SG11201403543QA - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
SG11201403543QA
SG11201403543QA SG11201403543QA SG11201403543QA SG11201403543QA SG 11201403543Q A SG11201403543Q A SG 11201403543QA SG 11201403543Q A SG11201403543Q A SG 11201403543QA SG 11201403543Q A SG11201403543Q A SG 11201403543QA SG 11201403543Q A SG11201403543Q A SG 11201403543QA
Authority
SG
Singapore
Prior art keywords
wire bonding
bonding apparatus
wire
bonding
Prior art date
Application number
SG11201403543QA
Inventor
Toru Maeda
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201403543QA publication Critical patent/SG11201403543QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7801—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78601—Storing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8501—Cleaning, e.g. oxide removal step, desmearing
    • H01L2224/85013—Plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00015—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
SG11201403543QA 2012-02-07 2012-09-06 Wire bonding apparatus SG11201403543QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012023722A JP5296233B2 (en) 2012-02-07 2012-02-07 Wire bonding equipment
PCT/JP2012/072783 WO2013118340A1 (en) 2012-02-07 2012-09-06 Wire bonding apparatus

Publications (1)

Publication Number Publication Date
SG11201403543QA true SG11201403543QA (en) 2014-10-30

Family

ID=48947128

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10201606486RA SG10201606486RA (en) 2012-02-07 2012-09-06 Wire bonding apparatus
SG11201403543QA SG11201403543QA (en) 2012-02-07 2012-09-06 Wire bonding apparatus
SG10202101224YA SG10202101224YA (en) 2012-02-07 2012-09-06 Wire bonding apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201606486RA SG10201606486RA (en) 2012-02-07 2012-09-06 Wire bonding apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10202101224YA SG10202101224YA (en) 2012-02-07 2012-09-06 Wire bonding apparatus

Country Status (7)

Country Link
US (1) US20140332583A1 (en)
JP (1) JP5296233B2 (en)
KR (1) KR101718340B1 (en)
CN (1) CN103999204B (en)
SG (3) SG10201606486RA (en)
TW (1) TWI509718B (en)
WO (1) WO2013118340A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103930980B (en) * 2012-01-26 2016-11-23 株式会社新川 The blower unit of the gas of anti-oxidation
WO2014054305A1 (en) * 2012-10-05 2014-04-10 株式会社新川 Antioxidant gas blow-off unit
JP2014075519A (en) 2012-10-05 2014-04-24 Shinkawa Ltd Antioxidation gas blower unit
JP5916814B2 (en) * 2014-08-06 2016-05-11 株式会社カイジョー Bonding method and bonding apparatus
TWI578468B (en) * 2015-12-31 2017-04-11 矽品精密工業股份有限公司 Wire-bonding device and wire-bonding method
TW201816909A (en) * 2016-10-27 2018-05-01 矽品精密工業股份有限公司 Mounting apparatus and mounting method
TWI677068B (en) * 2017-05-24 2019-11-11 日商新川股份有限公司 Wire bonding device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6158246A (en) * 1984-08-30 1986-03-25 Toshiba Corp Wire bonding method
JPS6215828A (en) * 1985-07-12 1987-01-24 Nec Kansai Ltd Wire bonding method
DE69405209T2 (en) * 1994-03-31 1998-03-19 Sgs Thomson Microelectronics Connection device for electronic semiconductor units
JP2000340599A (en) 1999-05-26 2000-12-08 Canon Inc Wire-bonding device and wire-bonding method using the same
US6320155B1 (en) * 2000-01-11 2001-11-20 Geomat Insights, Llc Plasma enhanced wire bonder
JP2002083837A (en) * 2000-09-07 2002-03-22 Shinkawa Ltd Wire bonding apparatus
JP3885867B2 (en) * 2000-11-29 2007-02-28 日本電気株式会社 Wire bonding equipment
KR20040080580A (en) * 2003-03-12 2004-09-20 삼성전자주식회사 Wire bonder having air plasma cleaner
CN1319658C (en) * 2003-09-09 2007-06-06 株式会社岛津制作所 Plasma washing equipment
WO2006048649A1 (en) * 2004-11-05 2006-05-11 Dow Corning Ireland Limited Plasma system
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
JP4787104B2 (en) * 2006-07-31 2011-10-05 株式会社新川 Bonding equipment
JP4700633B2 (en) * 2007-02-15 2011-06-15 株式会社新川 Wire cleaning guide
JP4762934B2 (en) * 2007-02-28 2011-08-31 株式会社新川 Horn mounting arm
JP4369507B2 (en) * 2007-12-07 2009-11-25 株式会社新川 Bonding apparatus and bonding method

Also Published As

Publication number Publication date
JP5296233B2 (en) 2013-09-25
KR101718340B1 (en) 2017-04-04
CN103999204A (en) 2014-08-20
CN103999204B (en) 2016-09-14
SG10202101224YA (en) 2021-03-30
TW201340225A (en) 2013-10-01
US20140332583A1 (en) 2014-11-13
TWI509718B (en) 2015-11-21
SG10201606486RA (en) 2016-09-29
KR20140104451A (en) 2014-08-28
JP2013161994A (en) 2013-08-19
WO2013118340A1 (en) 2013-08-15

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