SG10202012510VA - Output signal processing circuit for eddy current sensor and output signal processing method for eddy current sensor - Google Patents
Output signal processing circuit for eddy current sensor and output signal processing method for eddy current sensorInfo
- Publication number
- SG10202012510VA SG10202012510VA SG10202012510VA SG10202012510VA SG10202012510VA SG 10202012510V A SG10202012510V A SG 10202012510VA SG 10202012510V A SG10202012510V A SG 10202012510VA SG 10202012510V A SG10202012510V A SG 10202012510VA SG 10202012510V A SG10202012510V A SG 10202012510VA
- Authority
- SG
- Singapore
- Prior art keywords
- output signal
- signal processing
- current sensor
- eddy current
- processing method
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
- G01B7/105—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring thickness of coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019226549A JP7269871B2 (en) | 2019-12-16 | 2019-12-16 | Eddy current sensor output signal processing circuit and output signal processing method |
JP2019226547A JP7257945B2 (en) | 2019-12-16 | 2019-12-16 | Eddy current sensor output signal processing circuit and output signal processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202012510VA true SG10202012510VA (en) | 2021-07-29 |
Family
ID=76546040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202012510VA SG10202012510VA (en) | 2019-12-16 | 2020-12-14 | Output signal processing circuit for eddy current sensor and output signal processing method for eddy current sensor |
Country Status (2)
Country | Link |
---|---|
US (2) | US11852472B2 (en) |
SG (1) | SG10202012510VA (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11199151B2 (en) * | 2019-06-26 | 2021-12-14 | Cummins Inc. | Vehicle controller with complementary capacitance for analog-to-digital converter (A/D) low pass filter |
JP7291558B2 (en) * | 2019-07-03 | 2023-06-15 | 株式会社荏原製作所 | Eddy current sensor |
CN114473844B (en) * | 2021-12-31 | 2023-09-29 | 华海清科股份有限公司 | Film thickness measuring device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6433541B1 (en) * | 1999-12-23 | 2002-08-13 | Kla-Tencor Corporation | In-situ metalization monitoring using eddy current measurements during the process for removing the film |
US7112960B2 (en) | 2003-07-31 | 2006-09-26 | Applied Materials, Inc. | Eddy current system for in-situ profile measurement |
US7276897B2 (en) | 2004-04-09 | 2007-10-02 | Ksr International Co. | Inductive position sensor |
US7599675B2 (en) * | 2006-12-12 | 2009-10-06 | Telefonaktiebolaget Lm Ericsson (Publ) | Method and apparatus for receiving radio frequency signals |
US8454407B2 (en) | 2008-08-05 | 2013-06-04 | Ebara Corporation | Polishing method and apparatus |
JP5513795B2 (en) | 2009-07-16 | 2014-06-04 | 株式会社荏原製作所 | Polishing method and apparatus |
JP2010175530A (en) | 2009-02-02 | 2010-08-12 | Marktec Corp | Device and method for eddy-current flaw detection |
JP2013068465A (en) | 2011-09-21 | 2013-04-18 | Kureyon Co Ltd | Eddy current detector and phase control circuit |
US10324141B2 (en) * | 2017-05-26 | 2019-06-18 | Allegro Microsystems, Llc | Packages for coil actuated position sensors |
DE102017223695B4 (en) * | 2017-12-22 | 2019-10-31 | Life Science Inkubator Betriebs Gmbh & Co. Kg | Passive transponder system and pressure wave measuring device |
US11759912B2 (en) | 2017-12-26 | 2023-09-19 | Ebara Corporation | Magnetic element and eddy current sensor using the same |
TWI682649B (en) * | 2018-09-28 | 2020-01-11 | 國立中山大學 | Signal demodulation device with iq mixer and demodulated method thereof |
-
2020
- 2020-12-14 SG SG10202012510VA patent/SG10202012510VA/en unknown
- 2020-12-15 US US17/122,301 patent/US11852472B2/en active Active
-
2023
- 2023-11-08 US US18/504,301 patent/US20240077297A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US11852472B2 (en) | 2023-12-26 |
US20240077297A1 (en) | 2024-03-07 |
US20210199415A1 (en) | 2021-07-01 |
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