SG11201503691WA - Sputtering target for forming magnetic recording film, and carbon raw material used for production of said target - Google Patents

Sputtering target for forming magnetic recording film, and carbon raw material used for production of said target

Info

Publication number
SG11201503691WA
SG11201503691WA SG11201503691WA SG11201503691WA SG11201503691WA SG 11201503691W A SG11201503691W A SG 11201503691WA SG 11201503691W A SG11201503691W A SG 11201503691WA SG 11201503691W A SG11201503691W A SG 11201503691WA SG 11201503691W A SG11201503691W A SG 11201503691WA
Authority
SG
Singapore
Prior art keywords
target
production
raw material
magnetic recording
material used
Prior art date
Application number
SG11201503691WA
Inventor
Shin-Ichi Ogino
Yuichiro Nakamura
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201503691WA publication Critical patent/SG11201503691WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
    • H01F41/183—Sputtering targets therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
SG11201503691WA 2013-03-11 2014-02-10 Sputtering target for forming magnetic recording film, and carbon raw material used for production of said target SG11201503691WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013048333 2013-03-11
PCT/JP2014/053005 WO2014141789A1 (en) 2013-03-11 2014-02-10 Sputtering target for forming magnetic recording film, and carbon raw material used for production of said target

Publications (1)

Publication Number Publication Date
SG11201503691WA true SG11201503691WA (en) 2015-06-29

Family

ID=51536465

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503691WA SG11201503691WA (en) 2013-03-11 2014-02-10 Sputtering target for forming magnetic recording film, and carbon raw material used for production of said target

Country Status (3)

Country Link
JP (2) JP5973056B2 (en)
SG (1) SG11201503691WA (en)
WO (1) WO2014141789A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918108A (en) * 1983-05-20 1984-01-30 Central Glass Co Ltd Preparation of modified graphite fluoride
US20050227146A1 (en) * 2003-12-12 2005-10-13 Dania Ghantous Medium rate and high rate batteries
US7740825B2 (en) * 2004-03-31 2010-06-22 Stella Chemifa Corporation Method for forming a carbon nanotube aggregate
KR20080095909A (en) * 2006-02-21 2008-10-29 캘리포니아 인스티튜트 오브 테크놀로지 Electrochemistry of carbon subfluorides
CN102333905B (en) * 2009-03-27 2013-09-04 吉坤日矿日石金属株式会社 Ferromagnetic-material sputtering target of nonmagnetic-material particle dispersion type
WO2012073882A1 (en) * 2010-11-29 2012-06-07 三井金属鉱業株式会社 Sputtering target
CN103270554B (en) * 2010-12-20 2016-09-28 吉坤日矿日石金属株式会社 It is dispersed with the Fe-Pt type sputtering target of C particle

Also Published As

Publication number Publication date
WO2014141789A1 (en) 2014-09-18
JPWO2014141789A1 (en) 2017-02-16
JP6062586B2 (en) 2017-01-18
JP5973056B2 (en) 2016-08-23
JP2016173871A (en) 2016-09-29

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