SG10202007981XA - Method of detecting abnormality of a roller whichtransmits a local load to a retainer ring, and polishingapparatus - Google Patents

Method of detecting abnormality of a roller whichtransmits a local load to a retainer ring, and polishingapparatus

Info

Publication number
SG10202007981XA
SG10202007981XA SG10202007981XA SG10202007981XA SG10202007981XA SG 10202007981X A SG10202007981X A SG 10202007981XA SG 10202007981X A SG10202007981X A SG 10202007981XA SG 10202007981X A SG10202007981X A SG 10202007981XA SG 10202007981X A SG10202007981X A SG 10202007981XA
Authority
SG
Singapore
Prior art keywords
whichtransmits
polishingapparatus
roller
retainer ring
local load
Prior art date
Application number
SG10202007981XA
Inventor
Owada Tomoko
Nabeya Osamu
Suzuki Yuta
Togashi Shingo
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202007981XA publication Critical patent/SG10202007981XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
SG10202007981XA 2019-08-27 2020-08-20 Method of detecting abnormality of a roller whichtransmits a local load to a retainer ring, and polishingapparatus SG10202007981XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019154300A JP7339811B2 (en) 2019-08-27 2019-08-27 Abnormality detection method and polishing device for roller that transmits local load to retainer ring

Publications (1)

Publication Number Publication Date
SG10202007981XA true SG10202007981XA (en) 2021-03-30

Family

ID=74674688

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202007981XA SG10202007981XA (en) 2019-08-27 2020-08-20 Method of detecting abnormality of a roller whichtransmits a local load to a retainer ring, and polishingapparatus

Country Status (6)

Country Link
US (1) US11654524B2 (en)
JP (1) JP7339811B2 (en)
KR (1) KR20210025490A (en)
CN (1) CN112440202A (en)
SG (1) SG10202007981XA (en)
TW (1) TW202110580A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102333886B1 (en) * 2021-04-12 2021-12-03 주식회사 쓰리지 Dust collecting type sander
CN114952610B (en) * 2021-11-10 2024-02-09 华海清科股份有限公司 Bearing head for chemical mechanical polishing and polishing equipment

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4386988B2 (en) * 1999-04-30 2009-12-16 株式会社トプコン Polishing device
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
JP2006113002A (en) * 2004-10-18 2006-04-27 Nsk Ltd Anomaly diagnosis system for mechanical equipment
JP4814677B2 (en) * 2006-03-31 2011-11-16 株式会社荏原製作所 Substrate holding device and polishing device
JP2009028856A (en) 2007-07-27 2009-02-12 Tokyo Seimitsu Co Ltd Polishing end point detection method using torque change and apparatus thereof
JP5454513B2 (en) * 2011-05-27 2014-03-26 信越半導体株式会社 Method for adjusting position of polishing head in height direction and method for polishing workpiece
JP6005467B2 (en) * 2011-10-26 2016-10-12 株式会社荏原製作所 Polishing method and polishing apparatus
JP5976522B2 (en) 2012-05-31 2016-08-23 株式会社荏原製作所 Polishing apparatus and polishing method
TWI465317B (en) * 2012-06-25 2014-12-21 Sumco Corp Polishing method of workpiece and polishing device of workpiece
JP6445924B2 (en) 2014-05-14 2018-12-26 株式会社荏原製作所 Polishing equipment
TWI656944B (en) 2014-05-14 2019-04-21 日商荏原製作所股份有限公司 Polishing apparatus
JP6403601B2 (en) * 2015-02-16 2018-10-10 株式会社ディスコ Processing equipment
JP6767834B2 (en) * 2016-09-29 2020-10-14 株式会社荏原製作所 Substrate cleaning equipment and substrate processing equipment
JP7023063B2 (en) * 2017-08-08 2022-02-21 株式会社荏原製作所 Substrate polishing equipment and method

Also Published As

Publication number Publication date
JP7339811B2 (en) 2023-09-06
CN112440202A (en) 2021-03-05
KR20210025490A (en) 2021-03-09
US11654524B2 (en) 2023-05-23
US20210060723A1 (en) 2021-03-04
JP2021030382A (en) 2021-03-01
TW202110580A (en) 2021-03-16

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