SG11201406692WA - Electroplating processor with geometric electrolyte flow path - Google Patents

Electroplating processor with geometric electrolyte flow path

Info

Publication number
SG11201406692WA
SG11201406692WA SG11201406692WA SG11201406692WA SG11201406692WA SG 11201406692W A SG11201406692W A SG 11201406692WA SG 11201406692W A SG11201406692W A SG 11201406692WA SG 11201406692W A SG11201406692W A SG 11201406692WA SG 11201406692W A SG11201406692W A SG 11201406692WA
Authority
SG
Singapore
Prior art keywords
geometric
flow path
electrolyte flow
electroplating processor
electroplating
Prior art date
Application number
SG11201406692WA
Inventor
Randy A Harris
Daniel J Woodruff
Jeffrey I Turner
Gregory J Wilson
Paul R Mchugh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201406692WA publication Critical patent/SG11201406692WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electroplating Methods And Accessories (AREA)
SG11201406692WA 2012-05-10 2013-04-23 Electroplating processor with geometric electrolyte flow path SG11201406692WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/468,273 US8968533B2 (en) 2012-05-10 2012-05-10 Electroplating processor with geometric electrolyte flow path
PCT/US2013/037844 WO2013169477A1 (en) 2012-05-10 2013-04-23 Electroplating processor with geometric electrolyte flow path

Publications (1)

Publication Number Publication Date
SG11201406692WA true SG11201406692WA (en) 2014-11-27

Family

ID=49547798

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201609390RA SG10201609390RA (en) 2012-05-10 2013-04-23 Electroplating processor with geometric electrolyte flow path
SG11201406692WA SG11201406692WA (en) 2012-05-10 2013-04-23 Electroplating processor with geometric electrolyte flow path

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201609390RA SG10201609390RA (en) 2012-05-10 2013-04-23 Electroplating processor with geometric electrolyte flow path

Country Status (7)

Country Link
US (2) US8968533B2 (en)
KR (1) KR102056837B1 (en)
CN (2) CN107419320B (en)
DE (1) DE112013002400T5 (en)
SG (2) SG10201609390RA (en)
TW (2) TWI649457B (en)
WO (1) WO2013169477A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9469911B2 (en) 2015-01-21 2016-10-18 Applied Materials, Inc. Electroplating apparatus with membrane tube shield
US10047453B2 (en) * 2015-05-26 2018-08-14 Applied Materials, Inc. Electroplating apparatus
US10227706B2 (en) 2015-07-22 2019-03-12 Applied Materials, Inc. Electroplating apparatus with electrolyte agitation
US10858748B2 (en) 2017-06-30 2020-12-08 Apollo Energy Systems, Inc. Method of manufacturing hybrid metal foams
JP6993288B2 (en) * 2018-05-07 2022-01-13 株式会社荏原製作所 Plating equipment
PT3910095T (en) * 2020-05-11 2022-04-14 Semsysco Gmbh Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5954911A (en) 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6383352B1 (en) 1998-11-13 2002-05-07 Mykrolis Corporation Spiral anode for metal plating baths
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US6254742B1 (en) 1999-07-12 2001-07-03 Semitool, Inc. Diffuser with spiral opening pattern for an electroplating reactor vessel
JP2001234395A (en) 2000-02-28 2001-08-31 Tokyo Electron Ltd Wafer plating device
US7014947B2 (en) 2000-09-27 2006-03-21 Proton Energy Systems, Inc. Integral membrane support and frame structure
WO2002069426A2 (en) * 2001-02-27 2002-09-06 E.I. Dupont De Nemours And Company Fluid flow field plates for electrochemical devices
US6855235B2 (en) 2002-05-28 2005-02-15 Applied Materials, Inc. Anode impedance control through electrolyte flow control
JP4276413B2 (en) * 2002-09-25 2009-06-10 トヨタ自動車株式会社 Reactor device and manufacturing method thereof
US20040124090A1 (en) 2002-12-30 2004-07-01 Chen-Chung Du Wafer electroplating apparatus and method
KR100564799B1 (en) 2003-12-31 2006-03-27 동부아남반도체 주식회사 Device and method for electrochemical plating of Cu
TWI240300B (en) 2004-12-23 2005-09-21 Ind Tech Res Inst Wafer electroplating apparatus
TW200641189A (en) * 2005-02-25 2006-12-01 Applied Materials Inc Counter electrode encased in cation exchange membrane tube for electroplating cell
US20070261964A1 (en) * 2006-05-10 2007-11-15 Semitool, Inc. Reactors, systems, and methods for electroplating microfeature workpieces
US8291921B2 (en) * 2008-08-19 2012-10-23 Lam Research Corporation Removing bubbles from a fluid flowing down through a plenum
US7842173B2 (en) * 2007-01-29 2010-11-30 Semitool, Inc. Apparatus and methods for electrochemical processing of microfeature wafers
CN101435100B (en) * 2007-11-16 2011-04-06 联华电子股份有限公司 Fluid region control device and operation method thereof
KR100967256B1 (en) * 2007-12-10 2010-07-01 주식회사 동부하이텍 Cu electrochemical plating apparatus and plating method
US8475637B2 (en) 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
USD648289S1 (en) 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
US8496790B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor

Also Published As

Publication number Publication date
CN107419320B (en) 2019-08-13
KR20150013739A (en) 2015-02-05
CN104272435B (en) 2016-12-28
TWI568891B (en) 2017-02-01
WO2013169477A1 (en) 2013-11-14
TW201402873A (en) 2014-01-16
SG10201609390RA (en) 2016-12-29
US20150075976A1 (en) 2015-03-19
KR102056837B1 (en) 2019-12-17
TWI649457B (en) 2019-02-01
CN107419320A (en) 2017-12-01
TW201712167A (en) 2017-04-01
CN104272435A (en) 2015-01-07
US20130299343A1 (en) 2013-11-14
DE112013002400T5 (en) 2015-02-05
US8968533B2 (en) 2015-03-03

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