SG11201403059WA - Low dielectric photoimageable compositions and electronic devices made therefrom - Google Patents
Low dielectric photoimageable compositions and electronic devices made therefromInfo
- Publication number
- SG11201403059WA SG11201403059WA SG11201403059WA SG11201403059WA SG11201403059WA SG 11201403059W A SG11201403059W A SG 11201403059WA SG 11201403059W A SG11201403059W A SG 11201403059WA SG 11201403059W A SG11201403059W A SG 11201403059WA SG 11201403059W A SG11201403059W A SG 11201403059WA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic devices
- low dielectric
- made therefrom
- devices made
- photoimageable compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/369,809 US8871425B2 (en) | 2012-02-09 | 2012-02-09 | Low dielectric photoimageable compositions and electronic devices made therefrom |
PCT/IB2013/000170 WO2013117989A1 (en) | 2012-02-09 | 2013-02-08 | Low dielectric photoimageable compositions and electronic devices made therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201403059WA true SG11201403059WA (en) | 2014-07-30 |
Family
ID=47913498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201403059WA SG11201403059WA (en) | 2012-02-09 | 2013-02-08 | Low dielectric photoimageable compositions and electronic devices made therefrom |
Country Status (9)
Country | Link |
---|---|
US (1) | US8871425B2 (en) |
EP (1) | EP2812399B1 (en) |
JP (1) | JP5941559B2 (en) |
KR (1) | KR101904582B1 (en) |
CN (1) | CN104093784B (en) |
PH (1) | PH12014501731B1 (en) |
SG (1) | SG11201403059WA (en) |
TW (1) | TWI544280B (en) |
WO (1) | WO2013117989A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6213270B2 (en) * | 2014-01-31 | 2017-10-18 | 住友化学株式会社 | Polysilsesquioxane encapsulant composition for UV-LED and use of solvent therefor |
CN104282250B (en) * | 2014-10-24 | 2016-08-31 | 深圳市华星光电技术有限公司 | In TFT MIS structure design control method and system |
US10544329B2 (en) | 2015-04-13 | 2020-01-28 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
US10254650B2 (en) | 2016-06-29 | 2019-04-09 | Honeywell International Inc. | Low temperature SC1 strippable oxysilane-containing coatings |
JP2019535840A (en) | 2016-08-22 | 2019-12-12 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | Compound for optical devices |
WO2018050526A1 (en) | 2016-09-13 | 2018-03-22 | Merck Patent Gmbh | Light luminescent particle |
US10544330B2 (en) * | 2017-01-20 | 2020-01-28 | Honeywell International Inc. | Gap filling dielectric materials |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4442197A (en) | 1982-01-11 | 1984-04-10 | General Electric Company | Photocurable compositions |
ATE37242T1 (en) | 1984-02-10 | 1988-09-15 | Ciba Geigy Ag | PROCESS FOR PRODUCING A PROTECTIVE COATING OR A RELIEF IMAGE. |
US4603101A (en) | 1985-09-27 | 1986-07-29 | General Electric Company | Photoresist compositions containing t-substituted organomethyl vinylaryl ether materials |
JPH06148895A (en) | 1992-11-06 | 1994-05-27 | Toray Ind Inc | Photosensitive resin composition and pattern forming method using that |
TW526390B (en) | 1997-06-26 | 2003-04-01 | Shinetsu Chemical Co | Resist compositions |
US5962067A (en) * | 1997-09-09 | 1999-10-05 | Lucent Technologies Inc. | Method for coating an article with a ladder siloxane polymer and coated article |
TW588072B (en) | 2000-10-10 | 2004-05-21 | Shipley Co Llc | Antireflective porogens |
TW594416B (en) * | 2001-05-08 | 2004-06-21 | Shipley Co Llc | Photoimageable composition |
