SG11201406454UA - Aluminium coated copper ribbon - Google Patents

Aluminium coated copper ribbon

Info

Publication number
SG11201406454UA
SG11201406454UA SG11201406454UA SG11201406454UA SG11201406454UA SG 11201406454U A SG11201406454U A SG 11201406454UA SG 11201406454U A SG11201406454U A SG 11201406454UA SG 11201406454U A SG11201406454U A SG 11201406454UA SG 11201406454U A SG11201406454U A SG 11201406454UA
Authority
SG
Singapore
Prior art keywords
coated copper
aluminium coated
copper ribbon
ribbon
aluminium
Prior art date
Application number
SG11201406454UA
Inventor
Eugen Milke
Peter Prenosil
Sven Thomas
Original Assignee
Heraeus Materials Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Tech Gmbh filed Critical Heraeus Materials Tech Gmbh
Publication of SG11201406454UA publication Critical patent/SG11201406454UA/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
    • B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C9/00—Cooling, heating or lubricating drawing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/1275—Next to Group VIII or IB metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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KR100717667B1 (en) * 2000-09-18 2007-05-11 신닛뽄세이테쯔 카부시키카이샤 Bonding wire for semiconductor and method of manufacturing the bonding wire
US20040217488A1 (en) * 2003-05-02 2004-11-04 Luechinger Christoph B. Ribbon bonding
DE102006023167B3 (en) * 2006-05-17 2007-12-13 Infineon Technologies Ag Bonding wire, manufacturing method for a bonding wire and wedge-wedge wire bonding method
JP4390799B2 (en) * 2006-11-21 2009-12-24 株式会社日立製作所 Connection material, method for manufacturing connection material, and semiconductor device
US8022558B2 (en) * 2009-02-13 2011-09-20 Infineon Technologies Ag Semiconductor package with ribbon with metal layers
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JP2011192840A (en) * 2010-03-15 2011-09-29 Tanaka Electronics Ind Co Ltd Flat aluminum coated copper ribbon for semiconductor element
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DE102010031993B4 (en) 2010-07-22 2015-03-12 Heraeus Materials Technology Gmbh & Co. Kg A method of manufacturing a bonding wire, bonding wire and assembly comprising such a bonding wire.
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EP3557609A1 (en) 2019-10-23
KR20150013715A (en) 2015-02-05
JP6211065B2 (en) 2017-10-11
JP2015516114A (en) 2015-06-04
EP2662889A1 (en) 2013-11-13
WO2013167614A1 (en) 2013-11-14
PH12014502389A1 (en) 2014-12-22
CN104285287A (en) 2015-01-14
CN104285287B (en) 2018-05-29
US9214444B2 (en) 2015-12-15

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