SG10202102049WA - Inspection apparatus - Google Patents
Inspection apparatusInfo
- Publication number
- SG10202102049WA SG10202102049WA SG10202102049WA SG10202102049WA SG 10202102049W A SG10202102049W A SG 10202102049WA SG 10202102049W A SG10202102049W A SG 10202102049WA SG 10202102049W A SG10202102049W A SG 10202102049WA
- Authority
- SG
- Singapore
- Prior art keywords
- inspection apparatus
- inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020036109A JP7390934B2 (en) | 2020-03-03 | 2020-03-03 | Inspection equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202102049WA true SG10202102049WA (en) | 2021-10-28 |
Family
ID=77467894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202102049W SG10202102049WA (en) | 2020-03-03 | 2021-03-01 | Inspection apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US11486924B2 (en) |
JP (1) | JP7390934B2 (en) |
KR (1) | KR102535047B1 (en) |
CN (1) | CN113341239B (en) |
SG (1) | SG10202102049WA (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6939250B2 (en) * | 2017-08-25 | 2021-09-22 | 株式会社三洋物産 | Pachinko machine |
JP6939251B2 (en) * | 2017-08-25 | 2021-09-22 | 株式会社三洋物産 | Pachinko machine |
JP6939249B2 (en) * | 2017-08-25 | 2021-09-22 | 株式会社三洋物産 | Pachinko machine |
JP7294497B2 (en) * | 2017-11-10 | 2023-06-20 | 株式会社三洋物産 | game machine |
JP7294499B2 (en) * | 2017-11-10 | 2023-06-20 | 株式会社三洋物産 | game machine |
JP7294498B2 (en) * | 2017-11-10 | 2023-06-20 | 株式会社三洋物産 | game machine |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07107546B2 (en) * | 1987-12-01 | 1995-11-15 | 東京エレクトロン株式会社 | Probe device with automatic probe card exchange function |
KR101046769B1 (en) * | 2009-01-20 | 2011-07-06 | 주식회사 쎄믹스 | Probe card case |
JP2012080047A (en) * | 2010-10-06 | 2012-04-19 | Yokogawa Electric Corp | Semiconductor tester |
KR101561746B1 (en) * | 2013-11-27 | 2015-10-20 | 세메스 주식회사 | Apparatus for inspecting display cells |
JP6271257B2 (en) * | 2014-01-08 | 2018-01-31 | 東京エレクトロン株式会社 | Substrate inspection apparatus and probe card transfer method |
JP6333112B2 (en) * | 2014-08-20 | 2018-05-30 | 東京エレクトロン株式会社 | Wafer inspection equipment |
JP6400412B2 (en) * | 2014-09-29 | 2018-10-03 | 東京エレクトロン株式会社 | Conveying method and inspection system |
JP5967508B1 (en) | 2015-02-27 | 2016-08-10 | 株式会社東京精密 | Transport unit and prober |
JP6447553B2 (en) | 2016-03-18 | 2019-01-09 | 株式会社東京精密 | Prober |
KR101882209B1 (en) * | 2016-03-23 | 2018-07-27 | 리노공업주식회사 | Coaxial Test Socket Assembly |
JP2018022813A (en) * | 2016-08-05 | 2018-02-08 | 株式会社東京精密 | Prober |
JP6887332B2 (en) | 2017-07-19 | 2021-06-16 | 東京エレクトロン株式会社 | Inspection system |
JP7389945B2 (en) | 2019-12-13 | 2023-12-01 | 株式会社東京精密 | Prober and probe testing method |
-
2020
- 2020-03-03 JP JP2020036109A patent/JP7390934B2/en active Active
-
2021
- 2021-02-19 KR KR1020210022548A patent/KR102535047B1/en active IP Right Grant
- 2021-02-22 CN CN202110196176.9A patent/CN113341239B/en active Active
- 2021-03-01 SG SG10202102049W patent/SG10202102049WA/en unknown
- 2021-03-02 US US17/190,089 patent/US11486924B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20210278456A1 (en) | 2021-09-09 |
JP7390934B2 (en) | 2023-12-04 |
KR102535047B1 (en) | 2023-05-26 |
JP2021141143A (en) | 2021-09-16 |
CN113341239B (en) | 2024-08-30 |
CN113341239A (en) | 2021-09-03 |
US11486924B2 (en) | 2022-11-01 |
KR20210111681A (en) | 2021-09-13 |
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