SG10202003217SA - Saw filter manufacturing method and saw filter - Google Patents

Saw filter manufacturing method and saw filter

Info

Publication number
SG10202003217SA
SG10202003217SA SG10202003217SA SG10202003217SA SG10202003217SA SG 10202003217S A SG10202003217S A SG 10202003217SA SG 10202003217S A SG10202003217S A SG 10202003217SA SG 10202003217S A SG10202003217S A SG 10202003217SA SG 10202003217S A SG10202003217S A SG 10202003217SA
Authority
SG
Singapore
Prior art keywords
saw filter
manufacturing
filter manufacturing
saw
filter
Prior art date
Application number
SG10202003217SA
Inventor
Abatake Jun
Nomaru Keiji
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202003217SA publication Critical patent/SG10202003217SA/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6406—Filters characterised by a particular frequency characteristic
    • H03H9/6413—SAW comb filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6406—Filters characterised by a particular frequency characteristic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02259—Driving or detection means
    • H03H9/02275—Comb electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
SG10202003217SA 2019-04-23 2020-04-08 Saw filter manufacturing method and saw filter SG10202003217SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019082145A JP2020182035A (en) 2019-04-23 2019-04-23 SAW filter manufacturing method and SAW filter

Publications (1)

Publication Number Publication Date
SG10202003217SA true SG10202003217SA (en) 2020-11-27

Family

ID=72840152

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202003217SA SG10202003217SA (en) 2019-04-23 2020-04-08 Saw filter manufacturing method and saw filter

Country Status (6)

Country Link
US (1) US11088674B2 (en)
JP (1) JP2020182035A (en)
KR (1) KR20200124156A (en)
CN (1) CN111835313A (en)
DE (1) DE102020205160A1 (en)
SG (1) SG10202003217SA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114512412B (en) * 2022-04-20 2022-07-12 苏州科阳半导体有限公司 Surface acoustic wave filter wafer packaging method and chip

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03114310A (en) * 1989-09-28 1991-05-15 Toshiba Corp Substrate for surface acoustic wave filter and manufacture thereof
JP3880150B2 (en) * 1997-06-02 2007-02-14 松下電器産業株式会社 Surface acoustic wave device
JP2000278090A (en) * 1999-01-21 2000-10-06 Hokuriku Electric Ind Co Ltd Surface acoustic wave element and manufacture of the same
JP2003008396A (en) * 2001-06-22 2003-01-10 Japan Radio Co Ltd Surface acoustic wave element and its manufacturing method
DE102004062312B3 (en) * 2004-12-23 2006-06-01 Infineon Technologies Ag Piezoelectric resonator, e.g. in mobile telephones, has a piezoelectric layer with a first resonance frequency temperature coefficient with a first polarity sign and electrodes
JP5180104B2 (en) * 2009-01-09 2013-04-10 日本碍子株式会社 Surface acoustic wave device
JP2012015767A (en) * 2010-06-30 2012-01-19 Murata Mfg Co Ltd Elastic wave device
JP2017046225A (en) * 2015-08-27 2017-03-02 株式会社ディスコ Baw device and manufacturing method of the same

Also Published As

Publication number Publication date
JP2020182035A (en) 2020-11-05
CN111835313A (en) 2020-10-27
KR20200124156A (en) 2020-11-02
US20200343878A1 (en) 2020-10-29
US11088674B2 (en) 2021-08-10
TW202040935A (en) 2020-11-01
DE102020205160A1 (en) 2020-10-29

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