SG10202012631SA - Compositions and methods using same for carbon doped silicon containing films - Google Patents

Compositions and methods using same for carbon doped silicon containing films

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Publication number
SG10202012631SA
SG10202012631SA SG10202012631SA SG10202012631SA SG10202012631SA SG 10202012631S A SG10202012631S A SG 10202012631SA SG 10202012631S A SG10202012631S A SG 10202012631SA SG 10202012631S A SG10202012631S A SG 10202012631SA SG 10202012631S A SG10202012631S A SG 10202012631SA
Authority
SG
Singapore
Prior art keywords
compositions
methods
same
doped silicon
silicon containing
Prior art date
Application number
SG10202012631SA
Inventor
Haripin Chandra
Kirk Cuthill
Anupama Mallikarjunan
Xinjian Lei
Matthew Macdonald
Manchao Xiao
Madhukar Rao
Jianheng Li
Original Assignee
Versum Materials Us Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Versum Materials Us Llc filed Critical Versum Materials Us Llc
Publication of SG10202012631SA publication Critical patent/SG10202012631SA/en

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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0605Carbon
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/308Oxynitrides
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • C23C16/345Silicon nitride
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/36Carbonitrides
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45527Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
    • C23C16/45536Use of plasma, radiation or electromagnetic fields
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56After-treatment
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    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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    • H01L21/02208Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02211Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
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    • H01L21/02219Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
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SG10202012631SA 2015-02-06 2016-02-04 Compositions and methods using same for carbon doped silicon containing films SG10202012631SA (en)

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US201562113024P 2015-02-06 2015-02-06
US201562142546P 2015-04-03 2015-04-03

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EP (2) EP3460827B1 (en)
JP (4) JP6585724B2 (en)
KR (4) KR20240042186A (en)
CN (1) CN107406978B (en)
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Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585230B (en) * 2015-02-06 2017-06-01 氣體產品及化學品股份公司 Compositions and methods using same for carbon doped silicon containing films
TWI706957B (en) * 2015-03-30 2020-10-11 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 Catalyst dehydrogenative coupling of carbosilanes with ammonia, amnines and amidines
US20180033614A1 (en) 2016-07-27 2018-02-01 Versum Materials Us, Llc Compositions and Methods Using Same for Carbon Doped Silicon Containing Films
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10847360B2 (en) 2017-05-25 2020-11-24 Applied Materials, Inc. High pressure treatment of silicon nitride film
KR102405723B1 (en) 2017-08-18 2022-06-07 어플라이드 머티어리얼스, 인코포레이티드 High pressure and high temperature annealing chamber
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
CN111095524B (en) 2017-09-12 2023-10-03 应用材料公司 Apparatus and method for fabricating semiconductor structures using protective barrier layers
WO2019058477A1 (en) * 2017-09-21 2019-03-28 株式会社Kokusai Electric Method for manufacturing semiconductor device, substrate processing device and program
US10483372B2 (en) * 2017-09-29 2019-11-19 Taiwan Semiconductor Manufacturing Co., Ltd. Spacer structure with high plasma resistance for semiconductor devices
KR102396319B1 (en) 2017-11-11 2022-05-09 마이크로머티어리얼즈 엘엘씨 Gas Delivery Systems for High Pressure Processing Chambers
WO2019099125A1 (en) 2017-11-16 2019-05-23 Applied Materials, Inc. High pressure steam anneal processing apparatus
JP2021503714A (en) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Capacitor system for high pressure processing system
US10510852B2 (en) 2017-11-28 2019-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. Low-k feature formation processes and structures formed thereby
JP6806719B2 (en) * 2018-01-17 2021-01-06 株式会社Kokusai Electric Semiconductor device manufacturing methods, substrate processing devices and programs
CN111699549A (en) 2018-01-24 2020-09-22 应用材料公司 Seam closure using high pressure annealing
KR20230079236A (en) 2018-03-09 2023-06-05 어플라이드 머티어리얼스, 인코포레이티드 High pressure annealing process for metal containing materials
US10714331B2 (en) * 2018-04-04 2020-07-14 Applied Materials, Inc. Method to fabricate thermally stable low K-FinFET spacer
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10704141B2 (en) 2018-06-01 2020-07-07 Applied Materials, Inc. In-situ CVD and ALD coating of chamber to control metal contamination
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
US10985010B2 (en) * 2018-08-29 2021-04-20 Versum Materials Us, Llc Methods for making silicon and nitrogen containing films
US20200071819A1 (en) * 2018-08-29 2020-03-05 Versum Materials Us, Llc Methods For Making Silicon Containing Films That Have High Carbon Content
JP6980624B2 (en) * 2018-09-13 2021-12-15 株式会社Kokusai Electric Semiconductor device manufacturing method, substrate processing method, substrate processing device and program
KR20210047966A (en) * 2018-09-24 2021-04-30 버슘머트리얼즈 유에스, 엘엘씨 Method for producing silicon and nitrogen-containing membranes
JP7421551B2 (en) * 2018-10-03 2024-01-24 バーサム マテリアルズ ユーエス,リミティド ライアビリティ カンパニー Method for producing films containing silicon and nitrogen
TWI816086B (en) * 2018-10-05 2023-09-21 美商慧盛材料美國責任有限公司 High temperature atomic layer deposition of silicon-containing films
WO2020092002A1 (en) 2018-10-30 2020-05-07 Applied Materials, Inc. Methods for etching a structure for semiconductor applications
JP2022507390A (en) 2018-11-16 2022-01-18 アプライド マテリアルズ インコーポレイテッド Membrane deposition using enhanced diffusion process
WO2020112782A1 (en) * 2018-11-27 2020-06-04 Versum Materials Us, Llc 1-methyl-1-iso-propoxy-silacycloalkanes and dense organosilica films made therefrom
JP6957442B2 (en) 2018-11-30 2021-11-02 株式会社Kokusai Electric Semiconductor device manufacturing methods, substrate processing methods, substrate processing equipment, and programs
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US11756786B2 (en) 2019-01-18 2023-09-12 International Business Machines Corporation Forming high carbon content flowable dielectric film with low processing damage
KR20210114546A (en) * 2019-02-05 2021-09-23 버슘머트리얼즈 유에스, 엘엘씨 Deposition of carbon-doped silicon oxide
TWI776666B (en) * 2019-07-25 2022-09-01 美商慧盛材料美國責任有限公司 Compositions comprising silacycloalkanes and methods using same for deposition of silicon-containing film
US11186909B2 (en) * 2019-08-26 2021-11-30 Applied Materials, Inc. Methods of depositing low-K films
JP2023512674A (en) * 2020-01-31 2023-03-28 ユーピー ケミカル カンパニー リミテッド Silicon precursor compound, composition for forming silicon-containing film containing the same, and method for forming silicon-containing film
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
CN115867689A (en) * 2020-06-23 2023-03-28 恩特格里斯公司 Silicon precursor compound and method of forming silicon-containing film

