SG10202011390UA - Top ring for holding a substrate and substrate processing apparatus - Google Patents
Top ring for holding a substrate and substrate processing apparatusInfo
- Publication number
- SG10202011390UA SG10202011390UA SG10202011390UA SG10202011390UA SG10202011390UA SG 10202011390U A SG10202011390U A SG 10202011390UA SG 10202011390U A SG10202011390U A SG 10202011390UA SG 10202011390U A SG10202011390U A SG 10202011390UA SG 10202011390U A SG10202011390U A SG 10202011390UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- holding
- processing apparatus
- top ring
- substrate processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019208865A JP7328874B2 (en) | 2019-11-19 | 2019-11-19 | Top ring for holding the substrate and substrate handling equipment |
JP2020167306A JP2022059509A (en) | 2020-10-01 | 2020-10-01 | Top ring and substrate treatment apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202011390UA true SG10202011390UA (en) | 2021-06-29 |
Family
ID=74141246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202011390UA SG10202011390UA (en) | 2019-11-19 | 2020-11-16 | Top ring for holding a substrate and substrate processing apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US11701750B2 (en) |
EP (1) | EP3825061A3 (en) |
KR (1) | KR20210061273A (en) |
CN (1) | CN112894612B (en) |
SG (1) | SG10202011390UA (en) |
TW (1) | TW202133246A (en) |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0911115B1 (en) * | 1992-09-24 | 2003-11-26 | Ebara Corporation | Polishing apparatus |
USRE38878E1 (en) * | 1992-09-24 | 2005-11-15 | Ebara Corporation | Polishing apparatus |
US5398459A (en) * | 1992-11-27 | 1995-03-21 | Kabushiki Kaisha Toshiba | Method and apparatus for polishing a workpiece |
JP2757112B2 (en) | 1993-10-27 | 1998-05-25 | 信越半導体株式会社 | Wafer polishing equipment |
JPH07241764A (en) | 1994-03-04 | 1995-09-19 | Fujitsu Ltd | Polishing device and polishing method |
JPH08229809A (en) | 1995-03-01 | 1996-09-10 | Hitachi Ltd | Substrate holder for polishing device, and polishing method thereof |
JP3668529B2 (en) | 1995-07-26 | 2005-07-06 | ソニー株式会社 | Vacuum chuck device for polishing flaky members |
TW371635B (en) | 1996-10-10 | 1999-10-11 | Applied Materials Inc | Carrier head with a layer conformable material for a chemical mechanical polishing system |
JPH10217112A (en) * | 1997-02-06 | 1998-08-18 | Speedfam Co Ltd | Cmp device |
JP2940611B2 (en) | 1997-05-28 | 1999-08-25 | 株式会社東京精密 | Wafer polishing machine with retainer ring |
DE69813374T2 (en) | 1997-05-28 | 2003-10-23 | Tokyo Seimitsu Co Ltd | Semiconductor wafer polishing device with holder ring |
US6116992A (en) * | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
US6276998B1 (en) * | 1999-02-25 | 2001-08-21 | Applied Materials, Inc. | Padless substrate carrier |
US6645050B1 (en) * | 1999-02-25 | 2003-11-11 | Applied Materials, Inc. | Multimode substrate carrier |
SG90746A1 (en) * | 1999-10-15 | 2002-08-20 | Ebara Corp | Apparatus and method for polishing workpiece |
JP2001319905A (en) * | 2000-05-11 | 2001-11-16 | Meiji Kikai Kk | Vacuum chuck |
US7101273B2 (en) * | 2000-07-25 | 2006-09-05 | Applied Materials, Inc. | Carrier head with gimbal mechanism |
JP3856634B2 (en) * | 2000-09-14 | 2006-12-13 | 株式会社荏原製作所 | Substrate holding device and polishing apparatus provided with the substrate holding device |
US6676497B1 (en) * | 2000-09-08 | 2004-01-13 | Applied Materials Inc. | Vibration damping in a chemical mechanical polishing system |
US6848980B2 (en) * | 2001-10-10 | 2005-02-01 | Applied Materials, Inc. | Vibration damping in a carrier head |
US7255637B2 (en) * | 2000-09-08 | 2007-08-14 | Applied Materials, Inc. | Carrier head vibration damping |
US7497767B2 (en) * | 2000-09-08 | 2009-03-03 | Applied Materials, Inc. | Vibration damping during chemical mechanical polishing |
US6755723B1 (en) * | 2000-09-29 | 2004-06-29 | Lam Research Corporation | Polishing head assembly |
JP2002187060A (en) * | 2000-10-11 | 2002-07-02 | Ebara Corp | Substrate holding device, polishing device and grinding method |
JP3294600B1 (en) | 2001-02-28 | 2002-06-24 | 不二越機械工業株式会社 | Wafer polishing equipment |
JP4515047B2 (en) * | 2003-06-06 | 2010-07-28 | 株式会社荏原製作所 | Elastic film, substrate holding apparatus, polishing apparatus, and polishing method |
TWI393209B (en) * | 2003-02-10 | 2013-04-11 | Ebara Corp | A method of polishing a substrate |
JP2008296334A (en) | 2007-05-31 | 2008-12-11 | Toshiba Corp | Vacuum suction chuck and grinding machine using the same |
JP2009050943A (en) * | 2007-08-24 | 2009-03-12 | Applied Materials Inc | Retainer ring, carrier head and chemical mechanical polishing apparatus |
JP5493919B2 (en) | 2010-01-29 | 2014-05-14 | 富士電機株式会社 | Chuck table device and semiconductor device manufacturing method using the same |
US8591286B2 (en) * | 2010-08-11 | 2013-11-26 | Applied Materials, Inc. | Apparatus and method for temperature control during polishing |
JP5847435B2 (en) * | 2011-05-19 | 2016-01-20 | Sumco Techxiv株式会社 | Polishing head and polishing apparatus |
JP2014176950A (en) | 2013-02-12 | 2014-09-25 | Ebara Corp | Polishing device and polishing pad bonding method |
JP6556066B2 (en) * | 2016-02-09 | 2019-08-07 | 株式会社ディスコ | Cutting equipment |
JP6360586B1 (en) * | 2017-04-13 | 2018-07-18 | 三菱電線工業株式会社 | Elastic film for wafer holding of CMP apparatus |
JP7177320B2 (en) | 2018-06-05 | 2022-11-24 | 株式会社バルコス | bag |
JP7118025B2 (en) | 2019-03-29 | 2022-08-15 | 東京エレクトロン株式会社 | Deposition method |
-
2020
- 2020-11-13 KR KR1020200152016A patent/KR20210061273A/en unknown
- 2020-11-16 US US17/099,571 patent/US11701750B2/en active Active
- 2020-11-16 SG SG10202011390UA patent/SG10202011390UA/en unknown
- 2020-11-18 TW TW109140203A patent/TW202133246A/en unknown
- 2020-11-18 CN CN202011291745.XA patent/CN112894612B/en active Active
- 2020-11-18 EP EP20208443.0A patent/EP3825061A3/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN112894612A (en) | 2021-06-04 |
US20210170543A1 (en) | 2021-06-10 |
EP3825061A3 (en) | 2021-10-06 |
TW202133246A (en) | 2021-09-01 |
KR20210061273A (en) | 2021-05-27 |
CN112894612B (en) | 2024-06-04 |
US20230249313A9 (en) | 2023-08-10 |
EP3825061A2 (en) | 2021-05-26 |
US11701750B2 (en) | 2023-07-18 |
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