SG105504A1 - Die bonder and method for detecting misaligned workpieces - Google Patents

Die bonder and method for detecting misaligned workpieces

Info

Publication number
SG105504A1
SG105504A1 SG200104676A SG200104676A SG105504A1 SG 105504 A1 SG105504 A1 SG 105504A1 SG 200104676 A SG200104676 A SG 200104676A SG 200104676 A SG200104676 A SG 200104676A SG 105504 A1 SG105504 A1 SG 105504A1
Authority
SG
Singapore
Prior art keywords
die bonder
workpieces
detecting misaligned
detecting
misaligned workpieces
Prior art date
Application number
SG200104676A
Inventor
Michael Anastasius Gotsi Franz
Elisabeth Anna Radec Stephanie
Chin Hiang Tan
Original Assignee
Casem Asia Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casem Asia Pte Ltd filed Critical Casem Asia Pte Ltd
Priority to SG200104676A priority Critical patent/SG105504A1/en
Priority to MYPI20022792 priority patent/MY144878A/en
Priority to PCT/SG2002/000186 priority patent/WO2003015158A1/en
Publication of SG105504A1 publication Critical patent/SG105504A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangements of monitoring devices; Arrangements of safety devices
    • F27D2021/0057—Security or safety devices, e.g. for protection against heat, noise, pollution or too much duress; Ergonomic aspects
    • F27D2021/0092—Security or safety devices, e.g. for protection against heat, noise, pollution or too much duress; Ergonomic aspects against a jam in the transport line or a production interruption
SG200104676A 2001-08-06 2001-08-06 Die bonder and method for detecting misaligned workpieces SG105504A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG200104676A SG105504A1 (en) 2001-08-06 2001-08-06 Die bonder and method for detecting misaligned workpieces
MYPI20022792 MY144878A (en) 2001-08-06 2002-07-24 Die bonder and method for detecting misaligned workpieces
PCT/SG2002/000186 WO2003015158A1 (en) 2001-08-06 2002-08-05 Die bonder and method for detecting misaligned workpieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200104676A SG105504A1 (en) 2001-08-06 2001-08-06 Die bonder and method for detecting misaligned workpieces

Publications (1)

Publication Number Publication Date
SG105504A1 true SG105504A1 (en) 2004-08-27

Family

ID=20430811

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200104676A SG105504A1 (en) 2001-08-06 2001-08-06 Die bonder and method for detecting misaligned workpieces

Country Status (3)

Country Link
MY (1) MY144878A (en)
SG (1) SG105504A1 (en)
WO (1) WO2003015158A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102054730B (en) * 2010-11-19 2013-04-17 上海凯虹电子有限公司 Lead frame transporting device of and method for adhering chip

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661273A (en) * 1992-08-06 1994-03-04 Mitsubishi Electric Corp Lead frame treatment method and device for it
JP3251760B2 (en) * 1993-03-15 2002-01-28 株式会社東芝 Displacement error measuring method using charged beam, charged beam drawing apparatus, and semiconductor device provided with displacement error measuring mark
JPH07117847A (en) * 1993-10-21 1995-05-09 Ebara Corp Conveying device
JPH07123528A (en) * 1993-10-21 1995-05-12 Ebara Corp Magnetic levitation transport system
FR2726778A1 (en) * 1994-11-14 1996-05-15 Parveau Mab Automatic feed line for machining e.g. extruded PVC channels
JP2001330620A (en) * 2000-03-14 2001-11-30 Omron Corp Vibration/impact alarming apparatus

Also Published As

Publication number Publication date
WO2003015158A1 (en) 2003-02-20
MY144878A (en) 2011-11-30

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