SG11201403124SA - A method for fabricating a semiconductor device - Google Patents

A method for fabricating a semiconductor device

Info

Publication number
SG11201403124SA
SG11201403124SA SG11201403124SA SG11201403124SA SG11201403124SA SG 11201403124S A SG11201403124S A SG 11201403124SA SG 11201403124S A SG11201403124S A SG 11201403124SA SG 11201403124S A SG11201403124S A SG 11201403124SA SG 11201403124S A SG11201403124S A SG 11201403124SA
Authority
SG
Singapore
Prior art keywords
fabricating
semiconductor device
semiconductor
Prior art date
Application number
SG11201403124SA
Inventor
Oleg Kononchuck
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11201403124SA publication Critical patent/SG11201403124SA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/31051Planarisation of the insulating layers
    • H01L21/31053Planarisation of the insulating layers involving a dielectric removal step
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3178Coating or filling in grooves made in the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/30Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
    • H01L29/34Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being on the surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Element Separation (AREA)
  • Photovoltaic Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
SG11201403124SA 2010-12-27 2011-12-15 A method for fabricating a semiconductor device SG11201403124SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1005132A FR2969813B1 (en) 2010-12-27 2010-12-27 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
PCT/EP2011/006348 WO2012089314A2 (en) 2010-12-27 2011-12-15 A method for fabricating a semiconductor device

Publications (1)

Publication Number Publication Date
SG11201403124SA true SG11201403124SA (en) 2014-10-30

Family

ID=45406655

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201403124SA SG11201403124SA (en) 2010-12-27 2011-12-15 A method for fabricating a semiconductor device

Country Status (9)

Country Link
US (1) US20150014824A1 (en)
JP (1) JP2015501084A (en)
KR (1) KR20140092889A (en)
CN (1) CN104054186A (en)
DE (1) DE112011106034T5 (en)
FR (1) FR2969813B1 (en)
SG (1) SG11201403124SA (en)
TW (1) TW201234623A (en)
WO (1) WO2012089314A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2969815B1 (en) * 2010-12-27 2013-11-22 Soitec Silicon On Insulator Tech METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
US10453947B1 (en) * 2018-06-12 2019-10-22 Vanguard International Semiconductor Corporation Semiconductor structure and high electron mobility transistor with a substrate having a pit, and methods for fabricating semiconductor structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3806771A (en) * 1969-05-05 1974-04-23 Gen Electric Smoothly beveled semiconductor device with thick glass passivant
US4197141A (en) * 1978-01-31 1980-04-08 Massachusetts Institute Of Technology Method for passivating imperfections in semiconductor materials
US4431858A (en) * 1982-05-12 1984-02-14 University Of Florida Method of making quasi-grain boundary-free polycrystalline solar cell structure and solar cell structure obtained thereby
JPS6294941A (en) * 1985-10-21 1987-05-01 Sharp Corp Compound semiconductor device
FR2631488B1 (en) * 1988-05-10 1990-07-27 Thomson Hybrides Microondes PLANAR-TYPE INTEGRATED MICROWAVE CIRCUIT, COMPRISING AT LEAST ONE MESA COMPONENT, AND MANUFACTURING METHOD THEREOF
JP2542447B2 (en) * 1990-04-13 1996-10-09 三菱電機株式会社 Solar cell and method of manufacturing the same
JP3988018B2 (en) 2001-01-18 2007-10-10 ソニー株式会社 Crystal film, crystal substrate and semiconductor device
JP3801091B2 (en) * 2002-05-09 2006-07-26 富士電機デバイステクノロジー株式会社 Silicon carbide semiconductor device and manufacturing method thereof
JP2007059719A (en) * 2005-08-25 2007-03-08 Nippon Telegr & Teleph Corp <Ntt> Nitride semiconductor
US8236593B2 (en) * 2007-05-14 2012-08-07 Soitec Methods for improving the quality of epitaxially-grown semiconductor materials
GB0806556D0 (en) * 2008-04-11 2008-05-14 Isis Innovation Silicon wafers
JP5617175B2 (en) * 2008-04-17 2014-11-05 富士電機株式会社 Wide band gap semiconductor device and manufacturing method thereof
US20130008508A1 (en) * 2010-03-18 2013-01-10 National University Corporation Kyoto Institute Of Technology Light absorbing material and photoelectric conversion element

Also Published As

Publication number Publication date
DE112011106034T5 (en) 2014-09-04
JP2015501084A (en) 2015-01-08
WO2012089314A3 (en) 2012-10-18
TW201234623A (en) 2012-08-16
CN104054186A (en) 2014-09-17
US20150014824A1 (en) 2015-01-15
KR20140092889A (en) 2014-07-24
FR2969813A1 (en) 2012-06-29
FR2969813B1 (en) 2013-11-08
WO2012089314A2 (en) 2012-07-05

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