SG10202011737XA - Stacked Temperature Compensated Acoustic Wave Device With High Thermal Conductivity - Google Patents

Stacked Temperature Compensated Acoustic Wave Device With High Thermal Conductivity

Info

Publication number
SG10202011737XA
SG10202011737XA SG10202011737XA SG10202011737XA SG10202011737XA SG 10202011737X A SG10202011737X A SG 10202011737XA SG 10202011737X A SG10202011737X A SG 10202011737XA SG 10202011737X A SG10202011737X A SG 10202011737XA SG 10202011737X A SG10202011737X A SG 10202011737XA
Authority
SG
Singapore
Prior art keywords
thermal conductivity
acoustic wave
high thermal
wave device
temperature compensated
Prior art date
Application number
SG10202011737XA
Inventor
Hironori Fukuhara
Rei Goto
Takeshi Furusawa
Original Assignee
Skyworks Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyworks Solutions Inc filed Critical Skyworks Solutions Inc
Publication of SG10202011737XA publication Critical patent/SG10202011737XA/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6406—Filters characterised by a particular frequency characteristic

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
SG10202011737XA 2019-11-26 2020-11-25 Stacked Temperature Compensated Acoustic Wave Device With High Thermal Conductivity SG10202011737XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962940402P 2019-11-26 2019-11-26
US17/093,756 US11588465B2 (en) 2019-11-26 2020-11-10 Stacked temperature compensated acoustic wave device with high thermal conductivity

Publications (1)

Publication Number Publication Date
SG10202011737XA true SG10202011737XA (en) 2021-06-29

Family

ID=75975491

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202011737XA SG10202011737XA (en) 2019-11-26 2020-11-25 Stacked Temperature Compensated Acoustic Wave Device With High Thermal Conductivity

Country Status (2)

Country Link
US (1) US11588465B2 (en)
SG (1) SG10202011737XA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019217000A1 (en) * 2018-11-06 2020-05-07 Skyworks Solutions, Inc. ACOUSTIC SHAFT DEVICE WITH LAYER OF HIGH THERMAL CONDUCTIVITY ON INTERDIGITAL CONVERTER
WO2023028392A1 (en) * 2021-08-23 2023-03-02 Qualcomm Incorporated Surface acoustic wave (saw) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods
CN117040479B (en) * 2022-12-14 2024-03-01 北京芯溪半导体科技有限公司 Acoustic wave filter, communication equipment and electronic equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6509147B2 (en) * 2016-02-29 2019-05-08 太陽誘電株式会社 Electronic device

Also Published As

Publication number Publication date
US20210159877A1 (en) 2021-05-27
US11588465B2 (en) 2023-02-21

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