SG11201401601TA - Temperature system having an impurity filter - Google Patents
Temperature system having an impurity filterInfo
- Publication number
- SG11201401601TA SG11201401601TA SG11201401601TA SG11201401601TA SG11201401601TA SG 11201401601T A SG11201401601T A SG 11201401601TA SG 11201401601T A SG11201401601T A SG 11201401601TA SG 11201401601T A SG11201401601T A SG 11201401601TA SG 11201401601T A SG11201401601T A SG 11201401601TA
- Authority
- SG
- Singapore
- Prior art keywords
- temperature system
- impurity filter
- impurity
- filter
- temperature
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B43/00—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat
- F25B43/003—Filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B19/00—Machines, plants or systems, using evaporation of a refrigerant but without recovery of the vapour
- F25B19/005—Machines, plants or systems, using evaporation of a refrigerant but without recovery of the vapour the refrigerant being a liquefied gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2400/00—General features of, or devices for refrigerators, cold rooms, ice-boxes, or for cooling or freezing apparatus not covered by any other subclass
- F25D2400/02—Refrigerators including a heater
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Filtering Materials (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Control Of Temperature (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/274,967 US9335080B2 (en) | 2011-10-17 | 2011-10-17 | Temperature system having an impurity filter |
PCT/US2012/060599 WO2013059307A2 (en) | 2011-10-17 | 2012-10-17 | Temperature system having an impurity filter |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201401601TA true SG11201401601TA (en) | 2014-08-28 |
Family
ID=47178903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201401601TA SG11201401601TA (en) | 2011-10-17 | 2012-10-17 | Temperature system having an impurity filter |
Country Status (6)
Country | Link |
---|---|
US (1) | US9335080B2 (en) |
EP (1) | EP2769164B1 (en) |
JP (1) | JP2015503073A (en) |
CN (1) | CN104114973A (en) |
SG (1) | SG11201401601TA (en) |
WO (1) | WO2013059307A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106015816B (en) * | 2016-07-12 | 2018-12-04 | 中国石油化工股份有限公司 | A kind of self-heating heat preservation oil pipeline and method |
CN106320948A (en) * | 2016-08-22 | 2017-01-11 | 孟玲 | Perspective window with anti-fogging effect |
US11493242B2 (en) | 2018-11-27 | 2022-11-08 | Aktiebolaget Skf | Cooling system for a refrigerant lubricated bearing assembly |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2631731A (en) * | 1949-06-21 | 1953-03-17 | Curtiss Wright Corp | Ice removal device |
JPH02299206A (en) * | 1989-05-15 | 1990-12-11 | Toshiba Corp | High-tension electrical apparatus |
JP3021707B2 (en) | 1991-02-05 | 2000-03-15 | ダイキン工業株式会社 | Liquid tank type thermal shock test equipment |
US5423194A (en) * | 1993-10-15 | 1995-06-13 | Valany Marketing Inc. | Chilled service bowl |
US5796111A (en) * | 1995-10-30 | 1998-08-18 | Phrasor Scientific, Inc. | Apparatus for cleaning contaminated surfaces using energetic cluster beams |
EP0911078A1 (en) | 1997-10-20 | 1999-04-28 | Hitachi Metals, Ltd. | Photocatalyst-supporting body and photocatalytic apparatus |
US6328096B1 (en) | 1997-12-31 | 2001-12-11 | Temptronic Corporation | Workpiece chuck |
US6073681A (en) | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
US6019164A (en) | 1997-12-31 | 2000-02-01 | Temptronic Corporation | Workpiece chuck |
EP1196790B1 (en) * | 1999-07-15 | 2004-05-19 | Delta Design, Inc. | Apparatus and method for temperature control of ic device during test |
JP2001066027A (en) | 1999-08-24 | 2001-03-16 | Daikin Ind Ltd | Ice particle capturing unit and ice storage unit |
GB0015123D0 (en) | 2000-06-20 | 2000-08-09 | Air Prod & Chem | Process and apparatus for removal of volatile compounds from process gases |
EP1356499A2 (en) | 2000-07-10 | 2003-10-29 | Temptronic Corporation | Wafer chuck with interleaved heating and cooling elements |
AU2002224581A1 (en) | 2000-07-21 | 2002-02-05 | Temptronic Corporation | Temperature-controlled thermal platform for automated testing |
JP2002224513A (en) | 2001-02-01 | 2002-08-13 | Tokyo Gas Co Ltd | Filter |
JP2002305095A (en) | 2001-04-04 | 2002-10-18 | Taiyo Techno Kk | Method of eliminating static charge from insulating liquid and static charge eliminating filter unit |
JP3721512B2 (en) | 2001-07-24 | 2005-11-30 | 春日電機株式会社 | Blower static neutralizer |
US20060196653A1 (en) | 2005-03-04 | 2006-09-07 | Elsdoerfer Norbert W | Apparatus and method for controlling temperature in a chuck system |
JP2006283991A (en) | 2005-03-31 | 2006-10-19 | Sumitomo Heavy Ind Ltd | Cooling system |
JP2009144998A (en) | 2007-12-14 | 2009-07-02 | Sumitomo Heavy Ind Ltd | Cooling unit |
JP2010002136A (en) | 2008-06-20 | 2010-01-07 | Daikin Ind Ltd | Air conditioning apparatus |
JP5359772B2 (en) | 2009-10-21 | 2013-12-04 | 凸版印刷株式会社 | Method for removing moisture in resist and resist coating apparatus |
-
2011
- 2011-10-17 US US13/274,967 patent/US9335080B2/en active Active
-
2012
- 2012-10-17 SG SG11201401601TA patent/SG11201401601TA/en unknown
- 2012-10-17 WO PCT/US2012/060599 patent/WO2013059307A2/en active Application Filing
- 2012-10-17 JP JP2014537174A patent/JP2015503073A/en active Pending
- 2012-10-17 EP EP12787215.8A patent/EP2769164B1/en active Active
- 2012-10-17 CN CN201280062428.8A patent/CN104114973A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2013059307A2 (en) | 2013-04-25 |
JP2015503073A (en) | 2015-01-29 |
EP2769164A2 (en) | 2014-08-27 |
WO2013059307A3 (en) | 2013-10-10 |
US9335080B2 (en) | 2016-05-10 |
CN104114973A (en) | 2014-10-22 |
EP2769164B1 (en) | 2019-07-17 |
US20130092356A1 (en) | 2013-04-18 |
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