SG11201401302XA - Method of packaging encapsulating resin composition, package and method of transporting package - Google Patents
Method of packaging encapsulating resin composition, package and method of transporting packageInfo
- Publication number
- SG11201401302XA SG11201401302XA SG11201401302XA SG11201401302XA SG11201401302XA SG 11201401302X A SG11201401302X A SG 11201401302XA SG 11201401302X A SG11201401302X A SG 11201401302XA SG 11201401302X A SG11201401302X A SG 11201401302XA SG 11201401302X A SG11201401302X A SG 11201401302XA
- Authority
- SG
- Singapore
- Prior art keywords
- package
- resin composition
- encapsulating resin
- transporting
- packaging encapsulating
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000004806 packaging method and process Methods 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012044268 | 2012-02-29 | ||
| PCT/JP2013/001093 WO2013128889A1 (en) | 2012-02-29 | 2013-02-26 | Method for packing encapsulating resin composition, package, and transportation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201401302XA true SG11201401302XA (en) | 2014-09-26 |
Family
ID=49082102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201401302XA SG11201401302XA (en) | 2012-02-29 | 2013-02-26 | Method of packaging encapsulating resin composition, package and method of transporting package |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150018458A1 (en) |
| JP (1) | JP6225897B2 (en) |
| KR (1) | KR101886904B1 (en) |
| CN (1) | CN104024126B (en) |
| SG (1) | SG11201401302XA (en) |
| TW (1) | TWI593605B (en) |
| WO (1) | WO2013128889A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10561509B2 (en) | 2013-03-13 | 2020-02-18 | DePuy Synthes Products, Inc. | Braided stent with expansion ring and method of delivery |
| CN105358452B (en) * | 2013-07-10 | 2017-05-17 | 住友电木株式会社 | Beverage preparation capsules for delivery of functional ingredients |
| JP7249733B2 (en) * | 2015-05-27 | 2023-03-31 | 三菱瓦斯化学株式会社 | Method for producing hydroxy-substituted aromatic compound and method for packing |
| US10292851B2 (en) | 2016-09-30 | 2019-05-21 | DePuy Synthes Products, Inc. | Self-expanding device delivery apparatus with dual function bump |
| AU2019204522A1 (en) | 2018-07-30 | 2020-02-13 | DePuy Synthes Products, Inc. | Systems and methods of manufacturing and using an expansion ring |
| US10456280B1 (en) | 2018-08-06 | 2019-10-29 | DePuy Synthes Products, Inc. | Systems and methods of using a braided implant |
| JP6989044B1 (en) * | 2021-03-31 | 2022-01-05 | 住友ベークライト株式会社 | Manufacturing method of sealed structure and tablet |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141257U (en) * | 1985-02-21 | 1986-09-01 | ||
| JPH09240748A (en) * | 1996-03-02 | 1997-09-16 | Kao Corp | Container for powder |
| US6308826B1 (en) * | 1996-05-29 | 2001-10-30 | Mallinckrodt Inc. | Bulk packaging system and method for retarding caking of organic and inorganic chemical compounds |
| JP2000229668A (en) * | 1999-02-12 | 2000-08-22 | Nikken Kasei Kk | Method and container for preventing sugar-alcohol consolidation |
| JP4535213B2 (en) * | 1999-02-12 | 2010-09-01 | 日東電工株式会社 | Powder semiconductor encapsulant |
| JP3940945B2 (en) * | 1999-11-30 | 2007-07-04 | 大日本インキ化学工業株式会社 | Epoxy resin composition for sealing electronic parts |
| JP2001234196A (en) * | 1999-12-14 | 2001-08-28 | Lion Corp | Granular detergent composition and granular detergent composition filled in transparent container |
| JP2002347750A (en) * | 2001-05-24 | 2002-12-04 | Konica Corp | Packing box |
| JP2003128148A (en) * | 2001-10-23 | 2003-05-08 | Rengo Co Ltd | Cushioning member made of corrugated board |
| JP2004090971A (en) | 2002-08-30 | 2004-03-25 | Hitachi Chem Co Ltd | Packaging method for epoxide resin molding material for sealing semiconductor |
| JP4433368B2 (en) * | 2003-04-08 | 2010-03-17 | ジャパンエポキシレジン株式会社 | Epoxy resin granulated product and production method thereof |
| JP2004352288A (en) * | 2003-05-29 | 2004-12-16 | Sanyo Chem Ind Ltd | Flexible container bag |
| JP2007020710A (en) * | 2005-07-13 | 2007-02-01 | Terumo Corp | Medical container packing body |
| JP5277569B2 (en) * | 2007-06-11 | 2013-08-28 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| SG172031A1 (en) * | 2008-12-10 | 2011-07-28 | Sumitomo Bakelite Co | Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device |
-
2013
- 2013-02-26 US US14/371,140 patent/US20150018458A1/en not_active Abandoned
- 2013-02-26 WO PCT/JP2013/001093 patent/WO2013128889A1/en active Application Filing
- 2013-02-26 JP JP2014502030A patent/JP6225897B2/en active Active
- 2013-02-26 SG SG11201401302XA patent/SG11201401302XA/en unknown
- 2013-02-26 KR KR1020147009511A patent/KR101886904B1/en active IP Right Grant
- 2013-02-26 CN CN201380004637.1A patent/CN104024126B/en active Active
- 2013-02-27 TW TW102106895A patent/TWI593605B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104024126A (en) | 2014-09-03 |
| TWI593605B (en) | 2017-08-01 |
| KR20140128938A (en) | 2014-11-06 |
| US20150018458A1 (en) | 2015-01-15 |
| JPWO2013128889A1 (en) | 2015-07-30 |
| KR101886904B1 (en) | 2018-08-08 |
| JP6225897B2 (en) | 2017-11-08 |
| WO2013128889A1 (en) | 2013-09-06 |
| TW201348075A (en) | 2013-12-01 |
| CN104024126B (en) | 2016-08-24 |
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