JP2004165613A (en) | 2002-06-03 | 2004-06-10 | Shipley Co Llc | Manufacture of electronic device |
US7041748B2 (en) * | 2003-01-08 | 2006-05-09 | International Business Machines Corporation | Patternable low dielectric constant materials and their use in ULSI interconnection |
JP5102428B2 (en) * | 2003-11-25 | 2012-12-19 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Waveguide composition and waveguide formed therefrom |
DE602005001341T2 (en) * | 2004-04-14 | 2008-02-21 | Rohm and Haas Electronic Materials, L.L.C., Marlborough | Waveguide compositions and waveguides made therefrom |
JP4491283B2 (en) * | 2004-06-10 | 2010-06-30 | 信越化学工業株式会社 | Pattern formation method using antireflection film-forming composition |
EP1940989B1 (en) * | 2005-09-29 | 2010-12-15 | Dow Corning Corporation | Method of releasing high temperature films and/or devices from metallic substrates |
US8013077B2 (en) * | 2007-03-02 | 2011-09-06 | Fujifilm Corporation | Insulating film forming composition and production method of insulating film |
US7754510B2 (en) | 2007-04-02 | 2010-07-13 | Xerox Corporation | Phase-separated dielectric structure fabrication process |
JP2009199061A (en) * | 2007-11-12 | 2009-09-03 | Rohm & Haas Electronic Materials Llc | Coating compositions for use with overcoated photoresist |
TWI384025B (en) * | 2009-04-27 | 2013-02-01 | Ind Tech Res Inst | Polyvinyl alcohol film composition, and polarizer plate employing the same |
US8431670B2 (en) | 2009-08-31 | 2013-04-30 | International Business Machines Corporation | Photo-patternable dielectric materials and formulations and methods of use |
US8196655B2 (en) * | 2009-08-31 | 2012-06-12 | Halliburton Energy Services, Inc. | Selective placement of conformance treatments in multi-zone well completions |
US8389663B2 (en) * | 2009-10-08 | 2013-03-05 | International Business Machines Corporation | Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof |
JP2011154214A (en) * | 2010-01-27 | 2011-08-11 | Jsr Corp | Negative radiation-sensitive composition, cured pattern forming method and cured pattern |
JP5544239B2 (en) * | 2010-07-29 | 2014-07-09 | 富士フイルム株式会社 | Polymerizable composition |
KR20140007405A (en) * | 2011-03-30 | 2014-01-17 | 제온 코포레이션 | Resin composition and semiconductor element substrate |
-
2012
- 2012-02-09 US US13/369,809 patent/US8871425B2/en active Active
-
2013
- 2013-02-08 KR KR1020147018889A patent/KR101904582B1/en active IP Right Grant
- 2013-02-08 EP EP13711124.1A patent/EP2812399B1/en not_active Not-in-force
- 2013-02-08 TW TW102105212A patent/TWI544280B/en active
- 2013-02-08 SG SG11201403059WA patent/SG11201403059WA/en unknown
- 2013-02-08 CN CN201380006618.2A patent/CN104093784B/en active Active
- 2013-02-08 JP JP2014556147A patent/JP5941559B2/en not_active Expired - Fee Related
- 2013-02-08 WO PCT/IB2013/000170 patent/WO2013117989A1/en active Application Filing
-
2014
- 2014-07-31 PH PH12014501731A patent/PH12014501731B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201341963A (en) | 2013-10-16 |
CN104093784B (en) | 2016-09-21 |
PH12014501731A1 (en) | 2014-11-17 |
CN104093784A (en) | 2014-10-08 |
US8871425B2 (en) | 2014-10-28 |
US20130209754A1 (en) | 2013-08-15 |
JP2015508184A (en) | 2015-03-16 |
EP2812399A1 (en) | 2014-12-17 |
EP2812399B1 (en) | 2016-04-20 |
KR101904582B1 (en) | 2018-10-04 |
WO2013117989A1 (en) | 2013-08-15 |
KR20140117391A (en) | 2014-10-07 |
PH12014501731B1 (en) | 2014-11-17 |
JP5941559B2 (en) | 2016-06-29 |
TWI544280B (en) | 2016-08-01 |
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