, differential signals
JP2005244029A (en) * 2004-02-27 2005-09-08 Molex Inc Signal transport substrate and connection structure of signal transport substrate and connector
CN101673887B (en) * 2004-11-29 2013-04-10 Fci公司 Improved matched-impedance surface-mount technology footprints
JP2007123742A (en) * 2005-10-31 2007-05-17 Sony Corp Board connection structure, flex rigid board, optical transmission/reception module and optical transmission/reception device
US7362936B2 (en) * 2006-03-01 2008-04-22 Defense Photonics Group, Inc. Optical harness assembly and method
CN102282731B (en) * 2008-11-14 2015-10-21 莫列斯公司 resonance modifying connector
JP5686630B2 (en) * 2011-02-28 2015-03-18 三菱電機株式会社 Printed wiring board, optical communication module, optical communication device, module device, and arithmetic processing device
EP2701471B8 (en) * 2011-04-26 2017-09-27 Tyco Electronics Belgium EC bvba High speed input/output connection interface element and interconnection system with reduced cross-talk
JP5506737B2 (en) * 2011-05-27 2014-05-28 株式会社日立製作所 Signal transmission circuit
US9538637B2 (en) * 2011-06-29 2017-01-03 Finisar Corporation Multichannel RF feedthroughs
EP2541696A1 (en) * 2011-06-29 2013-01-02 Tyco Electronics Belgium EC BVBA Electrical connector
US9900101B2 (en) * 2012-04-30 2018-02-20 Hewlett Packard Enterprise Development Lp Transceiver module
EP2877885A4 (en) * 2012-07-27 2016-04-27 Hewlett Packard Development Co Optically connecting a chip package to an optical connector

Also Published As

Publication number Publication date
CN104996001A (en) 2015-10-21
JP6281151B2 (en) 2018-02-21
CN104996001B (en) 2018-08-31
SG10201704209QA (en) 2017-06-29
JP2016506063A (en) 2016-02-25
WO2014082761A1 (en) 2014-06-05
IL238806A0 (en) 2015-06-30
CA2891678C (en) 2018-07-24
CA2891678A1 (en) 2014-06-05
EP2739125A1 (en) 2014-06-04
US20150264803A1 (en) 2015-09-17
US9860972B2 (en) 2018-01-02

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