SG10202001862UA - Formation of Bonding Wire Vertical Interconnects - Google Patents
Formation of Bonding Wire Vertical InterconnectsInfo
- Publication number
- SG10202001862UA SG10202001862UA SG10202001862UA SG10202001862UA SG10202001862UA SG 10202001862U A SG10202001862U A SG 10202001862UA SG 10202001862U A SG10202001862U A SG 10202001862UA SG 10202001862U A SG10202001862U A SG 10202001862UA SG 10202001862U A SG10202001862U A SG 10202001862UA
- Authority
- SG
- Singapore
- Prior art keywords
- formation
- bonding wire
- vertical interconnects
- wire vertical
- interconnects
- Prior art date
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/292,469 US11145620B2 (en) | 2019-03-05 | 2019-03-05 | Formation of bonding wire vertical interconnects |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202001862UA true SG10202001862UA (en) | 2020-10-29 |
Family
ID=72334744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202001862UA SG10202001862UA (en) | 2019-03-05 | 2020-03-02 | Formation of Bonding Wire Vertical Interconnects |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11145620B2 (en) |
| JP (1) | JP7012765B2 (en) |
| KR (1) | KR102423324B1 (en) |
| CN (1) | CN111668124A (en) |
| PH (1) | PH12020000069A1 (en) |
| SG (1) | SG10202001862UA (en) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3623649A (en) * | 1969-06-09 | 1971-11-30 | Gen Motors Corp | Wedge bonding tool for the attachment of semiconductor leads |
| US5195237A (en) * | 1987-05-21 | 1993-03-23 | Cray Computer Corporation | Flying leads for integrated circuits |
| US5176310A (en) * | 1988-11-28 | 1993-01-05 | Hitachi, Ltd. | Method and apparatus for wire bond |
| JPH0513493A (en) * | 1991-06-28 | 1993-01-22 | Nec Kansai Ltd | Wire bonder |
| US5559054A (en) * | 1994-12-23 | 1996-09-24 | Motorola, Inc. | Method for ball bumping a semiconductor device |
| JP3513444B2 (en) * | 1999-10-20 | 2004-03-31 | 株式会社新川 | Method for forming pin-shaped wires |
| US7229906B2 (en) * | 2002-09-19 | 2007-06-12 | Kulicke And Soffa Industries, Inc. | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine |
| JP3854232B2 (en) * | 2003-02-17 | 2006-12-06 | 株式会社新川 | Bump forming method and wire bonding method |
| JP4298665B2 (en) * | 2005-02-08 | 2009-07-22 | 株式会社新川 | Wire bonding method |
| JP4509043B2 (en) * | 2006-02-14 | 2010-07-21 | 株式会社新川 | Stud bump formation method |
| US8914249B2 (en) * | 2008-06-30 | 2014-12-16 | Hioki Denki Kabushiki Kaisha | Resistance measuring apparatus |
| JP4344002B1 (en) * | 2008-10-27 | 2009-10-14 | 株式会社新川 | Wire bonding method |
| KR101641102B1 (en) * | 2009-04-01 | 2016-07-20 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | Conductive bumps, wire loops, and methods of forming the same |
| SG189657A1 (en) * | 2011-10-25 | 2013-05-31 | Asm Tech Singapore Pte Ltd | Automatic wire tail adjustment system for wire bonders |
| CN104471693B (en) * | 2012-07-17 | 2018-05-08 | 库利克和索夫工业公司 | The method for forming wire interconnecting structure |
| US8540136B1 (en) * | 2012-09-06 | 2013-09-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for stud bump formation and apparatus for performing the same |
-
2019
- 2019-03-05 US US16/292,469 patent/US11145620B2/en active Active
-
2020
- 2020-02-28 CN CN202010127023.4A patent/CN111668124A/en active Pending
- 2020-02-28 PH PH12020000069A patent/PH12020000069A1/en unknown
- 2020-03-02 SG SG10202001862UA patent/SG10202001862UA/en unknown
- 2020-03-04 KR KR1020200027019A patent/KR102423324B1/en active IP Right Grant
- 2020-03-04 JP JP2020036965A patent/JP7012765B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020145429A (en) | 2020-09-10 |
| US11145620B2 (en) | 2021-10-12 |
| JP7012765B2 (en) | 2022-01-28 |
| PH12020000069A1 (en) | 2021-01-18 |
| US20200286855A1 (en) | 2020-09-10 |
| KR20200106847A (en) | 2020-09-15 |
| KR102423324B1 (en) | 2022-07-22 |
| CN111668124A (en) | 2020-09-15 |
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