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW302063U (en) * 1992-09-24 1997-04-01 Honda Motor Co Ltd Pipe joint
US5415126A (en) * 1993-08-16 1995-05-16 Dow Corning Corporation Method of forming crystalline silicon carbide coatings at low temperatures
US20080268177A1 (en) * 2002-05-17 2008-10-30 Air Products And Chemicals, Inc. Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants
JP5218765B2 (en) * 2006-03-29 2013-06-26 Jsr株式会社 Method for producing polymer, polymer, composition for forming polymer film, method for forming polymer film, and polymer film
US7998536B2 (en) * 2007-07-12 2011-08-16 Applied Materials, Inc. Silicon precursors to make ultra low-K films of K<2.2 with high mechanical properties by plasma enhanced chemical vapor deposition
KR100923775B1 (en) * 2007-11-30 2009-10-27 한국과학기술연구원 Preparation method of polychlorocarbosilanes
WO2009123032A1 (en) * 2008-04-02 2009-10-08 Jsr株式会社 Composition containing silicon-containing polymer and cured product thereof
US8241624B2 (en) 2008-04-18 2012-08-14 Ecolab Usa Inc. Method of disinfecting packages with composition containing peracid and catalase
US8298628B2 (en) * 2008-06-02 2012-10-30 Air Products And Chemicals, Inc. Low temperature deposition of silicon-containing films
WO2010047869A1 (en) * 2008-10-20 2010-04-29 Dow Corning Corporation Cvd precursors
US8703624B2 (en) * 2009-03-13 2014-04-22 Air Products And Chemicals, Inc. Dielectric films comprising silicon and methods for making same
US8703625B2 (en) 2010-02-04 2014-04-22 Air Products And Chemicals, Inc. Methods to prepare silicon-containing films
JP5374638B2 (en) * 2010-04-09 2013-12-25 株式会社日立国際電気 Semiconductor device manufacturing method, substrate processing method, and substrate processing apparatus
CN103168344A (en) * 2010-11-03 2013-06-19 应用材料公司 Apparatus and methods for deposition of silicon carbide and silicon carbonitride films
US8575033B2 (en) 2011-09-13 2013-11-05 Applied Materials, Inc. Carbosilane precursors for low temperature film deposition
US8993072B2 (en) * 2011-09-27 2015-03-31 Air Products And Chemicals, Inc. Halogenated organoaminosilane precursors and methods for depositing films comprising same
JP6043546B2 (en) * 2011-10-21 2016-12-14 株式会社日立国際電気 Semiconductor device manufacturing method, substrate processing method, substrate processing apparatus, and program
US20130224964A1 (en) 2012-02-28 2013-08-29 Asm Ip Holding B.V. Method for Forming Dielectric Film Containing Si-C bonds by Atomic Layer Deposition Using Precursor Containing Si-C-Si bond
US8871656B2 (en) * 2012-03-05 2014-10-28 Applied Materials, Inc. Flowable films using alternative silicon precursors
US20130288485A1 (en) 2012-04-30 2013-10-31 Applied Materials, Inc. Densification for flowable films
US9337018B2 (en) * 2012-06-01 2016-05-10 Air Products And Chemicals, Inc. Methods for depositing films with organoaminodisilane precursors
US9243324B2 (en) 2012-07-30 2016-01-26 Air Products And Chemicals, Inc. Methods of forming non-oxygen containing silicon-based films
KR20150121217A (en) 2013-03-01 2015-10-28 어플라이드 머티어리얼스, 인코포레이티드 LOW TEMPERATURE ATOMIC LAYER DEPOSITION OF FILMS COMPRISING SiCN OR SiCON
US20140302690A1 (en) 2013-04-04 2014-10-09 Applied Materials, Inc. Chemical linkers to impart improved mechanical strength to flowable films
US9343293B2 (en) 2013-04-04 2016-05-17 Applied Materials, Inc. Flowable silicon—carbon—oxygen layers for semiconductor processing
TWI585230B (en) * 2015-02-06 2017-06-01 氣體產品及化學品股份公司 Compositions and methods using same for carbon doped silicon containing films

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