SG10202006289RA - Eddy current sensor - Google Patents

Eddy current sensor

Info

Publication number
SG10202006289RA
SG10202006289RA SG10202006289RA SG10202006289RA SG10202006289RA SG 10202006289R A SG10202006289R A SG 10202006289RA SG 10202006289R A SG10202006289R A SG 10202006289RA SG 10202006289R A SG10202006289R A SG 10202006289RA SG 10202006289R A SG10202006289R A SG 10202006289RA
Authority
SG
Singapore
Prior art keywords
current sensor
eddy current
eddy
sensor
current
Prior art date
Application number
SG10202006289RA
Inventor
Abe Atsushi
Watanabe Katsuhide
Takahashi Taro
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202006289RA publication Critical patent/SG10202006289RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • G01B7/105—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring thickness of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
    • G01N27/9006—Details, e.g. in the structure or functioning of sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
SG10202006289RA 2019-07-03 2020-06-30 Eddy current sensor SG10202006289RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019124522A JP7291558B2 (en) 2019-07-03 2019-07-03 Eddy current sensor

Publications (1)

Publication Number Publication Date
SG10202006289RA true SG10202006289RA (en) 2021-02-25

Family

ID=73919594

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202006289RA SG10202006289RA (en) 2019-07-03 2020-06-30 Eddy current sensor

Country Status (6)

Country Link
US (1) US20210001447A1 (en)
JP (1) JP7291558B2 (en)
KR (1) KR20210004832A (en)
CN (1) CN112171503A (en)
SG (1) SG10202006289RA (en)
TW (1) TW202102870A (en)

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611120A (en) * 1970-02-24 1971-10-05 Forster F M O Eddy current testing systems with means to compensate for probe to workpiece spacing
DE2419084A1 (en) * 1974-04-20 1975-11-06 Messer Griesheim Gmbh DEVICE FOR AUTOMATIC TRACKING OF TOOLS, IN PARTICULAR WELDING TORCHES
JPS5210167A (en) * 1975-07-14 1977-01-26 Sumitomo Metal Ind Ltd Method to detect distortion in the magnetic metal during the time of t ransportation
GB2028510B (en) * 1978-08-21 1983-02-16 Defence Sercretary Of State Fo Apparatus for the detection of defects in engineering materials
IT1194275B (en) * 1983-06-15 1988-09-14 Cise Spa "CONTACTLESS" HIGH THICKNESS GAUGE FOR METAL MATERIALS ABOVE CURIE TEMPERATURE
US4804912A (en) * 1987-05-14 1989-02-14 Kamyr Ab Apparatus for electromagnetically measuring the distance between two opposing grinding surfaces
FR2713776B1 (en) * 1993-12-10 1996-01-12 Commissariat Energie Atomique Microdevice for measuring electromagnetic characteristics of a medium and use of this microdevice.
EP0819944A1 (en) * 1996-07-16 1998-01-21 Lucent Technologies Inc. Eddy current sensor
JPH11337304A (en) * 1998-05-26 1999-12-10 Tohoku Electric Power Co Inc Device for measuring thickness of object to be measured, and method therefor
US6456069B1 (en) * 1999-03-05 2002-09-24 The United States Of America As Represented By The Secretary Of The Navy Fluxgate magnetic field sensor incorporating ferromagnetic test material into its magnetic circuitry
US7112961B2 (en) * 2002-12-13 2006-09-26 Applied Materials, Inc. Method and apparatus for dynamically measuring the thickness of an object
US7016795B2 (en) * 2003-02-04 2006-03-21 Applied Materials Inc. Signal improvement in eddy current sensing
US7112960B2 (en) 2003-07-31 2006-09-26 Applied Materials, Inc. Eddy current system for in-situ profile measurement
US20110189856A1 (en) * 2010-01-29 2011-08-04 Kun Xu High Sensitivity Real Time Profile Control Eddy Current Monitoring System
US20120276662A1 (en) * 2011-04-27 2012-11-01 Iravani Hassan G Eddy current monitoring of metal features
US9023667B2 (en) * 2011-04-27 2015-05-05 Applied Materials, Inc. High sensitivity eddy current monitoring system
US9472481B2 (en) * 2014-02-07 2016-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Packages with stress-reducing structures and methods of forming same
US9754846B2 (en) * 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
KR20160052193A (en) * 2014-11-04 2016-05-12 주식회사 케이씨텍 Chemical mechanical polishing apparatus and device of measuring wafer metal layer thickness used therein
JP6590612B2 (en) 2015-09-16 2019-10-16 株式会社荏原製作所 Eddy current sensor
TW201710029A (en) * 2015-09-01 2017-03-16 Ebara Corp Eddy current sensor
JP6779633B2 (en) * 2016-02-23 2020-11-04 株式会社荏原製作所 Polishing equipment
US10391610B2 (en) * 2016-10-21 2019-08-27 Applied Materials, Inc. Core configuration for in-situ electromagnetic induction monitoring system
KR102538861B1 (en) * 2017-12-26 2023-06-01 가부시키가이샤 에바라 세이사꾸쇼 Magnetic element and eddy current type sensor using the same
JP7179586B2 (en) * 2018-11-08 2022-11-29 株式会社荏原製作所 Eddy current detection device and polishing device
SG10202012510VA (en) * 2019-12-16 2021-07-29 Ebara Corp Output signal processing circuit for eddy current sensor and output signal processing method for eddy current sensor
JP2022083705A (en) * 2020-11-25 2022-06-06 株式会社荏原製作所 Eddy current sensor

Also Published As

Publication number Publication date
US20210001447A1 (en) 2021-01-07
JP2021012030A (en) 2021-02-04
TW202102870A (en) 2021-01-16
KR20210004832A (en) 2021-01-13
JP7291558B2 (en) 2023-06-15
CN112171503A (en) 2021-01-05

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