SG11201400321RA - Modular heater - Google Patents

Modular heater

Info

Publication number
SG11201400321RA
SG11201400321RA SG11201400321RA SG11201400321RA SG11201400321RA SG 11201400321R A SG11201400321R A SG 11201400321RA SG 11201400321R A SG11201400321R A SG 11201400321RA SG 11201400321R A SG11201400321R A SG 11201400321RA SG 11201400321R A SG11201400321R A SG 11201400321RA
Authority
SG
Singapore
Prior art keywords
modular heater
modular
heater
Prior art date
Application number
SG11201400321RA
Other languages
English (en)
Inventor
Arsalan Emami
Original Assignee
Arsalan Emami
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arsalan Emami filed Critical Arsalan Emami
Publication of SG11201400321RA publication Critical patent/SG11201400321RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)
SG11201400321RA 2011-09-06 2012-09-05 Modular heater SG11201400321RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161573451P 2011-09-06 2011-09-06
US201161573450P 2011-09-06 2011-09-06
PCT/IB2012/054575 WO2013035044A1 (fr) 2011-09-06 2012-09-05 Élément chauffant modulaire

Publications (1)

Publication Number Publication Date
SG11201400321RA true SG11201400321RA (en) 2014-03-28

Family

ID=47148867

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201400321RA SG11201400321RA (en) 2011-09-06 2012-09-05 Modular heater

Country Status (3)

Country Link
US (1) US10204806B2 (fr)
SG (1) SG11201400321RA (fr)
WO (1) WO2013035044A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9171746B2 (en) * 2011-09-06 2015-10-27 Arsalan Emami Heater elements with enhanced cooling
KR102371856B1 (ko) * 2015-04-22 2022-03-08 삼성전자 주식회사 기구물과 결합된 분리 가능한 커넥터 구조
USD790048S1 (en) * 2015-05-15 2017-06-20 Arsalan Emami Industrial heater
WO2017156503A1 (fr) * 2016-03-10 2017-09-14 Arsalan Emami Élément chauffant industriel amélioré
KR102403525B1 (ko) 2016-08-05 2022-05-27 샌드빅 써멀 프로세스. 인크. 비-균일한 절연부를 갖는 열적 프로세스 디바이스
EP3441757A1 (fr) * 2017-08-10 2019-02-13 Mettler-Toledo GmbH Dispositif d'isolation de four
JP6931123B2 (ja) * 2017-08-31 2021-09-01 杭州三花研究院有限公司Ｈａｎｇｚｈｏｕ Ｓａｎｈｕａ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．，Ｌｔｄ． 管路アダプター装置
CN109951906B (zh) * 2017-12-20 2024-05-10 长鑫存储技术有限公司 半导体炉管机台加热器
US10998205B2 (en) * 2018-09-14 2021-05-04 Kokusai Electric Corporation Substrate processing apparatus and manufacturing method of semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3973934A (en) * 1949-02-23 1976-08-10 The United States Of America As Represented By The United States Energy Research And Development Administration Apparatus for diffusion separation
JP3504784B2 (ja) * 1995-09-07 2004-03-08 東京エレクトロン株式会社 熱処理方法
JP4198901B2 (ja) 1997-07-31 2008-12-17 コバレントマテリアル株式会社 カーボンヒータ
US5997049A (en) * 1997-08-29 1999-12-07 Furon Company Adjustable leak-tight coupling system
US6827786B2 (en) 2000-12-26 2004-12-07 Stephen M Lord Machine for production of granular silicon
JP2002305157A (ja) * 2000-12-28 2002-10-18 Tokyo Electron Ltd ハニカム構造断熱体及び熱再利用システム
US7135659B2 (en) * 2001-03-05 2006-11-14 Tokyo Electron Limited Heat treatment method and heat treatment system
TWI315080B (en) 2005-08-24 2009-09-21 Hitachi Int Electric Inc Baseplate processing equipment, heating device used on the baseplate processing equipment and method for manufacturing semiconductors with those apparatus, and heating element supporting structure
JP4331768B2 (ja) * 2007-02-28 2009-09-16 東京エレクトロン株式会社 熱処理炉及び縦型熱処理装置
US20090293784A1 (en) * 2008-05-30 2009-12-03 Fred Lindeman Suspended refractory curtain

Also Published As

Publication number Publication date
US10204806B2 (en) 2019-02-12
WO2013035044A1 (fr) 2013-03-14
US20130058372A1 (en) 2013-03-07

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